IEC 62326-4-1:1996
Current
Current
The latest, up-to-date edition.
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French, Spanish, Castilian
Published date
19-12-1996
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
1. Scope
2. Normative references
3. Capability Qualifying Component (CQC)
4. Capability approval
5. Capability testing
6. Capability Test Board (CTB) descriptions
Figures
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
Relates to rigid multilayer printed boards with interlayerconnections. Specifies the capability qualifying component, thecharacteristics to be tested, the test methods and conditions to beapplied, and the requirements to be fulfilled for testingcapability for performance level A, B or C.
| DevelopmentNote |
Supersedes IEC 60326-6 (03/2001) Also numbered as BS EN 62326-4-1 and QC 230401. (09/2005) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
127
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 62326-4-1:1997-08 | Identical |
| I.S. EN 62326-4-1:1998 | Identical |
| PN EN 62326-4-1 : 2002 | Identical |
| EN 62326-4-1:1997 | Identical |
| NEN 12326-4-1 : 1997 | Identical |
| GOST IEC 62326-4-1 : 2013 ERRATA 2015 | Identical |
| SN EN 62326-4-1 : 1997 | Identical |
| NF EN 62326 4-1 : 1998 | Identical |
| UNE-EN 62326-4-1:1999 | Identical |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| BS EN 61241-18:2004 | Electrical apparatus for use in the presence of combustible dust Protection by encapsulation \'mD\' |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| BS EN 60079-18 : 2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| EN 62326-1:2002 | Printed boards - Part 1: Generic specification |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| BS EN 62326-4:1997 | Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification |
| NF EN 61249 8-8 : 1998 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
| I.S. EN 61193-3:2013 | QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| ISA 61241-18 : 2006 | ELECTRICAL APPARATUS FOR USE IN ZONE 20, ZONE 21 AND ZONE 22 HAZARDOUS (CLASSIFIED) LOCATIONS - PROTECTION BY ENCAPSULATION "MD" |
| BIS IS/IEC 60079-18 : 2009 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| BS EN 61193-3:2013 | Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| CEI EN 60079-18 : 2016 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| CEI EN 62326-1 : 2002 | PRINTED BOARDS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61189-3:2008 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| I.S. EN 61249-8-8:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
| IEC 60079-18:2014 RLV | Explosive atmospheres - Part 18: Equipment protection by encapsulation “m” |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| BS EN 61249-8-8:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
| CSA C22.2 No. 60079-18 : 2016 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| IEC 61241-18:2004 | Electrical apparatus for use in the presence of combustible dust - Part 18: Protection by encapsulation 'mD' |
| 13/30271432 DC : 0 | BS EN 60079-18 ED 4.0 - EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| EN 61241-18:2004 | Electrical apparatus for use in the presence of combustible dust - Part 18: Protection by encapsulation "mD" |
| EN 62326-4:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
| EN 60079-18:2015/A1:2017 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' (IEC 60079-18:2014/A1:2017) |
| I.S. EN 60079-18:2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| I.S. EN 62326-1:2002 | PRINTED BOARDS - GENERIC SPECIFICATION |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61249-8-8:1997 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
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