IEC 61192-1:2003

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Order of precedence
   4.2 Process control
   4.3 Facilities
   4.4 Process identification
5 Pre-process activities
   5.1 Design checks
   5.2 Specification and procurement of components
   5.3 Specification and procurement of printed boards
   5.4 Specification and procurement of process materials
   5.5 Inspection plan, inspection facilities and handling
   5.6 Storage and kitting of components, boards and materials
   5.7 Handling during assembly, packaging and shipping
   5.8 Electrical testing
6 Component preparation
   6.1 Lead and termination solderability
   6.2 Lead forming
   6.3 Lead flattening
   6.4 Lead cropping
   6.5 Lead coplanarity
   6.6 Thermal shock during re-tinning
   6.7 Moisture and gas traps
7 Mounting structure and printed board preparation
   7.1 Surface preparation
   7.2 Temporary masking requirements
   7.3 Gold on printed board surface-mount lands
   7.4 Printed board condition
8 Surface-mount solder paste deposition
   8.1 Description of process
   8.2 Storage and handling of solder paste
   8.3 Screen (off-contact) printing
   8.4 Stencil (in-contact) printing
   8.5 Syringe dispensing
   8.6 Transfer deposition of solder preforms
9 Non-conductive adhesive deposition and curing
   9.1 Stencil printing
   9.2 Syringe dispensing
   9.3 Pin transfer printing
   9.4 Adhesive curing
10 Surface-mounted component placement
   10.1 Leadless discrete components with metallized terminations
   10.2 Leadless circular cylinder components, for example, metal
         electrode leadless faces (MELFs)
   10.3 Leaded discrete small component packages
   10.4 Leaded integrated circuit packages
   10.5 Leaded 'fine-pitch' integrated circuit packages
   10.6 Modified leaded through-hole packages
   10.7 Leadless chip carrier packages
   10.8 Placement equipment
11 Through-hole component insertion
   11.1 General
   11.2 Axial lead components (two leads)
   11.3 Radial lead components (two leads)
   11.4 Radial lead components (three or more leads)
   11.5 Multilead integrated circuit packages
   11.6 Pin grid array (PGA) components
   11.7 Surface-mount packages modified for insertion
   11.8 Large components
   11.9 Insertion methods and equipment
   11.10 Cutting and clinching leads
12 Placement of terminals and press-fit pins
   12.1 Attachment of terminals to printed boards
   12.2 Soldering wires and component leads to terminals
13 Reflow soldering
   13.1 Infrared reflow soldering in pass-through equipment
   13.2 Convection reflow soldering in pass-through equipment
   13.3 Mixed infrared and convection reflow soldering in
         pass-through equipment
   13.4 Vapour phase reflow soldering
   13.5 Laser scan reflow soldering
   13.6 Thermode (hot bar) reflow soldering
   13.7 Hot gas multijet reflow soldering
   13.8 Focused infrared multi-point reflow soldering
14 Immersion soldering
   14.1 General requirements
   14.2 Wave soldering
   14.3 Drag soldering
   14.4 Hot dip soldering
15 Individual point soldering
   15.1 Manual soldering with an iron
   15.2 Hot gas pencil reflow soldering
16 Cleanliness/cleaning
   16.1 Use of 'no clean' fluxes
   16.2 Cleaning materials
   16.3 Cleaning processes
   16.4 Cleanliness assessment
17 Electrical test
   17.1 In-circuit test
   17.2 Functional test
   17.3 Test probes and probe lands
18 Rework and repair
   18.1 General
   18.2 Unmarked components
   18.3 Pre-heating printed boards and sensitive components
   18.4 Re-use of removed components
   18.5 Selection of rework tools and equipment
   18.6 Surface-mounted component realignment
   18.7 Adding solder to existing joints
   18.8 Removing excess solder
   18.9 Component removal
   18.10 Component replacement
   18.11 Repair of assemblies returned from the field
19 Conformal coatings, including solder resist
   19.1 General
   19.2 Conformal protective coating
   19.3 Solder mask coating
20 Packaging and shipping
   20.1 Materials
   20.2 Mechanical protection
   20.3 Marking/labelling
   20.4 Handling
21 Training
   21.1 Training of designers, engineers and senior line management
   21.2 Training production line personnel
Figures
Tables

Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.