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IEC 60068-2-54:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
07-03-2017
English, English - French, Spanish, Castilian
27-04-2006
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
5.1 Test system
5.2 Solder bath
6 Preconditioning
6.1 Preparation of specimens
6.2 Ageing
7 Materials
7.1 Solder
7.2 Flux
8 Procedure
8.1 Test temperature
8.2 Fluxing
8.3 Flux drying
8.4 Test
9 Presentation of results
9.1 Form of chart-recorder trace
9.2 Points of significance
9.3 Reference wetting force
9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
for solderability testing
Bibliography
Figures
Table
IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).
Committee |
TC 91
|
DevelopmentNote |
Stability Date: 2015. (10/2012) A Bilingual edition has been published on 30/07/2013. (08/2013)
|
DocumentType |
Standard
|
Pages |
18
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
Standards | Relationship |
BS 2011-2.1T:1981 | Similar to |
JIS C 0053:1996 | Identical |
NF EN 60068 2-54 : 2015 | Identical |
GOST R IEC 60068-2-54 : 2017 | Identical |
HD 323.2.54 : 200S1 | Identical |
NEN EN IEC 60068-2-54 : 2006 | Identical |
I.S. EN 60068-2-54:2006 | Identical |
PN EN 60068-2-54 : 2009 | Identical |
SN EN 60068-2-54 : 2006 | Identical |
UNE-EN 60068-2-54:2007 | Identical |
BS EN 60068-2-54:2006 | Identical |
CEI EN 60068-2-54 : 2007 | Identical |
EN 60068-2-54:2006 | Identical |
DIN EN 60068-2-54:2007-01 | Identical |
CEI 50-8/1 : 1ED 1998 | Identical |
UNE 20501-2-54:1994 | Identical |
DIN IEC 60068-2-54:1988-01 | Identical |
NEN 10068-2-54 : 1986 | Identical |
NF EN 60384-4 : 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
BS EN 61188-5-5:2007 | Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides |
PREN ISO 9455-16 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
BS 123100-003:2001 | System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes |
BS EN 60539-1:2016 | Directly heated negative temperature coefficient thermistors Generic specification |
BS EN 60384-4:2016 | Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte |
10/30210450 DC : 0 | BS EN 61076-4-116 - CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS: DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION |
NF EN 60384-1 : 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
BS EN 61051-1:2008 | Varistors for use in electronic equipment Generic specification |
BS EN 62211:2004 | Inductive components. Reliability management |
OVE/ONORM EN 61051-1 : 2009 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 60384-1 REDLINE : 5ED 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 60384-15:2017 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE |
BS EN 61076-4-116 : 2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION |
IEC 62391-1:2015 | Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
I.S. EN ISO 9455-16:2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
I.S. EN ISO 9455-10:2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
NF EN 62391-1 : 2018 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
UNI EN ISO 9455-16 : 2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
IEC 62211:2017 | Inductive components - Reliability management |
BS EN ISO 9455-16:2013 | Soft soldering fluxes. Test methods Flux efficacy test, wetting balance method |
IEC 60384-1:2016 RLV | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
EN 60068-2-44:1995 | Environmental testing - Part 2: Tests - Guidance on Test T: Soldering |
EN 61051-1:2008 | Varistors for use in electronic equipment - Part 1: Generic specification |
EN 61076-4-113:2003 | Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications |
EN 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
DEFSTAN 34-4/2(1990) : 1990 | FLUXES FOR SOFT SOLDERING ELECTRICAL AND ELECTRONIC ASSEMBLIES |
I.S. EN 61188-5-5:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES |
I.S. EN 61051-1:2008 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
07/30165180 DC : 0 | BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
11/30243259 DC : 0 | BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
BS EN 61169-1:2013 | Radio-frequency connectors Generic specification. General requirements and measuring methods |
IEC 60512-12-7:2001 | Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method |
BS EN 60384-15:2017 | Fixed capacitors for use in electronic equipment Sectional specification: Fixed tantalum capacitors with non-solid or solid electrolyte |
IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 60539-1:2016 | Directly heated negative temperature coefficient thermistors - Part 1: Generic specification |
CEI EN 60384-4 : 2007 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
NF EN 61076 4 113 : 2005 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRINTED BOARD CONNECTORS - PART 4-113: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS HAVING 5 ROWS WITH A GRID OF 2,54 MM FOR PRINTED BOARDS AND BACKPLANES IN BUS APPLICATIONS |
DIN EN ISO 9455-10:2013-01 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
DIN EN ISO 9455-16:2013-08 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
UNE-EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
13/30287806 DC : 0 | BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
CEI EN 60384-15 : 1ED 2017 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 15: SECTIONAL SPECIFICATION: FIXED TANTALUM CAPACITORS WITH NON-SOLID OR SOLID ELECTROLYTE |
BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
BS EN 61076-4-113:2003 | Connectors for electronic equipment Printed board connectors with assessed quality Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications |
10/30234803 DC : 0 | BS EN 61169-1 ED.2 - RADIO FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
I.S. EN 60384-1:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
PREN ISO 9455-10 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
I.S. EN 62211:2017 | INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
IEC 60384-15:2017 | Fixed capacitors for use in electronic equipment - Part 15: Sectional specification: Fixed tantalum capacitors with non-solid or solid electrolyte |
IEC 61051-1:2007 | Varistors for use in electronic equipment - Part 1: Generic specification |
I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
IEC 61076-4-113:2002 | Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications |
IEC 61169-1:2013 | Radio frequency connectors - Part 1: Generic specification - General requirements and measuring methods |
UNE-EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
UNI EN ISO 9455-10 : 2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
11/30252855 DC : 0 | BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
14/30280850 DC : 0 | BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
BS 123800-003:2001 | System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections |
EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
CEI EN 61051-1 : 2010 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 61076-4-113:2003 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRINTED BOARD CONNECTORS - PART 4-113: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS HAVING 5 ROWS WITH A GRID OF 2,54 MM FOR PRINTED BOARDS AND BACKPLANES IN BUS APPLICATIONS |
PD 6521:1988 | Summaries of test methods for environmental testing of electrotechnical products |
BS EN 60512-12-7:2001 | Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method |
BS EN 60068-2-20:2008 | Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads |
BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
IEC 62391-1:2015 RLV | Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
I.S. EN 61076-4-116:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION |
I.S. EN 60068-2-20:2008 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
CEI EN 60512-12-7 : 2002 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD |
EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
I.S. EN 62391-1:2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 61169-1:2013 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
EN 61169-1:2013/AC:2016-02 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013) |
EN 60539-1:2016/AC:2017-09 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
EN 61076-4-116:2012/A1:2016 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION (IEC 61076-4-116:2012/A1:2015) |
EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
ISO 12224-3:2003 | Solder wire, solid and flux cored Specifications and test methods Part 3: Wetting balance test method for flux cored solder wire efficacy |
BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
BS EN ISO 12224-3:2003 | Solder wire, solid and flux cored. Specification and test methods Wetting balance test method for flux core solder wire efficacy |
IEC 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
IEC 60384-4:2016 | Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Fixed aluminium electrolytic capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 62391-1 : 2.0 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN ISO 9455-10:2012 | Soft soldering fluxes. Test methods Flux efficacy test, solder spread method |
IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
IEC 61076-4-116:2012+AMD1:2015 CSV | Connectors for electronic equipment - Product requirements - Part4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function |
EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
EN ISO 12224-3:2003 | Solder wire, solid and flux cored - Specifications and tests methods - Part 3: Wetting balance test method for flux core solder wire efficacy (ISO 12224-3:2003) |
EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
13/30289543 DC : 0 | BS EN 60384-4 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO2) AND NON-SOLID ELECTROLYTE |
BS 9752:1989 | Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level |
13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
IEEE C62.33-1982 | IEEE Standard Test Specifications for Varistor Surge-Protective Devices |
11/30213136 DC : 0 | BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
11/30234673 DC : 0 | BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
NF EN 61076-4-116 : 2012 AMD 1 2016 | CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 4-116: PRINTED BOARD CONNECTORS - DETAIL SPECIFICATION FOR A HIGH-SPEED TWO-PART CONNECTOR WITH INTEGRATED SHIELDING FUNCTION |
I.S. EN 60068-2-44:1997 | ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
CEI EN 60539-1 : 2009 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
CEI EN 60068-2-20 : 2009 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
I.S. EN 60384-4:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 4: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH SOLID (MNO[2]) AND NON-SOLID ELECTROLYTE |
IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
I.S. EN 60539-1:2016 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
DIN EN ISO 12224-3:2003-10 | Solder wire, solid and flux cored - Specifications and test methods - Part 3: Wetting balance test method for flux cored solder wire efficacy (ISO 12224-3:2003) |
ISO 9455-16:2013 | Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
EN 62211:2017 | Inductive components - Reliability management |
EN 60384-4:2016 | Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Fixed aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyte |
EN 60512-12-7:2001 | Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method |
EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
EN 62391-1:2016/AC:2016-12 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016) |
EN 60384-15:2017 | Fixed capacitors for use in electronic equipment - Part 15: Sectional specification: Fixed tantalum capacitors with non-solid or solid electrolyte |
CSA E60384.1 : 2014 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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