IPC HDBK 830 : A
Current
The latest, up-to-date edition.
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
Hardcopy
English
07-10-2013
1 PREFACE
2 APPLICABLE DOCUMENTS
3 ENVIRONMENTAL, HEALTH AND SAFETY
(EHS) REQUIREMENTS
4 CONFORMAL COATING MATERIALS
5 DESIGN FOR COATING APPLICATION
6 RAW MATERIALS CHARACTERISTICS
7 COMPATIBILITY
8 PROCESSING
9 FILM PROPERTIES
10 REWORK, REPAIR AND RESTORATION
11 END USE ENVIRONMENT
12 LONG TERM RELIABILITY AND TESTING
13 BIBLIOGRAPHY
APPENDIX A - Conformal Coating Comparison
Guide
APPENDIX B - Flow Cup Viscosity
Measurement
APPENDIX C - Troubleshooting GuidE
APPENDIX D - Thermal Analysis
APPENDIX E - Relative Humidity
APPENDIX F - Time of Wetness
APPENDIX G - Atmospheric Particulates
APPENDIX H - Airborne ContaminantS
APPENDIX I - Simulated Acid Rain Test
APPENDIX J - Coating for Medical Applications
APPENDIX K - Example of Stringent Test for Any
Breach in A Conformal Coating
APPENDIX L - TIN WHISKERS
APPENDIX M - FUNGUS TEST METHOD
APPENDIX N - HMIS CONTAINER LABELING
SYSTEM
APPENDIX O - GHS HAZARD SYMBOLS AND
CLASSES
APPENDIX P - GHS SAFETY DATA SHEETS
(SDSS) CONTENTS
APPENDIX Q - NPL REPORT
APPENDIX 1 - GC-MS Flux Analysis
Describes as a thin, transparent, polymeric coating that is applied to the surfaces of PCAs to provide protection from the end-use environment.
Committee |
5-30
|
DevelopmentNote |
Included in IPC C 1000. (07/2008) Also available in Hardcopy format. (01/2018)
|
DocumentType |
Standard
|
ISBN |
978-1-61183-109-9
|
Pages |
183
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
Supersedes |
EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
IPC CC0201-CD : 2010 | CONFORMAL COATING APPLICATIONS, INSPECTION, REWORK & QUALITY CONTROL INTERACTIVE CD-ROM |
IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC CC0509 : 2009 | CONFORMAL COATING PHOTO GUIDE ON CD |
IPC 5702 : 0 | GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC P-CC0509 : 2009 | CONFORMAL COATING PHOTOGRAPHIC POSTER GUIDE |
IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IPC WP 009 : 0 | A SUMMARY OF TIN WHISKER RESEARCH REFERENCES |
IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
SEMI S2 : 2016B | ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT |
ASTM G 21 : 2015 : REDLINE | Standard Practice for Determining Resistance of Synthetic Polymeric Materials to Fungi |
IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
EN ISO 2360:2017 | Non-conductive coatings on non-magnetic electrically conductive base metals - Measurement of coating thickness - Amplitude-sensitive eddy-current method (ISO 2360:2017) |
MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
NFPA 79 : 2015 | ELECTRICAL STANDARD FOR INDUSTRIAL MACHINERY |
IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
NFPA 496 : 2017 | PURGED AND PRESSURIZED ENCLOSURES FOR ELECTRICAL EQUIPMENT |
ASTM F 22 : 2013 : REDLINE | Standard Test Method for Hydrophobic Surface Films by the Water-Break Test |
IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
IPC TM 650 : 0 | TEST METHODS MANUAL |
IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
MIL-HDBK-454 Revision B:2007 | GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT |
IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
NFPA 33 : 2016 | SPRAY APPLICATION USING FLAMMABLE OR COMBUSTIBLE MATERIALS |
IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
NFPA 35 : 2016 | MANUFACTURE OF ORGANIC COATINGS |
ASTM G 154 : 2016 : REDLINE | Standard Practice for Operating Fluorescent Ultraviolet (UV) Lamp Apparatus for Exposure of Nonmetallic Materials |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
MIL-F-13927 Revision A:1957 | FUNGUS RESISTANCE TEST, AUTOMOTIVE COMPONENTS |
IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
ASTM G 155 : 2013 : REDLINE | Standard Practice for Operating Xenon Arc Light Apparatus for Exposure of Non-Metallic Materials |
IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
IPC 1331 : 0 | VOLUNTARY SAFETY STANDARD FOR ELECTRICALLY HEATED PROCESS EQUIPMENT |
MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
1998/37/EC : 1998 | DIRECTIVE 98/37/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL OF 22 JUNE 1998 ON THE APPROXIMATION OF THE LAWS OF THE MEMBER STATES RELATING TO MACHINERY |
ASTM D 1212 : 1991 | Standard Test Methods for Measurement of Wet Film Thickness of Organic Coatings |
ANSI B11.1 : 2009 | SAFETY REQUIREMENTS FOR MECHANICAL POWER PRESSES |
ASTM D 570 : 1998 : R2018 | Standard Test Method for Water Absorption of Plastics |
SEMI S14 : 2016 | SAFETY GUIDELINES FOR FIRE RISK ASSESSMENT AND MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT |
ASTM D 3359 : 2017 : REDLINE | Standard Test Methods for Rating Adhesion by Tape Test |
IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
ASTM F 1249 : 2013 : REDLINE | Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor |
EN ISO 2808:2007 | Paints and varnishes - Determination of film thickness (ISO 2808:2007) |
EN 60204-1 : 2006 COR 2010 | SAFETY OF MACHINERY - ELECTRICAL EQUIPMENT OF MACHINES - PART 1: GENERAL REQUIREMENTS |
IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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