IPC A 610 SPANISH : E
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
Hardcopy
13-09-2023
English
Important note : Users cannot be edited or removed once added to your Multi user PDF.Este documento presenta los requisitos de aceptación para la manufactura de ensambles electrónicos. Históricamente, estándares de ensamble electrónico contenían preceptos más comprensivas que hablaban de principios y técnicas. Para un entendimiento más completo de las recomendaciones y requisitos de este documento, uno puede usar este estándar en conjunto con IPC-HDBK-001, IPC-HDBK-610 y el IPC J-STD-001.
| DevelopmentNote |
Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
420
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC AI 642 : 1988 | USER'S GUIDELINES FOR AUTOMATED INSPECTION OF ARTWORK, INTERLAYERS AND UNPOPULATED PWBS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC WHMA A 620 : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IPC AI 641 : 1987 | USER'S GUIDELINES FOR AUTOMATED SOLDER JOINT INSPECTION SYSTEMS |
| IPC 9691 : A | USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
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