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BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
Available format(s)
Hardcopy , PDF
Language(s)
English
Publisher
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1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Measuring method
Bibliography
BS EN 60747-14-8 ED 1.0.
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
NA
|
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-17:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation |
| IEC 60068-2-5:2010 | Environmental testing - Part 2-5: Tests - Test Sa: Simulated solar radiation at ground level and guidance for solar radiation testing |
| IEC 60068-2-70:1995 | Environmental testing - Part 2-70: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands |
| IEC 60068-2-18:2017 | Environmental testing - Part 2-18: Tests - Test R and guidance: Water |
| IEC 60068-2-43:2003 | Environmental testing - Part 2-43: Tests - Test Kd: Hydrogen sulphide test for contacts and connections |
| IEC 60068-2-68:1994 | Environmental testing - Part 2-68: Tests - Test L: Dust and sand |
| IEC 60749-8:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC 60068-2-60:2015 RLV | Environmental testing - Part 2-60: Tests - Test Ke: Flowing mixed gas corrosion test |
| IEC 60068-2-63:1991 | Environmental testing - Part 2: Test methods - Test Eg: Impact, spring hammer. |
| IEC 60068-2-49:1983 | Basic environmental testing procedures - Part 2-49: Tests - Guidance to test Kc: Sulphur dioxide test for contacts and connections |
| IEC 60068-2-81:2003 | Environmental testing - Part 2-81: Tests - Test Ei: Shock - Shock response spectrum synthesis |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| IEC 60749-31:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) |
| IEC 60749-1:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General |
| IEC 60749-29:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60068-2-57:2013 | Environmental testing - Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method |
| IEC 60068-2-50:1983 | Environmental testing. Part 2: Tests. Tests Z/AFc: Combined cold/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens |
| IEC 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| IEC 60749-36:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state |
| IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
| IEC 60749-18:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) |
| IEC 60068-2-39:2015 | Environmental testing - Part 2-39: Tests - Tests and guidance: Combined temperature or temperature and humidity with low air pressure tests |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
| IEC 60749-16:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) |
| IEC 60068-2-31:2008 | Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens |
| IEC 60068-2-64:2008 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
| IEC 60068-2-53:2010 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
| IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| IEC 60749-9:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60749-33:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave |
| IEC 60749-24:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
| IEC 60721-2-1:2013 | Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity |
| IEC 60068-2-47:2005 | Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60747-14-1:2010 | Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60721-3-0:1984+AMD1:1987 CSV | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction |
| IEC 60068-2-10:2005 | Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth |
| IEC 60749-35:2006 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60749-7:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases |
| IEC 60068-2-9:1975 | Environmental testing - Part 2: Tests. Guidance for solar radiation testing |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60068-2-61:1991 | Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence |
| IEC 60749-13:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere |
| IEC 60068-2-80:2005 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |
| IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| IEC 60068-2-42:2003 | Environmental testing - Part 2-42: Tests - Test Kc: Sulphur dioxide test for contacts and connections |
| IEC 60749-2:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure |
| IEC 60068-2-75:2014 | Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests |
| ISO/IEC Guide 2:2004 | Standardization and related activities — General vocabulary |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-28:1990 | Environmental testing - Part 2: Tests. Guidance for damp heat tests |
| IEC 60068-2-8:1960 | Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test H: Storage |
| IEC 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60068-2-48:1982 | Environmental testing - Part 2: Tests. Guidance on the application of the tests of IEC 68 to simulate the effects of storage |
| IEC 60068-2-55:2013 | Environmental testing - Part 2-55: Tests - Test Ee and guidance - Loose cargo testing including bounce |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60749-32:2002+AMD1:2010 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) |
| IEC 60068-2-74:1999 | Environmental testing - Part 2: Tests - Test Xc: Fluid contamination |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60749-14:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
| IEC 60749-19:2003+AMD1:2010 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength |
| IEC 60749-22:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength |
| IEC 60068-2-52:2017 | Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) |
| IEC 60068-2-65:2013 | Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 60068-2-51:1983 | Environmental testing. Part 2: Tests. Tests Z/BFc: Combined dry heat/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens |
| IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
| IEC 60721-3-1:1997 | Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage |
| IEC 60068-2-46:1982 | Basic environmental testing procedures - Part 2-46: Tests - Guidance to test Kd: Hydrogen sulphide test for contacts and connections |
| IEC 60068-2-59:1990 | Environmental testing. Part 2: Tests. Test Fe: Vibration - Sine-beat method |
| IEC 60749-23:2004+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
| IEC 60068-2-56:1988 | Environmental testing - Part 2: Tests. Test Cb: Damp heat, steady state, primarily for equipment |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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