IPC D 949 : 1987
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
31-12-1991
12-01-2013
Covers the requirements and considerations for the design of rigid multilayer printed boards based on industry manufacturing capabilities. Purpose is to establish rules, principles, and other considerations for mechanical, electrical, and producibility properties which the designer can use to select design features, and properties that will result in a multilayer board that will meet performance and cost requirements.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC D 354 : 0 | LIBRARY FORMAT DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM |
| IPC D 351 : 0 | PRINTED BOARD DRAWINGS IN DIGITAL FORM |
| IPC D 330 : 1992 | DESIGN GUIDE MANUAL |
| IPC D 352 : 0 | ELECTRONIC DESIGN DATA DESCRIPTION FOR PRINTED BOARDS IN DIGITAL FORM |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC D 300 : G1984 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC D 422 : 0 | DESIGN GUIDE FOR PRESS FIT RIGID PRINTED BOARD BACK PLANES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC D 322 : 0 | GUIDELINES FOR SELECTING PRINTED WIRING BOARD SIZES USING STANDARD PANEL SIZES |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEGREES C) |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| MIL-C-14550 Revision B:1983 | COPPER PLATING (ELECTRODEPOSITED) |
| MIL-P-81728 Revision A:1973 | PLATING, TIN LEAD, (ELECTRODEPOSITED) |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
| IPC CF 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
| IPC D 350 : 0 | PRINTED BOARD DESCRIPTION IN DIGITAL FORM |
| IPC AM 361 : 1982 | PRINTED BOARDS, SPECIFICATION FOR RIGID SUBSTRATES FOR ADDITIVE PROCESS, |
| IPC AM 372 : 1978 | ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) |
| IPC ML 950 : C1980 | RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC R 700 : C1988 | SUGGESTED GUIDELINES FOR MODIFICATION, REWORK AND REPAIR OF PRINTED BOARDS AND ASSEMBLIES |
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