IPC AJ 820 : A
Current
Current
The latest, up-to-date edition.
ASSEMBLY AND JOINING HANDBOOK
Available format(s)
Hardcopy
Language(s)
English
Published date
21-02-2012
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 SCOPE
2 HANDLING ELECTRONIC ASSEMBLIES
3 DESIGN CONSIDERATIONS
4 PRINTED CIRCUIT BOARDS
5 ELECTRONIC CIRCUIT COMPONENTS
6 SOLDERABILITY
7 ASSEMBLY AND JOINING MATERIALS
8 COMPONENT MOUNTING
9 SOLDERING
10 OTHER ASSEMBLY AND JOINING METHODS
11 CLEANLINESS REQUIREMENTS
12 CONFORMAL COATING
13 POTTING AND ENCAPSULATION
14 REWORK AND REPAIR
Specifies guidelines and supporting information for manufacturing electronic assemblies. The intent is to explain the 'how-to' and 'why' information, and fundamentals for these processes.
| DevelopmentNote |
Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-039-9
|
| Pages |
290
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC S 816 : 0 | SMT PROCESS GUIDELINE AND CHECKLIST |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| ASTM D 1458 : 2013-12 | TEST METHODS FOR FULLY CURED SILICONE RUBBER-COATED GLASS FABRIC AND TAPES FOR ELECTRICAL INSULATION |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC SM 780 : 0 | COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING |
| ASTM D 3418 : 2015 : REDLINE | Standard Test Method for Transition Temperatures and Enthalpies of Fusion and Crystallization of Polymers by Differential Scanning Calorimetry |
| SAE AS5553B | Counterfeit Electrical, Electronic, and Electromechanical (EEE) Parts; Avoidance, Detection, Mitigation, and Disposition |
| ASTM D 709 : 2017 : REDLINE | Standard Specification for Laminated Thermosetting Materials |
| SAE AS6174A | Counterfeit Materiel; Assuring Acquisition of Authentic and Conforming Materiel |
| IPC SM 784 : 0 | GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
| IEC 61086-2:2004 | Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test |
| ASME Y14.5 : 2009 | DIMENSIONING AND TOLERANCING |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL-STD-1130 Revision C:2012 | Connections, Electrical, Solderless Wrapped |
| IPC DRM 18 : H2007 | COMPONENT IDENTIFICATION TRAINING AND REFERENCE GUIDE |
| IEC 61086-3-1:2004 | Coatings for loaded printed wire boards (conformal coatings) - Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3) |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| SAE AMSQQN290C | Nickel Plating (Electrodeposited) |
| MIL-STD-1686 Revision C:1995 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) |
| IPC D 422 : 0 | DESIGN GUIDE FOR PRESS FIT RIGID PRINTED BOARD BACK PLANES |
| ASTM D 571 : 1976 | Methods of Testing Rubber Hose for Automotive Hydraulic Brake System (Withdrawn 1981) |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| MIL-HDBK-454 Revision B:2007 | GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC D 355 : 0 | PRINTED BOARD ASSEMBLY DESCRIPTION IN DIGITAL FORM |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| ASTM D 255 : 1992 | Standard Method for Steam Distillation of Bituminous Protective Coatings (Withdrawn 2000) |
| MIL-A-28870 Revision A:1990 | ASSEMBLIES, ELECTRICAL BACKPLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC SM 839 : 0 | PRE AND POST SOLDER MASK APPLICATION CLEANING GUIDELINES |
| IPC 7094 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
| IPC 1601 : 0 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| ASTM D 4065 : 2012 : REDLINE | Standard Practice for Plastics: Dynamic Mechanical Properties: Determination and Report of Procedures |
| ASTM D 257 : 2014 : REDLINE | Standard Test Methods for DC Resistance or Conductance of Insulating Materials |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| ASTM B 193 : 2016 : REDLINE | Standard Test Method for Resistivity of Electrical Conductor Materials |
| IPC SM 817 : A | GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
| ASTM D 570 : 1998 : R2018 | Standard Test Method for Water Absorption of Plastics |
| IPC DW 426 : 0 | SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| ASTM D 2214 : 2002 | Standard Test Method for Estimating the Thermal Conductivity of Leather with the Cenco-Fitch Apparatus (Withdrawn 2008) |
| IPC C 406 : 0 | DESIGN AND APPLICATION GUIDELINES FOR SURFACE MOUNT CONNECTORS |
| ASTM D 3359 : 2017 : REDLINE | Standard Test Methods for Rating Adhesion by Tape Test |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| ASTM D 638 : 2014 : REDLINE | Standard Test Method for Tensile Properties of Plastics |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| ASTM F 1249 : 2013 : REDLINE | Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor |
| IPC FA 251 : 0 | GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| ASTM E 92 : 2017 : REDLINE | Standard Test Methods for Vickers Hardness and Knoop Hardness of Metallic Materials |
| IEC 61086-1:2004 | Coatings for loaded printed wire boards (conformal coatings) - Part 1: Definitions, classification and general requirements |
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