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  • J STD 002 : D

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES

    Available format(s):  Hardcopy

    Superseded date:  23-08-2019

    Language(s):  English

    Published date:  24-06-2013

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 PREFACE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 TEST PROCEDURES
    5 NOTES
    APPENDIX A - Critical Component Surfaces
    APPENDIX B - Evaluation Aids
    APPENDIX C - Calculation of Maximum
                 Theoretical Force
    APPENDIX D - Calculation of Integrated Value
                 of Area of the Wetting Curve
    APPENDIX E - Informative Annex
    APPENDIX F - J-STD-002/J-STD-003 Activated
                 Solderability Test Flux Rationale
                 Committee Letter
    APPENDIX G - Graphical Representations:
                 Progression of Solder Wetting
                 Curve Parameters As Measured
                 By Wetting Balance Testing
    APPENDIX H - Test Protocol for Wetting

    Abstract - (Show below) - (Hide below)

    Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Development Note Supersedes IPC S 805, EIA IS 49 & EIA 638. Included in IPC C 103 & IPC C 1000. Supersedes EIA 364-52. (07/2009) Also available in Chinese Language, See separate record J STD 002 CHINESE. (05/2016) Jointly Published by IPC, EIA and JEDEC. (07/2013) Supersedes EIA JESD 22-B102. (03/2016) Also available in Hardcopy format. (03/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL PRF 83446/37 : A COILS, RADIO FREQUENCY, CHIP, OPEN CONSTRUCTION, SURFACE MOUNT, 0805 SIZE
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    DSCC 06012 : A RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (2.0 WATT), STYLE 2816
    MIL PRF 39010/16 : 0 COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, FERRITE CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
    DSCC 04006 : A CAPACITORS, TANTALUM, HYBRID, HERMETICALLY SEALED
    MIL PRF 32535 : A CAPACITOR, CHIP, FIXED, CERAMIC DIELECTRIC (TEMPERATURE STABLE AND GENERAL PURPOSE), EXTENDED RANGE, HIGH RELIABILITY AND STANDARD RELIABILITY, GENERAL SPECIFICATION FOR
    DSCC 04003 : E CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED
    SAE J 2685 : 2014 POSITIVE TEMPERATURE COEFFICIENT OVERCURRENT PROTECTION DEVICES (PTCS)
    DSCC 06008 : A RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.125 WATT), STYLE 0805
    ASTM B 965 : 2009 Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
    BS EN 60068-2-69 : 2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    SAE AS 22759 : 2014 WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, COPPER OR COPPER ALLOY
    IEC PAS 62686-2:2016 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
    SAE AS 29606 : 2014 WIRE, ELECTRICAL, STRANDED, UNINSULATED COPPER, COPPER ALLOY, OR ALUMINUM, OR THERMOCOUPLE EXTENSION, GENERAL SPECIFICATION FOR
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    DSCC 06010 : B RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.5 WATT), STYLE 2010
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    I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    EN IEC 60810:2018 LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS (IEC 60810:2017)
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    DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    ASTM B 965 : 2009 : R2014 Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
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    MIL PRF 10304 : F METERS, ELECTRICAL INDICATING, PANEL TYPE, RUGGEDIZED, GENERAL SPECIFICATION FOR
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    IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
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    PD IEC/TS 62647-22:2013 (published 2013-10) Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    IEC TS 62861:2017 Guidelines for principal component reliability testing for LED light sources and LED luminaires
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
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    BS PD IEC/PAS 62647-1 : 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
    IEC 62435-5:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
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    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    BS EN 62435-5 : 2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
    BS PD IEC TS 62668-2 : 2016 PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
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    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
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    J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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    J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
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