SEMI M31 : 2008
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
Superseded date
08-11-2018
Superseded by
Published date
12-01-2013
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Describes the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001) Also available in CD-ROM. (07/2006)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Superseded
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| SupersededBy |
| SEMI E146 : 2006 | TEST METHOD FOR THE DETERMINATION OF PARTICULATE CONTAMINATION FROM MINIENVIRONMENTS USED FOR STORAGE AND TRANSPORT OF SILICON WAFERS |
| SEMI M38 : 2012(R2018) | SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS |
| SEMI T3 : 2013 | SPECIFICATION FOR WAFER BOX LABELS |
| SEMI M45 : 2010(R2017) | SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM |
| SEMI E106 : 2004 | OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS |
| SEMI E119 : JUL 2006(R2012) | MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS |
| SEMI 3D16 : 2016 | SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING |
| SEMI 3D3:2013 | GUIDE FOR MULTIWAFER TRANSPORT AND STORAGE CONTAINERS FOR 300 MM, THIN SILICON WAFERS ON TAPE FRAMES |
| SEMI E62 : NOV 2006(R2012) | SPECIFICATION FOR 300 MM FRONT-OPENING INTERFACE MECHANICAL STANDARD (FIMS) |
| SEMI M49 : 2016 | GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS |
| SEMI M52 : 2014 | GUIDE FOR SPECIFYING SCANNING SURFACE INSPECTION SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 11 NM TECHNOLOGY GENERATIONS |
| SEMI 3D2 : 2016 | SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS |
| SEMI M26 : 2004(R2010) | GUIDE FOR THE RE-USE OF 100, 125, 150, AND 200 MM WAFER SHIPPING BOXES USED TO TRANSPORT WAFERS |
| SEMI E1-9 : NOV 2006E | MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 MM WAFERS |
| SEMI E119 : JUL 2006(R2012) | MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 MM WAFERS |
| SEMI M45 : 2010(R2017) | SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM |
| SEMI E62 : NOV 2006(R2012) | SPECIFICATION FOR 300 MM FRONT-OPENING INTERFACE MECHANICAL STANDARD (FIMS) |
| SEMI E15-1 : 2005(R2010) | SPECIFICATION FOR 300 MM TOOL LOAD PORT |
| SEMI E57 : 2000E2(R2010) | SPECIFICATION FOR KINEMATIC COUPLINGS USED TO ALIGN AND SUPPORT 300 MM WAFER CARRIERS |
| SEMI E15 : 1998E2(R2016) | SPECIFICATION FOR TOOL LOAD PORT |
| SEMI E47.1 : NOV 2006 | MECHANICAL SPECIFICATION FOR FOUPS USED TO TRANSPORT AND STORE 300 MM WAFERS |
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