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IEC 60749-25:2003

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

11-07-2003

€83.17
Excluding VAT

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
  5.1 Initial measurements
  5.2 Conditioning
  5.3 Cycle rates
  5.4 Upper and lower soak times
  5.5 Upper and lower soak temperatures
  5.6 Soak modes
  5.7 Cycle time
  5.8 Ramp rate
  5.9 Load transfer time
  5.10 Recovery
  5.11 Final measurements
  5.12 Failure criteria
6 Summary

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

DevelopmentNote
Supersedes IEC PAS 62178. (07/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2020. (11/2017)
DocumentType
Standard
Pages
25
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

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IEC 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
IEC 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers
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I.S. EN 62149-9:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS
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IEC 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
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EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
EN 62149-4:2010 Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application
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IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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