IEC 60191-3:1999
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
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English - French, Spanish, Castilian
29-10-1999
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Foreword
1 General
2 Terminology and definitions
3 Cross-referencing of packages
4 Terminal identification - Numbering of terminals
5 Dimensions and reference letter symbols
6 Drawing layout
7 Dimensioning and tolerances
8 Inter-conversion of inch and millimetre dimensions,
and rules for rounding-off
9 Definition of families
10 Examples of drawings
11 Design procedure for dimensions of integrated circuit
packages
12 Rules for mounting integrated circuit packages into
carriers
13 Bending of terminals of QUIL packages
14 Pin grid arrays
15 Rule for orientation of integrated circuit packages in
handling and shipping carriers such as stick magazines
and rails
Annex A (normative) Limits applicable for the dimensions of
integrated circuit package outlines
Annex B (informative) Example drawings showing cross-
referencing of packages, utilization
of reference letter symbols, terminal
identification and index area
Annex C (normative) Terminal identification and numbering of
terminals of devices with terminals
disposed in three or more rows in each
orthogonal direction
Annex D (normative) Recommended dimensions of integrated
circuit packages of Form G family
Annex E (normative) General rules for the preparation of
outline drawings of packages of Form G
intended for automated handling
Annex F (normative) General rules for the preparation of
outline drawings of pin grid arrays
Annex G (normative) Rule for orientation of integrated
circuit packages in handling and shipping
carriers such as stick magazines and rails
Annex G (normative) Rule for orientation of integrated circuit
packages in handling and shipping carriers
such as stick magazines and rails
Annex H (normative) Bottom view method for Terminal No 1
recognition
Annex K (normative) Gate burrs, mold flash and protrusions
Gives guidance on the preparation of drawings of integrated circuits outlines.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Also numbered as BS EN 60191-3. (09/2005) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
113
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60191-3 : 2000 | Identical |
| UNE-EN 60191-3:2001 | Identical |
| NEN 10191-3 : 91 AMD 2 97 | Identical |
| NEN EN IEC 60191-3 : 2000 | Identical |
| I.S. EN 60191-3:2000 | Identical |
| PN EN 60191-3 : 2002 | Identical |
| SN EN 60191-3 : 1999 | Identical |
| AS 3708.3-1989 | Identical |
| CEI 47-7 : 1ED 1981 | Identical |
| EN 60191-3:1999 | Identical |
| BS IEC 62679-1-1:2014 | Electronic paper displays Terminology |
| BS EN 61666:2010 | Industrial systems, installations and equipment and industrial products. Identification of terminals within a system |
| I.S. EN 60191-6:2009 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
| EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| BS CECC 90000:1985 | Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits |
| I.S. EN 61666:2010 | INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM |
| BS EN 60191-6:2009 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS IEC 61747-1 : 1998 AMD 10788 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION |
| 08/30179080 DC : DRAFT OCT 2008 | BS EN 61666 - INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM |
| CEI EN 61747-1 : 2004 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| BS CECC 63000:1990 | Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits |
| BS CECC 64000:1990 | Harmonized system of quality assessment for electronic components: generic specification: film resistor networks |
| BS EN 60191-6-2:2002 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| 05/30132036 DC : DRAFT APR 2005 | IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA |
| IEC 62679-1-1:2014 | Electronic paper displays - Part 1-1: Terminology |
| I.S. EN 60191-6-16:2007 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
| IEC 60191-6-16:2007 | Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| CEI EN 61666 : 2011 | INDUSTRIELLE SYSTEME, ANLAGEN UND AUSRUESTUNGEN UND INDUSTRIEPRODUKTE - IDENTIFIKATION VON ANSCHLUESSEN IN SYSTEMEN |
| 12/30244653 DC : 0 | BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION |
| 05/30132033 DC : DRAFT APR 2005 | IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA) |
| BS EN 60191-6-16:2007 | Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| DEFSTAN 59-62(PT5)/1(1983) : 1983 | MICROCIRCUITS ELECTRONIC (INTEGRATED CIRCUITS) - PART 5: ANALOGUE SWITCH/MULTIPLEXERS |
| BS EN 61747-1:2000 | Liquid crystal and solid-state display devices Generic specification |
| BS EN 60286-4:2013 | Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms |
| CEI EN 60286-4 : 2014 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS |
| I.S. EN 60286-4:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV)) |
| CEI EN 60191-6 : 2011 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 61666:2010 | Industrial systems, installations and equipment and industrial products - Identification of terminals within a system |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
| 13/30284029 DC : 0 | BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| CEI EN 60191-6-16 : 2008 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| BS 3934-6:1992 | Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages |
| 07/30167960 DC : 0 | BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
| EN 61666:2010 | Industrial systems, installations and equipment and industrial products - Identification of terminals within a system |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| EN 60191-6-16:2007 | Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| EN 61747-1:1999/A1:2003 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| ISO 2692:2014 | Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
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