IEC 61192-2:2003
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
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31-12-2021
English - French
14-03-2003
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Interpretation of requirements
4.4 Antistatic precautions
5 Component preparation processes
6 Solder paste deposition process qualification
6.1 Solder paste characteristics
6.2 Assessment of the process
6.3 Solder paste deposition - Screen and stencil printing
methods - Process control limits
7 Non-conductive adhesive deposition process
7.1 Pot life
7.2 Inter-stage storage and handling
7.3 Adhesive tackiness
7.4 Assessment of the adhesive attachment process
7.5 Adhesive deposition - Syringe dispensing method - Small
components - Process control limits
8 Temporary masking processes
9 Component placement processes
9.1 Assessment of the process
9.2 Discrete components with gull-wing leads
9.3 IC components with flat-ribbon, L- or gull-wing leads on
two sides
9.4 IC components with flat-ribbon, L- or gull-wing leads on
four sides, for example, quad flat packs
9.5 Components with round or flattened (coined) leads
9.6 IC component packages with J-leads on two and four sides,
for example, SOJ, PLCC
9.7 Leadless rectangular components with metallized
terminations
9.8 Components with cylindrical endcap terminations
9.9 Bottom-only terminations on leadless components
9.10 Leadless chip carriers with castellated terminations
9.11 Components with butt leads
9.12 Components with inward L-shaped ribbon leads
9.13 Flat-lug leads on power dissipating components
10 Post-placement rework
10.1 Rework of components placed on solder paste
10.2 Rework of components placed on non-conductive adhesive
11 Adhesive curing
12 Soldering processes
13 Cleaning processes
14 Hand placement and hand soldering, including hand
rework/repair
15 Electrical test
Annex A (normative)
A.1 Introduction
A.2 Example solder fillets and alignment: flat-ribbon, L- and
gull-wing leads
A.3 Example solder fillets and alignment: round or flattened
(coined) leads
A.4 Example solder fillets and alignment: J-leads
A.5 Example solder fillets and alignment: rectangular or
square end leadless components
A.6 Example solder fillets and alignment: cylindrical end cap
terminations, for example, MELFs
A.7 Example solder fillets and alignment: bottom-only
terminations on leadless components
A.8 Example solder fillets and alignment: leadless chip
carriers with castellated terminations
A.9 Example solder fillets and alignment: butt joints
A.10 Example solder fillets and alignment: inward L-shaped
flat ribbon leads
A.11 Example solder fillets and alignment: flat-lug leads on
power dissipating components
Figures
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
| DevelopmentNote |
To be used in conjunction with IEC 61192-1, IEC 61192-3 and IEC 61192-4. (03/2003) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
127
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| GOST R IEC 61192-2 : 2010 | Identical |
| NF EN 61192-2 : 2003 | Identical |
| NEN EN IEC 61192-2 : 2003 | Identical |
| I.S. EN 61192-2:2003 | Identical |
| PN EN 61192-2 : 2006 | Identical |
| BS EN 61192-2:2003 | Identical |
| CEI EN 61192-2 : 2004 | Identical |
| EN 61192-2:2003 | Identical |
| DIN EN 61192-2:2003-11 | Identical |
| UNE-EN 61192-2:2003 | Identical |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| BS EN 61188-5-1:2002 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements |
| I.S. EN 61193-1:2002 | QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| I.S. EN 61192-3:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| BS EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies Terminal assemblies |
| 97/206324 DC : DRAFT MAY 1997 | |
| UTEC 90 720-1 : 2000 | ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES |
| BS EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies |
| BS 6221-25:2000 | Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies |
| I.S. EN 61192-4:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
| I.S. EN 61188-5-1:2002 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| 97/230541 DC : DRAFT AUG 1997 | |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| BS EN 61193-1:2002 | Quality assessment systems Registration and analysis of defects on printed board assemblies |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 61193-1:2002 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| NF EN 61188-5-1 : 2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| ISO 9002:1994 | Quality systems — Model for quality assurance in production, installation and servicing |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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