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IPC 6012 RUSSIAN : C

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

View Superseded by

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

Available format(s)

Hardcopy

Withdrawn date

19-01-2014

Superseded by

IPC 6013 : C

Language(s)

Russian

€213.56
Excluding VAT

Committee
D-33A
DevelopmentNote
Russian translation of C2010 Edition issued in May 2013. (01/2014)
DocumentType
Standard
Pages
60
PublisherName
Institute of Printed Circuits
Status
Withdrawn
SupersededBy

IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
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IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
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IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
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IPC 4202 : A FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC JP002 : 0 JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC 4203 : A COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
IPC 4563 : 0 RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE
ASME B46.1 : 2009 SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY)
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
IPC 4811 : 0 SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2251 : 0 DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
IPC 9151 : D PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
ASTM B 679 : 1998 Standard Specification for Electrodeposited Coatings of Palladium for Engineering Use
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
IPC 4821 : 0 SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
SAE AMS QQ A 250 B : 2012 ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR
IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
IPC 4781 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK
NEMA LI 1 : 1998(R2011) INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
IPC 4554 : 0 SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC A 47 : 1996 COMPOSITE TEST PATTERN TEN-LAYER PHOTOTOOL
IPC 6016 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS
QQ-S-635 Revision B:1976 STEEL PLATE, CARBON
IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS

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