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SEMI M20 : 2015

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM

Superseded date

07-06-2021

Superseded by

SEMI M20:2015 (R2021)

Published date

12-01-2013

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Specifies a method for referencing any other coordinate system, such as a site, pattern, or mapping array, to the physical geometry of the wafer surface.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI HB7 : 2015 TEST METHOD FOR MEASUREMENT OF WAVINESS OF CRYSTALLINE SAPPHIRE WAFERS BY USING OPTICAL PROBES
SEMI 3D17 : 2017 SPECIFICATION FOR REFERENCE MATERIAL FOR BONDED WAFER STACK VOID METROLOGY
SEMI E91 : 2017 SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL (PSEM)
SEMI M21 : 2018 GUIDE FOR ASSIGNING ADDRESSES TO RECTANGULAR ELEMENTS IN A CARTESIAN ARRAY
SEMI M53 : 2018 PRACTICE FOR CALIBRATING SCANNING SURFACE INSPECTION SYSTEMS USING CERTIFIED DEPOSITIONS OF MONODISPERE REFERENCE SPHERES ON UNPATTERNED SEMICONDUCTOR WAFER SURFACES
SEMI M77 : 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY USING ROLL-OFF AMOUNT, ROA
SEMI M68 : MAR 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDD
SEMI M70 : 2015 TEST METHOD FOR DETERMINING WAFER-NEAR-EDGE GEOMETRY USING PARTIAL WAFER SITE FLATNESS
SEMI M67 : 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD, AND ESBIR METRICS
SEMI M33 : 1998 TEST METHOD FOR THE DETERMINATION OF RESIDUAL SURFACE CONTAMINATION ON SILICON WAFERS BY MEANS OF TOTAL REFLECTION X-RAY FLUORESCENCE SPECTROSCOPY (TXRF)
SEMI ME1392 : 2016 GUIDE FOR ANGLE RESOLVED OPTICAL SCATTER MEASUREMENTS ON SPECULAR OR DIFFUSE SURFACES
ASTM F 2166 : 2002 Standard Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers (Withdrawn 2003)
SEMI M1 : 2017 SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI M72 : 2008 TEST METHOD FOR DETERMINING WAFER FLATNESS USING THE MOVING AVERAGE QUALIFICATION METRIC BASED ON SCANNING LITHOGRAPHY
SEMI M76 : 2010 SPECIFICATION FOR DEVELOPMENTAL 450 MM DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI MF2074 : 2012 (R2018) GUIDE FOR MEASURING DIAMETER OF SILICON AND OTHER SEMICONDUCTOR WAFERS
SEMI HB6 : 2016 TEST METHOD FOR MEASUREMENT OF THICKNESS AND SHAPE OF CRYSTALLINE SAPPHIRE WAFERS BY USING OPTICAL PROBES
SEMI M59 : 2014 TERMINOLOGY FOR SILICON TECHNOLOGY
SEMI E130 : 2017 SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL FOR 300 MM ENVIRONMENT (PSEM300)
ASTM F 2074 : 2000 Standard Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers (Withdrawn 2003)
SEMI M48 : 2001 GUIDE FOR EVALUATING CHEMICAL-MECHANICAL POLISHING PROCESSES OF FILMS ON UNPATTERNED SILICON SUBSTRATES
SEMI M71 : 2012 SPECIFICATION FOR SILICON-ON-INSULATOR (SOI) WAFERS FOR CMOS LSI
SEMI MF1530 : 2007(R2018) TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI M69 : 2007 PRACTICE FOR DETERMINING WAFER NEAR-EDGE GEOMETRY USING ROLL-OFF AMOUNT, ROA
SEMI M61 : 2007(R 2019) SPECIFICATION FOR SILICON EPITAXIAL WAFERS WITH BURIED LAYERS
SEMI E30.1 : 2017 SPECIFICATION FOR INSPECTION AND REVIEW SPECIFIC EQUIPMENT MODEL (ISEM)
SEMI M40 : 2014 GUIDE FOR MEASUREMENT OF ROUGHNESS OF PLANAR SURFACES ON POLISHED WAFERS
SEMI M74 : 2008(R2018) SPECIFICATION FOR 450 MM DIAMETER MECHANICAL HANDLING POLISHED WAFERS
SEMI M73 : 2013 TEST METHODS FOR EXTRACTING RELEVANT CHARACTERISTICS FROM MEASURED WAFER EDGE PROFILES
SEMI MS1 : 2007(R2018) GUIDE TO SPECIFYING WAFER-WAFER BONDING ALIGNMENT TARGETS
SEMI E30.5 : 2002(R2017) SPECIFICATION FOR METROLOGY SPECIFIC EQUIPMENT MODEL (MSEM)
SEMI MF1390 : 2018 TEST METHOD FOR MEASURING BOW AND WARP ON SILICON WAFERS BY AUTOMATED NONCONTACT SCANNING
SEMI MF1618 : 2010(R2015) PRACTICE FOR DETERMINATION OF UNIFORMITY OF THIN FILMS ON SILICON WAFERS
SEMI HB5 : 2015 TEST METHOD FOR MEASUREMENT OF SAW MARKS ON CRYSTALLINE SAPPHIRE WAFERS BY USING OPTICAL PROBES
SEMI E141 : 2005 GUIDE FOR SPECIFICATION OF ELLIPSOMETER EQUIPMENT FOR USE IN INTEGRATED METROLOGY
SEMI HB1 : 2016 SPECIFICATION FOR SAPPHIRE WAFERS INTENDED FOR USE FOR MANUFACTURING HIGH BRIGHTNESS-LIGHT EMITTING DIODE DEVICES
SEMI M78 : 2010 GUIDE FOR DETERMINING NANOTOPOGRAPHY OF UNPATTERNED SILICON WAFERS FOR THE 130 NM TO 22 NM GENERATIONS IN HIGH VOLUME MANUFACTURING
SEMI T13 : 2004(R2010) SPECIFICATION FOR DEVICE TRACKING: CONCEPTS, BEHAVIOR AND SERVICES
SEMI E127 : 2008 SPECIFICATION FOR INTEGRATED MEASUREMENT MODULE COMMUNICATIONS: CONCEPTS, BEHAVIOR, AND SERVICES (IMMC)
SEMI 3D7 : 2013(R2019) GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS
SEMI MF2166 : 2010 PRACTICES FOR MONITORING NON-CONTACT DIELECTRIC CHARACTERIZATION SYSTEMS THROUGH USE OF SPECIAL REFERENCE WAFERS

SEMI M59 : 2014 TERMINOLOGY FOR SILICON TECHNOLOGY
SEMI M17 : 2010(R2015) GUIDE FOR A UNIVERSAL WAFER GRID

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