IPC CH 65 : B
Current
Current
The latest, up-to-date edition.
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
Available format(s)
Hardcopy
Language(s)
English
Published date
25-07-2011
Publisher
1 OVERVIEW
2 APPLICABLE DOCUMENTS
3 ASSEMBLY CLEANING VALUE AND APPLICABILITY
4 DESIGNING ASSEMBLIES FOR CLEANING
5 MATERIALS COMPATIBILITY
6 PROCESS DEVELOPMENT AND VERIFICATION
7 CONTAMINATION AND ITS EFFECTS ON PWBS
8 ASSEMBLY RESIDUES/CLEANING CONSIDERATIONS
9 ENVIRONMENTAL CONSIDERATIONS
10 SOLVENT CLEANING AGENTS
11 SEMI-AQUEOUS CLEANING AGENTS, EQUIPMENT, AND PROCESS
OPTIMIZATION
12 AQUEOUS CLEANING AGENTS, EQUIPMENT, AND PROCESS INTEGRATION
13 CLEANING FOR REWORK, REPAIR, AND RESTORATION OPERATIONS
Discusses the relationship between materials, processes, and contaminants in fabrication and assembly operations. Also addresses cleanliness assessment and process control in relation to cleanliness.
| DevelopmentNote |
Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008) Supersedes IPC SC 60, IPC SA 61, IPC AC 62 & IPC SM 839. (07/2011) Also available in Chinese language, See IPC CH 65 CHINESE. (01/2014)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-004-7
|
| Pages |
200
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7526 : 2007 | STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 5701 : 0 | USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 075 GERMAN : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 075 CHINESE : - | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC HDBK 4691 : 2015 | HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS |
| IPC SA 61 : A | POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC TR 582 : 0 | CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IPC M 108 : LATEST | CLEANING GUIDES AND HANDBOOKS MANUAL |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC TR 580 : 1989 | CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS |
| IPC TR 581 : 1994 | IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY |
| TT-N-95 Revision B:1967 | |
| ASTM D 1153 : 2012 : REDLINE | Standard Specification for Methyl Isobutyl Ketone |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| CFR 33(PTS125-199) : JUL 2017 | NAVIGATION AND NAVIGABLE WATERS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ASQ Z1.15:1979 | Generic Guidelines For Quality Systems, |
| O-T-236 Revision C:1979 | TETRACHLOROETHYLENE (PERCHLOROETHYLENE), TECHNICAL GRADE |
| CFR 40(PTS81-85) : JUL 2012 | PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY |
| IPC 4202 : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS |
| CFR 40(PTS300-399) : JUL 2017 | PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY |
| ASTM D 1320 : 73(1983) | TEST METHOD FOR TENSILE STRENGTH OF PARAFFIN WAX |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| CFR 40(PT63) : JUL 98 | NATIONAL EMISSION STANDARDS FOR HAZARDOUS AIR POLLUTANTS FOR SOURCE CATEGORIES |
| MIL-C-81302 Revision D:1985 | CLEANING COMPOUND, SOLVENT, TRICHLOROTRIFLUOROETHANE |
| CFR 40(PTS400-424) : JUL 2017 | PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY |
| IPC 4203 : A | COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY |
| CFR 40(PTS260-265) : JUL 2017 | PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY |
| O-T-634 Revision C:1984 | TRICHLOROETHYLENE, TECHNICAL |
| CFR 40(PTS100-135) : JUL 2017 | PROTECTION OF ENVIRONMENT |
| O-T-620 Revision C:1967 | TRICHLOROETHANE-1,1,1, TECHNICAL, INHIBITED (METHYL CHLOROFORM) |
| TT-M-261 Revision D:1970 | METHYL ETHYL KETONE, TECHNICAL |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| ASTM D 4080 : 2015 : REDLINE | Standard Specification for Trichloroethylene, Technical and Vapor-Degreasing Grade |
| TT-N-97 Revision D:2007 | Naphtha; Aromatic |
| TT-T-548 Revision F:1991 | TOLUENE, TECHNICAL |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| NFPA 35 : 2016 | MANUFACTURE OF ORGANIC COATINGS |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IPC TR 580 : 1989 | CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS |
| ASTM D 4081 : 2016 : REDLINE | Standard Specification for Drycleaning-Grade Perchloroethylene |
| GR 78 CORE : ISSUE 2 | GENERIC REQUIREMENTS FOR THE PHYSICAL DESIGN AND MANUFACTURE OF TELECOMMUNICATIONS PRODUCTS AND EQUIPMENT |
| ASTM D 4376 : 2015 : REDLINE | Standard Specification for Vapor-Degreasing Grade Perchloroethylene |
| CFR 29(PT1910.1000 TO END) : 0 | LABOR - OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR |
| ASTM D 93 : 2016-07 | TEST METHODS FOR FLASH POINT BY PENSKY-MARTENS CLOSED CUP TESTER |
| ASTM D 5309 : 2017 : REDLINE | Standard Specification for Cyclohexane 999 |
| TT B 848 : B | BUTYL ALCOHOL, SECONDARY (FOR USE IN ORGANIC COATINGS) |
| CFR 40(PTS425-699) : JUL 2017 | PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY |
| NFPA 30 : 2018 | FLAMMABLE AND COMBUSTIBLE LIQUIDS CODE |
| IPC PE 740 : 0 | TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY |
| TT-I-735 Revision A:1963 | ISOPROPYL ALCOHOL |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| O-A-51 Revision H:1992 | ACETONE, TECHNICAL |
| ASTM D 362 : 1984 | Specification for Industrial Grade Toluene (Withdrawn 1989) |
| ASTM D 1133 : 2013 : REDLINE | Standard Test Method for Kauri-Butanol Value of Hydrocarbon Solvents |
| ASTM D 329 : 2007 | Standard Specification for Acetone |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| O-E-760 Revision D:1987 | ETHYL ALCOHOL (ETHANOL), DENATURED ALCOHOL, PROPRIETARY SOLVENTS & SPECIAL INDUSTRIAL SOLVENTS |
| O-M-232 Revision M:2016 | METHANOL (METHYL ALCOHOL) |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL-T-81533 Revision A:1967 | TRICHLOROETHANE, 1, 1, 1, (METHYL CHLOROFORM) INHIBITED, VAPOR DEGREASING |
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