EN 61192-3:2003
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
01-02-2006
20-02-2003
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection techniques
4.4 Interpretation of requirements
5 Component preparation processes
5.1 Lead forming
5.2 Lead protrusion and clinching
5.3 Lead cutting/cropping
5.4 Pre-tinning
6 Masking attributes
6.1 Misalignment
6.2 Improper adhesion
6.3 Thermal capability
7 Insertion of through-hole components
7.1 General requirements
7.2 Orientation and mounting criteria
7.3 Missing components
7.4 Wrong components
7.5 Damaged components
8 Soldering process attributes
8.1 General requirements
8.2 Misalignment
8.3 Damaged components
8.4 Solder joint characteristics
9 Cleaning attributes
9.1 Flux residues
9.2 Other residues
10 Rework/replacement attributes
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
| Committee |
CLC/SR 91
|
| DevelopmentNote |
To be used in conjunction with EN 61192-1, EN 61192-2 & EN 61192-4 (04/2003)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 61192-3:2002 | Identical |
| NBN EN 61192-3 : 2004 | Identical |
| NF EN 61192-3 : 2003 | Identical |
| NEN EN IEC 61192-3 : 2003 | Identical |
| I.S. EN 61192-3:2003 | Identical |
| PN EN 61192-3 : 2007 | Identical |
| SN EN 61192-3 : 2003 | Identical |
| UNE-EN 61192-3:2003 | Identical |
| BS EN 61192-3:2003 | Identical |
| CEI EN 61192-3 : 2003 | Identical |
| DIN EN 61192-3:2003-10 | Identical |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| EN 60115-2:2015 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| I.S. EN 60068-2-82:2007 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| I.S. EN 61192-2:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| BS EN 60115-2:2015 | Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
| BS EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies Terminal assemblies |
| I.S. EN 60115-2:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| 14/30311384 DC : 0 | BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| BS EN 60068-2-82:2007 | Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components |
| I.S. EN 61192-4:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
| CEI EN 60068-2-82 : 2008 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| CEI EN 60115-2 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| BS EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies Surface-mount assemblies |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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