IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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IEC 60749-17:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
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IEC 60749-8:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
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IEC 60749-21:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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IEC 60749-25:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
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IEC 60749-30:2005+AMD1:2011 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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IEC 60749-5:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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IEC 60749-4:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
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IEC 60749-31:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
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IEC 60749-1:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 1: General
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IEC 60749-29:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
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IEC 60749-11:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
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IEC 60749-36:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
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IEC 60749-18:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
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IEC 60749-27:2006+AMD1:2012 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
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IEC 60749-16:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
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IEC 60749-9:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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IEC 60749-33:2004
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Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
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IEC 60749-24:2004
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Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
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IEC 60721-2-1:2013
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Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity
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IEC 60747-14-1:2010
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Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
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IEC 60749-15:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
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IEC 60749-26:2013
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
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IEC 60721-3-0:1984+AMD1:1987 CSV
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Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction
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IEC 60749-35:2006
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Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
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IEC 60749-7:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
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IEC 60747-1:2006+AMD1:2010 CSV
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Semiconductor devices - Part 1: General
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IEC 60749-13:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
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IEC 60749-34:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
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IEC 60749-6:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
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IEC 60749-2:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
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ISO/IEC Guide 2:2004
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Standardization and related activities General vocabulary
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IEC 60749-3:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
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IEC 60068-2-1:2007
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Environmental testing - Part 2-1: Tests - Test A: Cold
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IEC 60749-10:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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IEC 60749-32:2002+AMD1:2010 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
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IEC 60749-14:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
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IEC 60749-19:2003+AMD1:2010 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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IEC 60749-22:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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IEC 60749-12:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
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IEC 60721-3-1:1997
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Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage
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IEC 60749-23:2004+AMD1:2011 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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