IPC A 600 : H
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
ACCEPTABILITY OF PRINTED BOARDS
Available format(s)
Hardcopy
Superseded date
13-04-2010
Superseded by
Language(s)
English
Published date
13-04-2010
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Acknowledgment
1 Introduction
2 Externally Observable Characteristics
3 Internally Observable Characteristics
4 Miscellaneous
5 Cleanliness Testing
Specifies the target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards.
| DevelopmentNote |
Included in IPC C 102, IPC C 105 & IPC C 1000. H2010 Edition is still available in Swedish, Polish, Russian languages, See separate records. G2004 Edition is still available in ITALIAN language, See separate record. Also available in French, Chinese, German & Spanish languages, See separate records. (02/2017) Also available in Japanese language, See IPC A 600 JAPANESE. (08/2017) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
|
| Pages |
168
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| BS EN 50155:2017 | Railway applications. Rolling stock. Electronic equipment |
| BS EN 60079-18 : 2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| 16/30282633 DC : 0 | BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| IPC FC 250 : A1986 | SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
| IPC P-MICRO : 2010 | PCB MULTI-ISSUE MICROSECTION WALL POSTER |
| IPC 2224 : 0 | SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 2225 : 0 | SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| MIL-PRF-31032-2 Revision C:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
| IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC TR 549 : 1973 | MEASLES IN PRINTED WIRING BOARDS |
| MIL-PRF-31032-1 Revision D:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
| IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6202 : 0 | IPC/JPCA PERFORMANCE GUIDE MANUAL FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS |
| IPC TR 486 : 0 | ROUND ROBIN STUDY TO CORRELATE IST AND MICROSECTIONING EVALUATIONS FOR INNER-LAYER SEPARATION |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| MIL-P-46843 Revision C:1989 | PRINTED WIRING ASSEMBLIES PRODUCTION OF |
| IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL-PRF-31032-4 Revision C:2017 | PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
| MIL-PRF-31032-6 Revision B:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| MIL-PRF-31032-3 Revision C:2017 | PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC TA 724 : 1998 | TECHNOLOGY ASSESSMENT ON CLEANROOMS |
| MIL-PRF-31032-5 Revision B:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC QE 605 : A | PRINTED BOARD QUALITY EVALUATION HANDBOOK |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| SAE AS 7119 : 2015 | NADCAP AEROSPACE STANDARD FOR ELECTRONICS PRINTED CIRCUIT BOARDS |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| DD IEC PAS 62050 : DRAFT 2004 | BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
| I.S. EN 50155:2017-11 | RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IEC 60079-18:2014 RLV | Explosive atmospheres - Part 18: Equipment protection by encapsulation “m” |
| EN 50155:2017 | Railway applications - Rolling stock - Electronic equipment |
| CSA N290.14 : 2015 | QUALIFICATION OF DIGITAL HARDWARE AND SOFTWARE FOR USE IN INSTRUMENTATION AND CONTROL APPLICATIONS FOR NUCLEAR POWER PLANTS |
| IEC PAS 62050:2004 | Board level drop test method of components for handheld electronic products |
| CSA C22.2 No. 60079-18 : 2016 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
| BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| 13/30271432 DC : 0 | BS EN 60079-18 ED 4.0 - EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| IPC 2524 : 0 | PWB FABRICATION DATA QUALITY RATING SYSTEM |
| EN 60079-18:2015/A1:2017 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' (IEC 60079-18:2014/A1:2017) |
| I.S. EN 60079-18:2015 | EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
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