IPC 6012 FRENCH : C
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
Available format(s)
Hardcopy
Superseded date
28-01-2018
Superseded by
Language(s)
French
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| DevelopmentNote |
ADDENDUM 15 is available separately, See separate record IPC 6012DS FRENCH. (12/2016) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
64
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 4552 : 0 | PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC 4202 : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS |
| IPC 9252 : A | REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC JP002 : 0 | JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC 4203 : A | COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY |
| IPC 4563 : 0 | RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE |
| ASME B46.1 : 2009 | SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY) |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC 4811 : 0 | SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 2251 : 0 | DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS |
| IPC 9151 : D | PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| ASTM B 679 : 1998 | Standard Specification for Electrodeposited Coatings of Palladium for Engineering Use |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 9691 : A | USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING |
| IPC 4821 : 0 | SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| SAE AMS QQ A 250 B : 2012 | ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
| IPC 4781 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK |
| NEMA LI 1 : 1998(R2011) | INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
| IPC 4554 : 0 | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| IPC A 47 : 1996 | COMPOSITE TEST PATTERN TEN-LAYER PHOTOTOOL |
| IPC 6016 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS |
| QQ-S-635 Revision B:1976 | STEEL PLATE, CARBON |
| IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
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