IPC 7351 : B
Current
The latest, up-to-date edition.
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
30-06-2010
1 SCOPE
2 APPLICABLE DOCUMENTS
3 DESIGN REQUIREMENTS
4 COMPONENT QUALITY VALIDATION
5 TESTABILITY
6 PRINTED BOARD STRUCTURE TYPES
7 ASSEMBLY CONSIDERATION FOR SURFACE MOUNT TECHNOLOGY (SMT)
8 IPC-7352 DISCRETE COMPONENTS
9 IPC-7353 GULLWING LEADED COMPONENTS, TWO SIDES
10 IPC-7354 J-LEADED COMPONENTS, TWO SIDES
11 IPC-7355 GULL-WING LEADED COMPONENTS, FOUR SIDES
12 IPC-7356 J LEADED COMPONENTS, FOUR SIDES
13 IPC-7357 POST (DIP) LEADS, TWO SIDES
14 IPC-7358 AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA,
Chip Array)
15 IPC-7359 NO-LEAD COMPONENTS (QFN, PQFN, SON, PSON, LCC)
16 ZERO COMPONENT ORIENTATIONS
APPENDIX A (INFORMATIVE) - TEST PATTERNS - PROCESS EVALUATIONS
APPENDIX B - IPC-7351 LAND PATTERN CALCULATOR
Defines land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. Also specifies printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.
| DevelopmentNote |
Included in IPC C 106, IPC C 103, IPC C 105 & IPC C 1000. (07/2009) Also available in German Language, See IPC 7351 GERMAN. (11/2011) Supersedes IPC SM 782 & IPC 7351 CD. (05/2016)
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| DocumentType |
Standard
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| PublisherName |
Institute of Printed Circuits
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| Status |
Current
|
| Supersedes |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| IPC 7801 : 0 | REFLOW OVEN PROCESS CONTROL STANDARD |
| PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 2223 CHINESE : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 2223 GERMAN : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC 1756 : 2010 | MANUFACTURING PROCESS DATA MANAGEMENT |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC 9701 CHINESE : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC S 816 : 0 | SMT PROCESS GUIDELINE AND CHECKLIST |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 2226 : 0 | SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7530 : 0 | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE) |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 1902 : 1998 | GRID SYSTEMS FOR PRINTED CIRCUITS |
| IPC 7525 : B | STENCIL DESIGN GUIDELINES |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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