I.S. EN 60115-1:2011
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
Available format(s)
Hardcopy , PDF
Superseded date
22-03-2023
Superseded by
Language(s)
English
Published date
01-01-2011
Publisher
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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1 General
2 Technical data
3 Quality assessment procedures
4 Test and measurement procedures
Annex B (normative) - Rules for the preparation of detail
specifications for resistors and capacitors for
electronic equipment for use within the IECQ
system
Annex C (informative) - Example of test equipment for the
periodic-pulse high-voltage overload test
Annex F (informative) - Letter symbols and abbreviations
Annex G (informative) - Index table for test and measurement
procedures
Annex Q (normative) - Quality assessment procedures
Annex ZA (informative) - Example of a certified test record
Annex ZR (normative) - Failure rate level evaluation,
determination and qualification
Annex ZX (informative) - Cross reference
Specifies standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
| DevelopmentNote |
Supersedes I.S. EN 140000. (02/2008) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
170
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| BS EN 60115-1 : 2011 | Identical |
| IEC 60115-1:2008 | Identical |
| SN EN 60115-1 : 2011 | Identical |
| NF EN 60115-1 : 2015 AMD 11 2015 | Identical |
| EN 60115-1:2011/A11:2015 | Identical |
| NBN EN 60115-1 : 2012 AMD 1 2015 | Identical |
| DIN EN 60115-1:2016-03 | Identical |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 60060-1:2010 | High-voltage test techniques - Part 1: General definitions and test requirements |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN 60027-1:2006/A2:2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 1: GENERAL |
| IECQ 001002-2:1998 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 2: DOCUMENTATION |
| EN 61249-2-35:2009 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| EN 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| EN 61193-2 : 2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| EN 60068-2-67:1996 | Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
| EN 61340-3-1:2007 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| EN 60062:2016/AC:2016-12 | MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016) |
| ISO 80000-1:2009 | Quantities and units — Part 1: General |
| IEC 61249-2-35:2008 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
| IEC 61340-3-1:2006 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| EN 60068-2-13:1999 | Environmental testing - Part 2: Tests - Test M: Low air pressure |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| IEC 60063:2015 | Preferred number series for resistors and capacitors |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 60068-2-11:1999 | Environmental testing - Part 2: Tests - Test Ka: Salt mist |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IECQ 210000:1995 | TECHNOLOGY APPROVAL SCHEDULES - REQUIREMENTS UNDER THE IECQ QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) |
| IEC 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 60060-1:2010 | High-voltage test techniques - Part 1: General definitions and test requirements |
| EN 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
| EN 60695-11-5:2017 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
| IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 60195:2016 | Method of measurement of current noise generated in fixed resistors |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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