IPC J STD 006 : C
Current
Current
The latest, up-to-date edition.
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Amended by
Available format(s)
Hardcopy
Language(s)
English
Published date
12-08-2013
Publisher
1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
Appendix A - Solder Alloys
Appendix B - Examples of Inspection
Report Format
Appendix B-1 - Test Report for Solder Alloy Composition
and Impurity Level
Appendix B-2 - Inspection Report for Fluxed
Wire/Ribbon Solder Individual
Inspection and Test Results
Appendix B-3 - Inspection Report for Non-Fluxed Solder
Individual Inspection and Test Results
Appendix B-4 - Inspection Report for
Solder Powder
Describes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for 'special form' electronic grade solders.
| Committee |
5-20
|
| DevelopmentNote |
Supersedes MIL F 14256, QQ S 571, QPL 14256 & QPL QQ S 571. (07/2004) Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. B2006 + A1 2008 Edition is still available in Japanese Language, See J STD 006 JAPANESE. (10/2009) B2006 + A2 2009 Edition is still available in Russian Language, See separate record (12/2011) Also available in Chinese Language, See J STD 006 CHINESE. (04/2014)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-104-4
|
| Pages |
34
|
| ProductNote |
NEW CHILD AMD 1 2017 IS NOW ADDED
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| MIL-DTL-15514 Revision G:2016 | Telephone Equipment, Sound Powered Telephone Handset, Headset-Chest Set, and Headset - Chest Set, Noise Attenuating |
| MIL-DTL-83513-30 Revision B:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-32025 Base Document:1998 | CARTRIDGE, IMPULSE, CCU-96/B |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| MIL-PRF-94 Revision G:2006 | Resistor, Variable, Composition, General Specification for |
| MIL-DTL-4339 Revision E:2009 | Corrosion Preventive, Soluble Oil for Water Injection Systems (NATO Code Number C-630) |
| MIL-DTL-4510 Revision F:2009 | Spotlights, Incandescent, Roof-Mounted, Automotive |
| MS27145 Revision C:2003 | CONNECTOR, PLUG, ELECTRICAL, NO. 14 AWG DOUBLE CONTACT, WATERPROOF |
| MIL-DTL-83513-32 Revision B:2009 | Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Straight, Socket Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board |
| MIL-DTL-13623 Revision E:2010 | SWITCH, ROTARY: 28 VOLT DC |
| MIL-DTL-83513-13 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL R 23285 : B | RESISTOR, VARIABLE, NONWIRE WOUND GENERAL SPECIFICATION FOR |
| MIL-DTL-28748-19 Base Document:2005 | CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, STRAIGHT THROUGH, SOCKET CONTACTS, SIZE 22 |
| MIL-DTL-83513-27 Revision D:2009 | Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Straight, Socket Contacts, 4 Row, Solder Type, 100 Contacts, Printed Circuit Board |
| MIL-DTL-83513-23 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-83513-33 Revision B:2008 | Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Straight, Socket Contacts, 4 Row, Solder Type, Standard Profile, 100 Contacts, Printed Circuit Board |
| MIL-PRF-27208 Revision F:2006 | RESISTOR, VARIABLE, WIREWOUND, NONPRECISION, GENERAL SPECIFICATION FOR |
| SAE AS83519C | Shield Termination, Solder Style, Insulated, Heat-Shrinkable, Environment Resistant General Specification For |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| SAE AS95234A | Connectors, Electrical, Reverse Bayonet, General Specification for |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IPC J STD 002 CHINESE : C | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| MIL-DTL-83513 Revision G:2008 | Connectors, Electrical, Rectangular, Microminiature, Polarized Shell, General Specification for |
| MIL-C-11272 Revision E:2008 | CAPACITORS, FIXED, GLASS DIELECTRIC, GENERAL SPECIFICATION FOR |
| MIL-PRF-914 Revision C:2008 | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, NONESTABLISHED RELIABILITY, AND ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL C 5 : G | CAPACITOR, FIXED, MICA DIELECTRIC, GENERAL SPECIFICATION FOR |
| MIL C 39019 : C | CIRCUIT BREAKERS, MAGNETIC, LOW-POWER, SEALED, TRIP-FREE, GENERAL SPECIFICATION FOR |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL-DTL-3607 Revision C:2009 | Connectors, Coaxial, Radiofrequency, Series for Pulse, General Specification for |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-DTL-28778 Revision A:2005 | TRANSFORMER, POWER, STEPUP, 3 PHASE |
| MIL-PRF-31031 Revision C:2014 | CONNECTORS, ELECTRICAL, PLUGS AND RECEPTACLES, COAXIAL, RADIO FREQUENCY, HIGH RELIABILITY, FOR FLEXIBLE AND SEMIRIGID CABLES, GENERAL SPECIFICATION FOR |
| MIL-DTL-12109-21 Revision B:2011 | SOLENOID, ELECTRICAL; CLASS 2 (MACHINE GUN) 7.62 MM, 24 VOLT DC, 8 AMP MAX |
| IPC J STD 003 CHINESE : B | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| MIL-DTL-22641 Revision G:2016 | ADAPTERS, COAXIAL TO WAVEGUIDE, GENERAL SPECIFICATION FOR |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL-DTL-7879 Revision E:2013 | Antenna AT-141A/ARC |
| IPC LDFR0805-CD : 2005 | IPC/JEDEC 9TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES AUGUST 2005 |
| IPC SPVC-LAT1 : 2010 | ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA |
| IPC J STD 005 RUSSIAN : A | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL-DTL-13253 Revision E:2007 | HANDSETS, GENERAL SPECIFICATION FOR |
| IPC LDFR1006-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND" |
| MIL-DTL-14072 Revision F:2013 | FINISHES FOR GROUND BASED ELECTRONIC EQUIPMENT |
| MIL PRF 83513 : D | CONNECTORS, ELECTRICAL, RECTANGULAR, MICROMINIATURE, POLARIZED SHELL, GENERAL SPECIFICATION FOR |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-DTL-15743 Revision F:2017 | SWITCHES, ROTARY, ENCLOSED |
| IPC TP 1090 : 1996 | THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002 |
| MIL-STD-2003-1 Revision A:2009 | ELECTRIC PLANT INSTALLATION STANDARD METHODS FOR SURFACE SHIPS AND SUBMARINES (CABLE) |
| IPC LDFR0806-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND" |
| IPC LDFR0605-CD : 2005 | IPC/SOLDERTEC 3RD INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONICS "TOWARDS IMPLEMENTATION OF THE ROHS DIRECTIVE" |
| IPC LDFR1005-CD : 2005 | IPC/JEDEC 11TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES |
| IPC LDFR1106-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND" |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-DTL-32106 Base Document:2003 | INITIATORS, ELECTRICAL, FOR ROCKET MOTOR IGNITERS |
| MIL B 18 : F | BATTERIES, NON-RECHARGEABLE, DRY |
| MIL-PRF-39003 Revision N:2016 | Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for |
| MIL-DTL-28754-62 Revision A:2016 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER, CROSSOVER, CONTACT TAILS ON .050 CENTERS |
| MIL-STD-2003-5 Revision A:2009 | ELECTRIC PLANT INSTALLATION STANDARD METHODS FOR SURFACE SHIPS AND SUBMARINES (CONNECTORS) |
| MIL-DTL-28748 Revision D:2001 | CONNECTOR, PLUG AND RECEPTACLE, RECTANGULAR, RACK AND PANEL SOLDER TYPE AND CRIMP TYPE CONTACTS - GENERAL SPECIFICATION FOR |
| MIL-PRF-55681 Revision G:2016 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC LDFR0306-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES |
| IPC SPVC2005-CD : 2005 | ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC LDFR1205-CD : 2006 | IPC/JEDEC 12TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES - DECEMBER 2005 |
| MIL-DTL-917 Revision F:2014 | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
| MIL-DTL-3786 Revision J:2013 | SWITCHES, ROTARY (CIRCUIT SELECTOR, LOW-CURRENT CAPACITY), GENERAL SPECIFICATION FOR |
| MIL-STD-1353 Revision C:2014 | ELECTRICAL CONNECTORS, PLUG-IN SOCKETS AND ASSOCIATED HARDWARE, SELECTION AND USE OF |
| MIL-DTL-87104 Revision C:2014 | COAXIAL ASSEMBLIES, GENERAL SPECIFICATION FOR |
| MIL STD 750-2 : A | MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999 |
| MIL-PRF-49467 Revision C:2005 | Capacitor, Fixed, Ceramic, Multilayer, High Voltage (General Purpose), General Specification For |
| MIL-DTL-28827 Revision C:2011 | SWITCHES, THERMOSTATIC, (VOLATILE LIQUID), HERMETICALLY SEALED, GENERAL SPECIFICATION FOR |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| MIL PRF 24308 : D | CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, GENERAL SPECIFICATION FOR |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC HDBK 005 : 0 | GUIDE TO SOLDER PASTE ASSESSMENT |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC SM 840 CHINESE : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL-DTL-28754-6 Revision D:2014 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 PIN, STRAIGHT THROUGH |
| MIL-DTL-1716 Revision J:1997 | POLE, TENT, TELESCOPIC, ADJUSTABLE 5 FEET TO 9 FEET, MAGNESIUM |
| IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
| MIL-DTL-28754-97 Revision A:2015 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 150 CONTACT, RIGHT ANGLE, CONTACT TAILS ON 0.100 CENTERS |
| MIL-DTL-9395 Revision K:2016 | Switches, Pressure (Absolute, Gage and Differential) General Specification for |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC LDFR0406-CD : 2006 | IPC/SOLDERTEC GLOBAL 4TH INTERNATIONAL ELECTRONICS CONFERENCE AND EXHIBITION "ROHS COMPLIANCE AND BEYOND" |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| MIL-PRF-27 Revision G:2014 | TRANSFORMERS AND INDUCTORS (AUDIO, POWER, AND HIGH-POWER PULSE), GENERAL SPECIFICATION FOR |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| IPC J STD 005 CHINESE : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL DTL 28754/60 : A | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER CONTACT TAILS ON .100 CENTERS |
| MIL-DTL-16225 Revision C:2010 | LOUDSPEAKER, PERMANENT MAGNET, BLASTPROOF AND SUBMERSIBLE, NAVY TYPE 49546() |
| MIL-DTL-11996 Revision C:2015 | HANDSETS, GENERAL SPECIFICATION FOR |
| PPP-B-1672 Revision E:2013 | BOXES, SHIPPING, REUSABLE WITH CUSHIONING |
| MIL-DTL-12606 Revision E:2000 | LOUDSPEAKER, PERMANENT MAGNET (UNENCASED, 3-INCH AND 4-INCH DIAMETER CONE, 2-WATT; FUNGUS-, AND IMMERSION-RESISTANT), TYPE LS-445/U, M12606-01, AND M12606-02 |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| MIL-DTL-12632 Revision E:2016 | LOUDSPEAKERS, PERMANENT MAGNET (ENCASED, 2-WATT, FUNGUS-, GUNBLAST-, AND IMMERSION-RESISTANT), GENERAL SPECIFICATION FOR |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC TP 1115 : 1998 | SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-DTL-18793 Revision B:2011 | ANTENNA AS-333/AP |
| MIL-DTL-28754-8 Revision D:2014 | Connectors, Electrical, Modular, Type IV, 40 Contact, Right Angle (for Die Cast Frame) |
| MIL-DTL-28754-11 Revision F:2014 | Connectors, Electrical, Modular, Type IV, 40 Contact, Right Angle (for Solid or Dip Frame) |
| MIL-DTL-28754-59 Revision A:2016 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER CONTACT TAILS ON .100 CENTERS (CERAMIC COMPATIBLE) |
| MIL-DTL-83513-29 Revision B:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, STANDARD PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-28748-18 Base Document:2005 | CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, STRAIGHT THROUGH, PIN CONTACTS, SIZE 22 |
| MIL-DTL-83513-25 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-83513-22 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-13625 Revision G:2017 | SWITCHES, PULL; SWITCHES, PUSH; SWITCHES, BEAM SELECTING, HEADLIGHT: ELECTRICAL (28 VOLTS DC MAXIMUM, FOR MILITARY VEHICLES) |
| MIL-DTL-83513-17 Revision D:2009 | Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board |
| MIL-DTL-83513-19 Revision D:2009 | Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Right Angle, Socket Contacts, 2 Row, Solder Type, Standard Profile, 9 Through 37 Contacts, Printed Circuit Board |
| MIL-DTL-83513-21 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-83513-24 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 4 ROW, SOLDER TYPE, 100 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-16878 Revision H:2012 | WIRE, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR |
| MIL-DTL-25516 Revision F:2004 | CONNECTORS, ELECTRICAL, MINIATURE, COAXIAL, ENVIRONMENT RESISTANT TYPE, GENERAL SPECIFICATION FOR |
| MIL-DTL-83513-18 Revision D:2009 | Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 4 Row, Solder Type, Standard Profile, 100 Contacts, Printed Circuit Board |
| MIL-PRF-15733 Revision J:2010 | FILTERS AND CAPACITORS, RADIO FREQUENCY INTERFERENCE, GENERAL SPECIFICATION FOR |
| MIL R 27208 : D | RESISTOR, VARIABLE, WIRE-WOUND, NONPRECISION, GENERAL SPECIFICATION FOR |
| MIL F 28861 : B | FILTER AND CAPACITOR, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR |
| MS27144 Revision D:2016 | CONNECTOR, PLUG, ELECTRICAL, SOCKET CONTACT, NO. 14 AND 16 AWG, WATERPROOF |
| AWS WHC2.13 : 0 | WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING |
| MIL-DTL-83513-26 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-3976 Revision F:2013 | Lights, Marker, Clearance (Service and Blackout) General Specification for |
| MIL-DTL-83513-10 Revision D:2008 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-PRF-28861 Revision E:2016 | FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR |
| MIL-DTL-21567 Revision B:2009 | COMPOUND, SILICONE, SOFT FILM |
| MIL R 94 : E | RESISTORS, VARIABLE, COMPOSITION, GENERAL SPECIFICATION FOR |
| MIL-PRF-81705 Revision E:2009 | Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable |
| MS90908 Revision C:2011 | FILLER TUBE, FUEL TANK - MILITARY VEHICLES |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| 13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| MIL-DTL-5015 Revision H:2000 | CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE - GENERAL SPECIFICATION FOR |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-DTL-28754-14 Revision D:2014 | Connectors, Electrical, Modular, Connector, Type IV, 20 Contact, Right Angle (for Die Cast Frame) |
| MIL-DTL-26482 Revision H:2007 | Connectors, Electrical, Circular, Miniature, Quick Disconnect, Environment Resisting, Receptacles and Plugs, General Specification for |
| MIL-DTL-28748-21 Base Document:2005 | Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Socket Contacts, Size 22 |
| MIL-PRF-6864 Revision F:2010 | CLEANING COMPOUND, SOLVENT, OIL COOLER |
| MIL-DTL-32234 Base Document:2007 | CONNECTORS, ELECTRICAL, ULTRA HIGH DENSITY, MODULAR, BLADE AND FORK, EIGHT ROW, GENERAL SPECIFICATION FOR |
| MIL-DTL-83513-31 Revision B:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATUREE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-83513-16 Revision D:2009 | Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 2 Row, Solder Type, Standard Profile, 9 Through 37 Contacts, Printed Circuit Board |
| MIL-DTL-83513-14 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-PRF-22097 Revision J:2007 | RESISTOR, VARIABLE, NONWIREWOUND, ADJUSTMENT TYPE, GENERAL SPECIFICATION FOR |
| IPC TR 582 : 0 | CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR |
| MIL-PRF-32560 Base Document:2016 | COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| SAE AMSP81728B | Plating, Tin-Lead (Electrodeposited) |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| MIL-DTL-39024 Revision C:2014 | JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR |
| NASA STD 8739.3 : 1998 | SOLDERED ELECTRICAL CONNECTIONS |
| MIL-STD-981 Revision C:2010 | DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS |
| NASA MSFC STD 2907 : 2006 | WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
| MIL-B-49030 Revision A:2010 | BATTERIES, DRY (ALKALINE) |
| NASA KSC SPEC E 0031 : 2008 | CABLES, ELECTRICAL, SPECIFICATION FOR |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| MIL-DTL-28754-47 Revision C:2015 | CONNECTORS, ELECTRICAL MODULAR, TYPE 4, CONNECTOR, 100 PIN, RIGHT ANGLE CONTACT TAILS ON .100 CENTERS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| NASA KSC SPEC E 0024 : 2008 | CABLE, ELECTRICAL, SHIELDED, JACKETED, FOR HARNESS ASSEMBLIES, GENERAL SPECIFICATION FOR |
| NASA STD 8739.2 : 1999 | WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| MIL-STD-186 Revision F:2002 | PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS |
| MIL-DTL-28754-10 Revision D:2014 | Connectors, Electrical, Modular, Connector, Type IV, 40 Pin, Contact Tails on 0.050 Centers |
| MIL-DTL-28754-101 Revision A:2015 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 0.6 PITCH, 250 CONTACT, CENTER |
| MIL-DTL-24308 Revision G:2009 | Connectors, Electric, Rectangular, Nonenvironmental, Miniature, Polarized Shell, Rack and Panel, General Specification for |
| MIL-PRF-31033 Revision B:2011 | Capacitor, Fixed, Ceramic Dielectric, High Reliability, Discoidal, General Specification for |
| MIL-DTL-83513-12 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-8416 Revision C:2005 | ADAPTER, HEADSET-MICROPHONE MX-1646()/AIC |
| MIL-DTL-83513-11 Revision D:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-5794 Revision C:2006 | MICROPHONE UNIT M-6A/UR AND MICROPHONE, CARBON M-51/UR (CARBON NOISE CANCELING) |
| MIL L 12632 : D | LOUDSPEAKER, PERMANENT MAGNET (ENCASED, 2 WATT, FUNGUS, GUNBLAST, AND IMMERSION RESISTANT), GENERAL SPECIFICATION FOR |
| MIL-DTL-27434 Revision B:2003 | ADAPTERS, CONNECTOR, COAXIAL, RADIO FREQUENCY, BETWEEN SERIES, GENERAL SPECIFICATION FOR |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| MIL-DTL-76 Revision E:2016 | WIRE AND CABLE, HOOKUP, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR |
| AWS C3.11M/C3.11:2011 | SPECIFICATION FOR TORCH SOLDERING |
| MIL-DTL-10986 Revision G:2007 | INDICATORS AND TRANSMITTERS: LIQUID, TEMPERATURE AND PRESSURE |
| MIL-PRF-29607 Base Document:1996 | CLEANING COMPOUND, AVIONICS COMPONENTS, NON-OZONE DEPLETING |
| MIL-DTL-83513-15 Revision E:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKETS CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD |
| SAE AS39029D | Contacts, Electrical Connector, General Specification For |
| SAE AS50151C | Connectors, Electrical, Circular Threaded, AN Type, General Specification For |
| SAE AS4461C | Assembly and Soldering Criteria for High Quality/High Reliability Soldering Wire and Cable Termination in Aerospace Vehicles |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| MIL-DTL-28754-100 Revision A:2015 | CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 200 CONTACT, CENTER |
| MIL-DTL-28754-61 Revision A:2016 | Connectors, Electrical, Modular, Type IV, Connector, 100 Pin, Center, Crossover, Contact Tails on .100 Centers (Ceramic Compatible) |
| MIL-DTL-83513-28 Revision B:2009 | CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD |
| MIL-DTL-55235 Revision A:2003 | CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES TPS, GENERAL SPECIFICATION |
| MIL-DTL-21617 Revision B:2012 | CONNECTORS, PLUG AND RECEPTACLE, ELECTRICAL, RECTANGULAR, POLARIZED SHELL, MINIATURE TYPE, GENERAL SPECIFICATION FOR |
| MIL-DTL-83502 Revision E:2007 | Sockets, Plug-in Electronic Components, Round Style, General Specification for |
| MIL-DTL-28748-20 Base Document:2005 | Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Pin Contacts, Size 22 |
| MIL-DTL-3655 Revision D:2004 | Connector, Plug and Receptacle, Electrical (Coaxial, Series Twin), and Associated Fittings, General Specification for |
| MIL-DTL-55302-83 Revision C:2004 | CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, PIN CONTACTS, 41, 66, 114 CONTACT POSITIONS: FOR PRINTED WIRING BOARDS (.100 X .050 OFFSET GRID) |
| SAE AS95234 | Connectors, Electrical, Reverse Bayonet, General Specification For |
| SAE AS29600B | Connectors, Electrical, Circular, Miniature, Composite, High Density, Quick Coupling, Environment Resistant, Removable Crimp Contacts Associated Hardware, General Specification For |
| MIL-DTL-83513-20 Revision D:2009 | Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Right Angle, Socket Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board |
| MIL-DTL-3643 Revision B:2003 | Connectors, Coaxial, Radio Frequency, Series HN, and Associated Fittings, General Specification for |
| MIL-DTL-3650 Revision B:2003 | Connectors, Coaxial, Radio Frequency, Series LC |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| MS35644 Revision G:2011 | FILLER NECK: FUEL TANK - MILITARY VEHICLES |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| DSCC 99002 : A | TRANSFORMER, SWITCHING |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| MIL-DTL-18714 Revision F:2012 | PRIMER, ELECTRIC, MARK 45 MOD 1 |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| DSCC 03024 : C | SHIELDING BEAD, ELECTRONIC, CHIP, FERRITE, HIGH RELIABILITY |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| ISO 9001:2015 | Quality management systems — Requirements |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| ISO 10012-1:1992 | Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment |
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