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IPC J STD 004 : B

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

REQUIREMENTS FOR SOLDERING FLUXES

Available format(s)

Hardcopy

Superseded date

10-03-2022

Superseded by

IPC-J-STD-004C:2022

€201.00
Excluding VAT

1 SCOPE AND DESIGNATION
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 QUALIFICATIONS AND QUALITY ASSURANCE PROVISIONS
Appendix A - Example Qualification Test Report
Appendix B - Notes

Describes general requirements for the classification and characterization of fluxes for high quality solder interconnections.

DevelopmentNote
Supersedes QQ S 571, MIL F 14256, IPC SF 818, QPL 14256, QPL QQ S 571 & DEFSTAN 34-4/2(1990). Included in IPC C 103 & IPC C 1000. (04/2006) A2004 Edition is available in Japanese Language, See J STD 004 JAPANESE. B2008 Edition Re-Issued in November 2011 & incorporates AMD 1 2011. Also available in Chinese & Russian languages, See J STD 004 CHINESE & J STD 004 RUSSIAN. (11/2012)
DocumentType
Standard
Pages
36
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 3155-041:2007 Aerospace series. Electrical contacts used in elements of connection Contacts, electrical, coaxial, size 12, female, type D, solder, class R. Product standard
EN 3155-041:2007 Aerospace series - Electrical contacts used in elements of connection - Part 041: Contacts, electrical, coaxial, size 12, female, type D, solder, class R - Product standard
PREN 3155-040 : 200P1 AEROSPACE SERIES - ELECTRICAL CONTACTS USED IN ELEMENTS OF CONNECTION - PART 040: CONTACTS, ELECTRICAL, COAXIAL, SIZE 12, MALE, TYPE D, SOLDER, CLASS R - PRODUCT STANDARD
MIL-DTL-28754-11 Revision F:2014 Connectors, Electrical, Modular, Type IV, 40 Contact, Right Angle (for Solid or Dip Frame)
I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
MIL-DTL-21617 Revision B:2012 CONNECTORS, PLUG AND RECEPTACLE, ELECTRICAL, RECTANGULAR, POLARIZED SHELL, MINIATURE TYPE, GENERAL SPECIFICATION FOR
MIL-DTL-28754-100 Revision A:2015 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 200 CONTACT, CENTER
MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
DSCC 99002 : A TRANSFORMER, SWITCHING
SAE AMSP81728B Plating, Tin-Lead (Electrodeposited)
MS90908 Revision C:2011 FILLER TUBE, FUEL TANK - MILITARY VEHICLES
GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
I.S. EN 3155-041:2007 AEROSPACE SERIES - ELECTRICAL CONTACTS USED IN ELEMENTS OF CONNECTION - PART 041: CONTACTS, ELECTRICAL, COAXIAL, SIZE 12, FEMALE, TYPE D, SOLDER, CLASS R - PRODUCT STANDARD
EN 3155-039:2007 Aerospace series - Electrical contacts used in elements of connection - Part 039: Contacts, electrical, coaxial, size 16, female, type D, solder, class R - Product standard

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
ISO/TS 16949:2009 Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations
EN 14582:2016 Characterization of waste - Halogen and sulfur content - Oxygen combustion in closed systems and determination methods
IPC TM 650 : 0 TEST METHODS MANUAL
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
ANSI/NCSL Z540 1 : 94(R2002) CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS
ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
GR 78 CORE : ISSUE 2 GENERIC REQUIREMENTS FOR THE PHYSICAL DESIGN AND MANUFACTURE OF TELECOMMUNICATIONS PRODUCTS AND EQUIPMENT
ISO 10012:2003 Measurement management systems — Requirements for measurement processes and measuring equipment
ISO 9001:2015 Quality management systems — Requirements
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS

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