IPC CH 65 : B

Current

Current The latest, up-to-date edition.

GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES

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Published date: 27-07-2011

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 OVERVIEW
2 APPLICABLE DOCUMENTS
3 ASSEMBLY CLEANING VALUE AND APPLICABILITY
4 DESIGNING ASSEMBLIES FOR CLEANING
5 MATERIALS COMPATIBILITY
6 PROCESS DEVELOPMENT AND VERIFICATION
7 CONTAMINATION AND ITS EFFECTS ON PWBS
8 ASSEMBLY RESIDUES/CLEANING CONSIDERATIONS
9 ENVIRONMENTAL CONSIDERATIONS
10 SOLVENT CLEANING AGENTS
11 SEMI-AQUEOUS CLEANING AGENTS, EQUIPMENT, AND PROCESS
OPTIMIZATION
12 AQUEOUS CLEANING AGENTS, EQUIPMENT, AND PROCESS INTEGRATION
13 CLEANING FOR REWORK, REPAIR, AND RESTORATION OPERATIONS

Abstract - (Show below) - (Hide below)

Discusses the relationship between materials, processes, and contaminants in fabrication and assembly operations. Also addresses cleanliness assessment and process control in relation to cleanliness.

General Product Information - (Show below) - (Hide below)

Development Note	Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008) Supersedes IPC SC 60, IPC SA 61, IPC AC 62 & IPC SM 839. (07/2011) Also available in Chinese language, See IPC CH 65 CHINESE. (01/2014)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Current
Supersedes	IPC SA 61 : A IPC CH 65 : A IPC SC 60 : A IPC SM 839 : 0 IPC AC 62 : A

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 HUNGARIAN : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 HEBREW : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7093 CHINESE : -	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7526 : 2007	STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 SPANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 CHINESE : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 VIETNAMESE : B2012	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 5701 : 0	USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS
IPC A 610 KOREAN : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC HDBK 850 : 0	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
IPC HDBK 830 : A	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 075 GERMAN : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC WHMA A 620 POLISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC HDBK 840 : 0	SOLDER MASK HANDBOOK
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 075 CHINESE : -	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC HDBK 4691 : 2015	HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS
IPC SA 61 : A	POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
IPC WHMA A 620 DANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC TR 582 : 0	CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
IPC J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC M 108 : LATEST	CLEANING GUIDES AND HANDBOOKS MANUAL
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC TR 580 : 1989	CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS
IPC TR 581 : 1994	IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY

Standards Referencing This Book - (Show below) - (Hide below)

TT-N-95 Revision B:1967
ASTM D 1153 : 2012 : REDLINE	Standard Specification for Methyl Isobutyl Ketone
IPC A 600 : H	ACCEPTABILITY OF PRINTED BOARDS
CFR 33(PTS125-199) : JUL 2017	NAVIGATION AND NAVIGABLE WATERS
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
ASQ Z1.15:1979	Generic Guidelines For Quality Systems,
O-T-236 Revision C:1979	TETRACHLOROETHYLENE (PERCHLOROETHYLENE), TECHNICAL GRADE
CFR 40(PTS81-85) : JUL 2012	PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
IPC 4202 : A	FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
CFR 40(PTS300-399) : JUL 2017	PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
ASTM D 1320 : 73(1983)	TEST METHOD FOR TENSILE STRENGTH OF PARAFFIN WAX
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
CFR 40(PT63) : JUL 98	NATIONAL EMISSION STANDARDS FOR HAZARDOUS AIR POLLUTANTS FOR SOURCE CATEGORIES
MIL-C-81302 Revision D:1985	CLEANING COMPOUND, SOLVENT, TRICHLOROTRIFLUOROETHANE
CFR 40(PTS400-424) : JUL 2017	PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
IPC 4203 : A	COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
CFR 40(PTS260-265) : JUL 2017	PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
O-T-634 Revision C:1984	TRICHLOROETHYLENE, TECHNICAL
CFR 40(PTS100-135) : JUL 2017	PROTECTION OF ENVIRONMENT
O-T-620 Revision C:1967	TRICHLOROETHANE-1,1,1, TECHNICAL, INHIBITED (METHYL CHLOROFORM)
TT-M-261 Revision D:1970	METHYL ETHYL KETONE, TECHNICAL
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0	TEST METHODS MANUAL
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
ASTM D 4080 : 2015 : REDLINE	Standard Specification for Trichloroethylene, Technical and Vapor-Degreasing Grade
TT-N-97 Revision D:2007	Naphtha; Aromatic
TT-T-548 Revision F:1991	TOLUENE, TECHNICAL
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
NFPA 35 : 2016	MANUFACTURE OF ORGANIC COATINGS
IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC TR 580 : 1989	CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS
ASTM D 4081 : 2016 : REDLINE	Standard Specification for Drycleaning-Grade Perchloroethylene
GR 78 CORE : ISSUE 2	GENERIC REQUIREMENTS FOR THE PHYSICAL DESIGN AND MANUFACTURE OF TELECOMMUNICATIONS PRODUCTS AND EQUIPMENT
ASTM D 4376 : 2015 : REDLINE	Standard Specification for Vapor-Degreasing Grade Perchloroethylene
CFR 29(PT1910.1000 TO END) : 0	LABOR - OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR
ASTM D 93 : 2016-07	TEST METHODS FOR FLASH POINT BY PENSKY-MARTENS CLOSED CUP TESTER
ASTM D 5309 : 2017 : REDLINE	Standard Specification for Cyclohexane 999
TT B 848 : B	BUTYL ALCOHOL, SECONDARY (FOR USE IN ORGANIC COATINGS)
CFR 40(PTS425-699) : JUL 2017	PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
NFPA 30 : 2018	FLAMMABLE AND COMBUSTIBLE LIQUIDS CODE
IPC PE 740 : 0	TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY
TT-I-735 Revision A:1963	ISOPROPYL ALCOHOL
IPC 4204 : A	FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC 2223 : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
O-A-51 Revision H:1992	ACETONE, TECHNICAL
ASTM D 362 : 1984	Specification for Industrial Grade Toluene (Withdrawn 1989)
ASTM D 1133 : 2013 : REDLINE	Standard Test Method for Kauri-Butanol Value of Hydrocarbon Solvents
ASTM D 329 : 2007	Standard Specification for Acetone
IPC 9191 : 0	GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
O-E-760 Revision D:1987	ETHYL ALCOHOL (ETHANOL), DENATURED ALCOHOL, PROPRIETARY SOLVENTS & SPECIAL INDUSTRIAL SOLVENTS
O-M-232 Revision M:2016	METHANOL (METHYL ALCOHOL)
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
MIL-T-81533 Revision A:1967	TRICHLOROETHANE, 1, 1, 1, (METHYL CHLOROFORM) INHIBITED, VAPOR DEGREASING

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