EN 61192-5 : 2007

FOREWORD
1 Scope
2 Normative references
3 Terminology
   3.1 Terms and definitions
   3.2 Abbreviations
4 Classification of rework activities
   4.1 Pre-soldering rework
   4.2 Post-soldering rework
   4.3 Essential prerequisites for successful and reliable
        rework
5 Pre-soldering rework
   5.1 General
   5.2 Reworking solder paste and non-conducting adhesive
        deposits
        5.2.1 General
        5.2.2 General misalignment or smudging of deposits
        5.2.3 Local misalignment or smudging of deposit
        5.2.4 General paste or adhesive quantity incorrect
        5.2.5 Local paste or adhesive quantity incorrect
   5.3 Reworking placed components
        5.3.1 General overall component misalignment
        5.3.2 Local component misalignment
   5.4 Realigning components after curing thermoplastic
        adhesive
   5.5 Realigning components after curing thermosetting
        adhesive
6 Factors affecting post-soldering rework
   6.1 Component marking and unmarked components
   6.2 Reuse of removed components
   6.3 Sensitive components
   6.4 Printed board layout design and space constraints
   6.5 Heat-sink effects
   6.6 Printed board material type
   6.7 Solder resist material and aperture size
   6.8 Reworking individual fine pitch device leads
   6.9 Reworking grid arrays
7 Preparation for post-soldering rework and repair
   7.1 Electrostatic precautions
   7.2 Avoiding exposure of components to contaminants
   7.3 Removal of conformal coating
   7.4 Unsuitable components
   7.5 Cleaning prior to rework
   7.6 Protecting adjacent sensitive components
   7.7 Baking of assemblies prior to component replacement
   7.8 Preheating large multilayer boards
   7.9 Preheating replacement sensitive components
8 Post-soldering rework
   8.1 General
   8.2 Component realignment (tweaking)
   8.3 Component removal
   8.4 Removal of adjacent components
   8.5 Reuse of components
   8.6 Addition of flux and solder
   8.7 Topping-up
   8.8 Removal of excess solder from joints
   8.9 Preparation of lands before component replacement
   8.10 Component replacement
   8.11 Cleaning (if required)
   8.12 Visual inspection and electrical testing
   8.13 Checking thermal integrity of solder joints
   8.14 Replacement of local conformal coating (if required)
9 Selection of rework equipment, tools and methods
   9.1 General
   9.2 Matching rework equipment to component and
        printed-board prerequisites
        9.2.1 General
        9.2.2 Selection based on component types on the
              printed board
        9.2.3 Selection based on printed-board laminate
              material type
        9.2.4 Selection based on assembly structure and
              soldering processes
10 Manual rework tools and methods
   10.1 General
   10.2 Miniature conventional (stored energy) soldering irons
   10.3 Directly heated soldering irons
   10.4 Hot air/gas pencils
   10.5 Heated tweezers
   10.6 Soldering irons with special tips
11 Mechanized and programmable rework machines
   11.1 General
   11.2 Hot air rework machines
   11.3 Focused infrared (IR) equipment
   11.4 Thermode (heated electrode) equipment
   11.5 Laser equipment for de-soldering
12 Ancillary tools and equipment
   12.1 Conventional soldering irons
   12.2 Hotplates
   12.3 Pneumatic dispensers
   12.4 De-soldering tools, as used for through-hole assemblies
   12.5 Tweezers and vacuum pencils
   12.6 Solder pots
   12.7 Copper braid
13 Rework recording procedures
   13.1 General
   13.2 Anomaly charts
   13.3 Travelling documents
   13.4 Rework status
14 Training of operators and inspectors
15 Field repair
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies.