MIL-STD-883 Revision K:2016
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TEST METHOD STANDARD - MICROCIRCUITS
Available format(s)
PDF
Superseded date
17-07-2021
Superseded by
MIL-STD-883 Revision L:2019
MIL-STD-883-3 Base Document:2019
MIL-STD-883-4 Base Document:2019
Language(s)
English
Published date
03-05-2018
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1. SCOPE
2. APPLICABLE DOCUMENTS
3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAIL REQUIREMENTS
6. NOTES
Sets up uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.
| Committee |
FSC 5962
|
| DocumentType |
Test Method
|
| Pages |
765
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| DOD-C-24529 Base Document:1976 | CHARGERS, BATTERY, LIFT TRUCK AND PALLET TRANSPORTER BATTERY SERVICE (METRIC) |
| I.S. EN IEC 60810:2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| MIL-M-38510-763 Revision B:2005 | MICROCIRCUITS, DIGITAL, ADVANCED CMOS, COUNTERS, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-655 Revision A:2005 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, BUS TRANSCEIVERS WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON |
| MIL-M-38510-345 Revision C:2004 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, Exclusive or Gates, Monolithic Silicon |
| MIL C 83383 : C | CIRCUIT BREAKER, REMOTE CONTROL THERMAL, TRIP FREE, GENERAL SPECIFICATION FOR |
| AFGS-87213 Revision B:1993 | DISPLAYS, AIRBORNE, ELECTRONICALLY/OPTICALLY GENERATED |
| MIL-M-38510-203 Revision E:2007 | MICROCIRCUITS, DIGITAL, 1024 BIT SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON |
| IEC 62396-1:2016 | Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
| DD IEC TS 62396-1 : DRAFT JUL 2006 | PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 1: ACCOMMODATION OF ATMOSPHERIC RADIATION EFFECTS VIA SINGLE EVENT EFFECTS WITHIN AVIONICS ELECTRONIC EQUIPMENT |
| DSCC 10018 : A | FILTER, EMI, HYBRID, 15 AMP |
| MIL-PRF-32140 Base Document:2004 | RELAYS, ELECTROMAGNETIC, RADIO FREQUENCY, ESTABLISHED RELIABILITY, - GENERAL SPECIFICATION FOR |
| BS EN 16602-60-15:2014 | Space product assurance. Radiation hardness assurance. EEE components |
| MIL-M-38510-211 Base Document:1987 | MICROCIRCUITS, DIGITAL, 32,768 BIT SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON |
| MIL-M-38510-289 Revision A:2006 | MICROCIRCUITS, DIGITAL, CMOS 4096 BIT STATIC RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| SAE AS6294/1 | Requirements for Plastic Encapsulated Microcircuits in Space Applications |
| I.S. EN 16602-60-13:2015 | SPACE PRODUCT ASSURANCE - REQUIREMENTS FOR THE USE OF COTS COMPONENTS |
| MIL-R-29583 Base Document:1992 | RADIO SET |
| MIL-M-38510-26 Revision B:2005 | Microcircuits, Digital, TTL, Low Power, Exclusive-OR Gates, Monolithic Silicon |
| ANSI/AAMI CI86:2017 | COCHLEAR IMPLANT SYSTEMS: REQUIREMENTS FOR SAFETY, FUNCTIONAL VERIFICATION, LABELING AND RELIABILITY REPORTING |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
| 18/30373170 DC : 0 | BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
| MIL-R-83726-24 Revision M:2016 | RELAYS, SOLID STATE, TIME DELAY (ON OPERATE), TRACK MOUNTED, TYPE 1, CLASS C, SPST, 150 MILLIAMPERES, FIXED TIME, 50 MILLISECONDS TO 500 SECONDS |
| MIL L 24554 : 0 | LAMPS MK III INTERFACE SIGNAL SWITCHING SET |
| DSCC 98026 : C | FILTER, EMI, HYBRID |
| 15/30324422 DC : 0 | BS EN 62396-1 - PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 1: ACCOMMODATION OF ATMOSPHERIC RADIATION EFFECTS VIA SINGLE EVENT EFFECTS WITHIN AVIONICS ELECTRONIC EQUIPMENT |
| SAE AS1145C | Aircraft Brake Temperature Monitor Systems (BTMS) |
| DSCC 13010 : A | FILTER, EMI, HYBRID, 28 V DC |
| DSCC SMD 5962-89855 : 0 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ONE TIME PROGRAMMABLE, ASYNCHRONOUS REGISTERED PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON |
| MIL-PRF-32535 Revision A:2017 | Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, General Specification for |
| DSCC SMD 5962-90993 : F | MICROCIRCUIT, LINEAR, OPERATIONAL AMPLIFIER, HIGH SPEED, PROGRAMMABLE SUPPLY CURRENT, MONOLITHIC SILICON |
| DOD-STD-2000-4 Revision A:1987 | GENERAL PURPOSE SOLDERING REQUIREMENT FOR ELECTRICAL AND ELECTRONIC EQUIPMENT |
| DSCC 85092 : G | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS |
| GEIA TA HB 0009 : 2013 | RELIABILITY PROGRAM HANDBOOK |
| MIL H 38534 : B (1) | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| MIL-M-38510-342 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, 4-Bit Binary Full Adders with Fast Carry, Monolithic Silicon |
| BS EN 16602-70-08:2015 | Space product assurance. Manual soldering of high-reliability electrical connections |
| CEI 56-44 : 2000 | DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE |
| MIL-A-24726 Base Document:1989 | ATTENUATORS, FIBER OPTIC, SHIPBOARD GENERAL SPECIFICATION FOR |
| DSCC 09027 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210 |
| MIL P 24765 : 0 | POWER SUPPLY, UNINTERRUPTIBLE, STATIC |
| SAE AS6294/2 | Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications |
| MIL-A-85055 Base Document:1979 | Avionics System Performance Specification for A-4M/AV-8 Bombing Set, Angle Rate AN/ASB-19(V) |
| MIL P 49146 : B | POWER SUPPLY 18 MILLIMETER, MICROCHANNEL WAFER |
| DSCC 95004 : J | FILTER, EMI, HYBRID |
| MIL-M-38510-55 Revision G:2005 | MICROCIRCUITS, DIGITAL, CMOS, BUFFER/CONVERTER, TRUE/COMPLIMENT BUFFER, MONOLITHIC SILICON |
| MIL-M-38510-323 Revision D:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Quadruple Bus Buffer Gates with Three State Outputs, Monolithic Silicon |
| BS EN 62258-1:2010 | Semiconductor die products Procurement and use |
| 01/206130 DC : DRAFT AUG 2001 | IEC 62258 - SEMICONDUCTOR DIE PRODUCTS - MINIMUM REQUIREMENTS FOR PROCUREMENT AND USE - PART 1: GENERAL REQUIREMENTS - MECHANICAL, MATERIAL AND CONNECTIVITY |
| MIL-HDBK-11991 Base Document:1996 | DESIGN OF ELECTRICAL, ELECTRONIC, AND ELECTRO-MECHANICAL EQUIPMENT, GUIDED MISSILE AND ASSOCIATED WEAPONS SYSTEMS |
| MIL-PRF-83383 Revision F:2017 | Circuit Breakers, Remote Control, Thermal, Trip Free General Specification For |
| MIL-A-29420 Base Document:1985 | AMPLIFIER-CONVERTER: AM-6879/URC |
| MIL-M-63530 Base Document:1982 | MICROCIRCUIT, DIGITAL, CMOS (LOGIC) |
| MIL-M-38510-374 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Low Power Schottky TTL, and Gates, Monolithic Silicon |
| ASTM D 2442 : 1975 : R2012 | Standard Specification for Alumina Ceramics for Electrical and Electronic Applications |
| DD IEC/TS 62239:2003 | Process management for avionics. Preparation of an electronic components management plan |
| MIL-F-24638 Base Document:1984 | FREQUENCY CHANGER, SOLID STATE, AIR COOLED (NAVAL SHIPBOARD) |
| 17/30371228 DC : 0 | BS EN 62149-3 ED.3.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 3: MODULATOR-INTEGRATED LASER DIODE TRANSMITTERS FOR 2;5-GBIT/S TO 40-GBIT/S FIBRE OPTIC TRANSMISSION SYSTEMS |
| DSCC 95010 : D | FILTER, EMI AND TRANSIENT SUPPRESSION, HYBRID |
| MIL-C-87179 Base Document:1984 | COATING, PROTECTIVE, SOLVENT REMOVABLE, FOR MICROCIRCUITS |
| MIL M 38510/233 : A | MICROCIRCUIT DIGITAL TTL 4096 BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| MIL-M-38510-172 Revision C:2004 | Microcircuits, Digital, CMOS, and-or-Invert, Exclusive-or, Exclusive-nor Gates, Monolithic Silicon, Positive Logic |
| MIL-DTL-62421 Revision A:2009 | CONTROL, UNIT, ELECTRONIC, DIGITAL |
| MIL-M-38510-291 Revision B:2006 | MICROCIRCUITS, DIGITAL, CMOS 16,384 BIT STATIC RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| MIL-M-38510-322 Revision C:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Hex Bus Drivers with 3 State Outputs, Monolithic Silicon |
| MIL-M-38510-178 Revision A:1984 | MICROCIRCUIT, DIGITAL, CMOS MULTIPLEXERS DEMULTIPLEXERS MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL M 38510/235 : C | MICROCIRCUIT DIGITAL MOS 4096 BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| MIL C 0024621 : A | COUPLERS, PASSIVE, FIBER OPTIC, GENERAL SPECIFICATION FOR |
| ASTM E 2311 : 2004 : R2016 | Standard Practice for QCM Measurement of Spacecraft Molecular Contamination in Space |
| MIL-M-38510-750 Revision B:2003 | Microcircuits, Digital, Advanced CMOS, Nand Gates, Monolithic Silicon, Positive Logic |
| MIL-M-38510-348 Revision C:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Bus Transceivers with Three-State Outputs, Monolithic Silicon |
| MIL-M-38510-110 Revision C:2003 | Microcircuits, Linear, Quad Operational Amplifiers, Monolithic Silicon |
| MIL-M-38510-73 Revision B:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, MULTIPLE NOR GATES, MONOLITHIC SILICON |
| MIL-M-38510-753 Revision B:2003 | Microcircuits, Digital, Advanced CMOS, Flip-Flops, Monolithic Silicon, Positive Logic |
| MIL-M-38510-176 Revision B:2004 | MICROCIRCUIT, DIGITAL, CMOS, LATCHES, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-STD-1546 Revision B:1992 | PARTS, MATERIALS, AND PROCESSES CONTROL PROGRAM FOR SPACE AND LAUNCH VEHICLES |
| MIL M 38510/226 : A | MICROCIRCUITS DIGITAL NMOS 16,384 BIT ELECTRICALLY PROGRAMMABLE READ ONLY MEMORY (EPROM) MONOLITHIC SILICON |
| MIL-M-38510-503 Revision B:1987 | MICROCIRCUITS, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON |
| CEI ES 59001 : 2000 | APPROVAL SCHEME FOR AUTOMOTIVE ORIENTED APPLICATIONS WITHIN THE ELECTRONIC COMPONENTS INDUSTRY - SEMICONDUCTOR STRESS TEST QUALIFICATION |
| DSCC 11018 : 0 | INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603 |
| MIL-M-38510-16 Revision A:2005 | Microcircuits, Digital, TTL, and Gates, Monolithic Silicon |
| MIL-M-38510-423 Revision A:1983 | MICROCIRCUITS, DIGITAL, SCHOTTKY TTL, SYSTEM CONTROLLER AND BUS DRIVER, MONOLITHIC SILICON |
| DSCC 85145 : E | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, 240 MILLIAMPERES, +/-100 V DC BIDIRECTIONAL, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS |
| MIL-E-63300 Revision A:1981 | ELECTRONIC ASSEMBLY FOR MINE, ANTIPERSONNEL, HE, M74 |
| MIL-R-85669 Base Document:1988 | REPEATER SET, RADIO, POD AN/ARQ-49 |
| MIL D 87213 : 0 | DISPLAYS/OPTICALLY GENERATED REQUEST FOR ISSUE OTHER THAN DOD MUST BE SENT VIA; ASD/ENES, WRIGHT-PATTERSON AFB OH 45433-6503 |
| DSCC 90091 : G | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 1 OR 2 A, WITH OR WITHOUT CIRCUIT-BREAKER ACTION OR STATUS INDICATION, 6-PIN CERAMIC DUAL-IN-LINE PACKAGE |
| MIL-M-38510-238 Revision B:2003 | Microcircuits, Digital, MOS, 4096 Bit Static Random Access Memory (RAM), Monolithic Silicon |
| MIL-M-38510-373 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Low Power Schottky TTL, Nor Gates, Monolithic Silicon |
| MIL-M-38510-210 Revision F:2013 | Microcircuit, Digital, 16,384 Bit Schottky, Bipolar, Programmable Read-Only Memory (PROM) Monolithic Silicon |
| MIL-R-83726-22 Revision F:2008 | Relays, Solid State, Repeat Cycle Timer, Type IV, Class C, SPST, 250 Milliamperes (No S/S Document) |
| MIL-M-38510-13 Revision G:2005 | Microcircuits, Digital, Bipolar, TTL, Counters Monolithic Silicon |
| MIL-N-63396 Base Document:1981 | NETWORK, RESISTOR FIXED & ADJUSTABLE |
| MIL-M-38510-663 Revision A:2006 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, COUNTERS, MONOLITHIC SILICON |
| MIL-M-38510-702 Revision A:2005 | Microcircuits, Linear, Regulating Pulse Width Modulators, Monolithic Silicon |
| MIL-M-38510-61 Revision C:2004 | Microcircuits, Digital, ECL, Flip-Flops, Monolithic Silicon |
| IEC TS 62239-2:2017 | Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan |
| MIL-M-38510-102 Revision C:2003 | Microcircuits, Linear, Voltage Regulator, Monolithic Silicon |
| I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| ASTM F 458 : 2013 : R2018 | Standard Practice for Nondestructive Pull Testing of Wire Bonds (Withdrawn 2023) |
| ARINC 628P1-7 : 2015 | CABIN EQUIPMENT INTERFACES - PART 1: CABIN MANAGEMENT AND ENTERTAINMENT SYSTEM - PERIPHERALS |
| I.S. EN 16602-60:2015 | SPACE PRODUCT ASSURANCE - ELECTRICAL, ELECTRONIC AND ELECTROMECHANICAL (EEE) COMPONENTS |
| DSCC SMD 5962-87739 : H | MICROCIRCUIT, LINEAR, QUAD, VOLTAGE COMPARATOR, RADIATION HARDENED, MONOLITHIC SILICON |
| I.S. EN 62258-1:2010 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| IEC 60300-3-7:1999 | Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware |
| ASTM E 2311 : 2004 : R2009 | Standard Practice for QCM Measurement of Spacecraft Molecular Contamination in Space |
| DSCC 06023 : B | FILTER, EMI, HYBRID, 28V DC |
| ASTM F 97 : 1972 : R2002 : EDT 1 | Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration (Withdrawn 2008) |
| IEC 62149-3:2014 | Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems |
| EN 62149-6:2003 | Fibre optic active components and devices - Performance standards - Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| DSCC 01515L:2023 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS,FIELD PROGRAMMABLE GATE ARRAY, 72,000 GATES, MONOLITHIC SILICON |
| DSCC 93173B:2023 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, PARALLEL FIFO,MONOLITHIC SILICON |
| DSCC 21203A:2023 | MICROCIRCUIT, LINEAR, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON |
| DSCC 84185G:2023 | MICROCIRCUIT, LINEAR, TWO-STAGE DIFFERENTIAL VIDEO AMPLIFIER, MONOLITHIC SILICON |
| DSCC 6209D:2023 | MICROCIRCUIT, HYBRID, LINEAR, 3.3 VOLT, SINGLE CHANNEL, DC-DC CONVERTER |
| DSCC V62/22612:2022 | MICROCIRCUIT, BiCMOS, ULTRA-LOW-NOISE JESD204B DUAL-LOOP CLOCK JITTER CLEANER, MONOLITHIC SILICON |
| DSCC V62/P22612A:2022 | MICROCIRCUIT, BiCMOS, ULTRA-LOW-NOISE JESD204B DUAL-LOOP CLOCK JITTER CLEANER, MONOLITHIC SILICON |
| DSCC 99514D:2023 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1-MEG X 1-BIT SERIAL CONFIGURATION PROM, MONOLITHIC SILICON |
| DSCC 89683F:2022 | MICROCIRCUIT, HYBRID, LINEAR, 5-VOLT,SINGLE CHANNEL, DC/DC CONVERTER |
| DSCC V62/23612:2023 | MICROCIRCUIT, BiCMOS, ULTRA-LOW-NOISE JESD204B DUAL-LOOP CLOCK JITTER CLEANER, MONOLITHIC SILICON |
| DSCC 84180H:2023 | MICROCIRCUIT, LINEAR, PRECISION VOLTAGE REFERENCES, SHUNT REGULATORS, MONOLITHIC SILICON |
| DSCC 87806F:2023 | MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, BCD-TO-7 SEGMENT LATCH/DECODER/DRIVER, MONOLITHIC SILICON |
| DSCC 92042H:2022 | MICROCIRCUIT, LINEAR, CMOS, MULTIPLEXER,MONOLITHIC SILICON |
| DSCC 87578F:2023 | MICROCIRCUIT, LINEAR, LOW-NOISE OPERATIONAL AMPLIFIER, MONOLITHIC SILICON |
| DSCC 14211D:2023 | MICROCIRCUIT, HYBRID, DUAL CHANNEL,DC-DC CONVERTER |
| DSCC 92069B:2023 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 4K X PARALLEL-TO-SERIAL FIFO, MONOLITHIC SILICON |
| DSCC 88755D:2023 | MICROCIRCUIT, DIGITAL, ADVANCED CMOS,QUAD 2-INPUT MULTIPLEXER, TTL COMPATIBLEINPUTS, MONOLITHIC SILICON |
| DSCC 86054C:2023 | MICROCIRCUIT, LINEAR, ELECTROLUMINESCENT ROW DRIVER, MONOLITHIC SILICON |
| DSCC 89746D:2023 | MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS,8-INPUT NAND GATE, TTL COMPATIBLE INPUTS MONOLITHIC SILICON |
| DSCC 89718F:2023 | MICROCIRCUIT, HYBRID, LINEAR, DIGITALTO-ANALOG CONVERTER WITH INPUT REGISTER |
| DSCC 01512C:2023 | MICROCIRCUIT, LINEAR, DUAL, HIGH SPEED, FET DRIVER, MONOLITHIC SILICON |
| DSCC 88562H:2022 | MICROCIRCUIT, LINEAR, FAST ±150 mA, POWER BUFFER, MONOLITHIC SILICON |
| DSCC 16210A:2023 | MICROCIRCUIT, LINEAR, OCTAL DIODE ARRAY PAIRS WITH REDUNDANCY, MONOLITHIC SILICON |
| DSCC 96801E:2023 | MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, HEX SCHMITT TRIGGER INVERTER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON |
| DSCC 14228C:2023 | MICROCIRCUIT, LINEAR, SINK/SOURCE DDR TERMINATION VOLTAGE REGULATOR,MONOLITHIC SILICON |
| DSCC 90765G:2023 | MICROCIRCUIT, LINEAR, LINE DRIVER, QUAD DIFFERENTIAL, MONOLITHIC SILICON |
| DSCC 97621D:2023 | MICROCIRCUIT, LINEAR, HIGH SPEED DIFFERENTIAL LINE DRIVER, MONOLITHIC SILICON |
| DSCC 87629J:2022 | MICROCIRCUIT, DIGITAL, FAST CMOS,NONINVERTING OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON |
| DSCC 94521D:2022 | MICROCIRCUIT, LINEAR, PICOAMPERE INPUT CURRENT, QUAD OPERATIONAL AMPLIFIER, MONOLITHIC SILICON |
| DSCC 87524E:2023 | MICROCIRCUIT, LINEAR, LINE RECEIVER, DUAL,DIFFERENTIAL, MONOLITHIC SILICON |
| DSCC 91618B:2023 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X 9 FIFO, MONOLITHIC SILICON |
| DSCC V62/22609:2022 | MICROCIRCUIT, LINEAR, SINGLE CHANNEL LOAD SWITCH, MONOLITHIC SILICON |
| DSCC 88730D:2022 | MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, QUADRUPLE, 2-INPUT POSITIVE OR DRIVERS, MONOLITHIC SILICON |
| DSCC 89680E:2023 | MICROCIRCUIT, LINEAR, OCTAL GENERAL INTERFACE BUS TRANSCEIVER, MONOLITHIC SILICON |
| DSCC 95729F:2023 | MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, RADIATION HARDENED, 4 TO 16 LINE DECODER/DEMULTIPLEXER, MONOLITHIC SILICON |
| DSCC 87616D:2023 | MICROCIRCUIT, LINEAR, QUAD DIFFERENTIAL LINE RECEIVER, MONOLITHIC SILICON |
| DSCC V62/22609A:2023 | MICROCIRCUIT, LINEAR, SINGLE CHANNEL LOAD SWITCH, MONOLITHIC SILICON |
| DSCC 90557E:2023 | MICROCIRCUIT, DIGITAL, CMOS, DUAL PRECISION MONOSTABLE MULTIVIBRATOR MONOLITHIC SILICON |
| DSCC 17202B:2022 | Microcircuit, Hybrid, Linear, Single Channel, DC-DC Converter |
| DSCC 92075D:2023 | MICROCIRCUIT, DIGITAL, ECL, 68030/40 ECL/TTL CLOCK DRIVER,MONOLITHIC SILICON |
| DSCC 86018F:2023 | MICROCIRCUIT, LINEAR, AC PLASMA DISPLAY DRIVERS, MONOLITHIC SILICON |
| DSCC 90748D:2023 | MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICO |
| DSCC 91549BG:2022 | MICROCIRCUIT, MEMORY, DIGITAL, CMOSEE PROGRAMMABLE READ ONLY MEMORY 256 X 16, MONOLITHIC SILICON |
| DSCC 84056H:2023 | MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, DUAL D-TYPE FLIP-FLOP WITH CLEAR AND PRESET, MONOLITHIC SILICON |
| DSCC 99560H:2022 | MICROCIRCUIT, DIGITAL-LINEAR, RADIATION HARDENED DUAL NON-INVERTING MOSFET DRIVER, MONOLITHIC SILICON |
| DSCC 89554D:2023 | MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, DUAL 4-INPUT POSITIVE-AND GATE, MONOLITHIC SILICON |
| DSCC 95525B:2023 | MICROCIRCUIT, DIGITAL, CMOS, QUAD ELECTRICALLY ERASABLE PROGRAMMABLE POTENTIOMETER, MONOLITHIC SILICON |
| DSCC 89525E:2023 | MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, BUS INTERFACE FLIP-FLOP, MONOLITHIC SILICON |
| DSCC 89702D:2023 | MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, DUAL J-K FLIP-FLOP WITH SET AND RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON |
| DSCC 92057B:2023 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS,1K X 18 PARALLEL FIFO, MONOLITHIC SILICON |
| DSCC 11214F:2023 | MICROCIRCUIT, HYBRID, LINEAR, DUAL CHANNEL, DC-DC CONVERTER |
| DSCC 97603D:2023 | MICROCIRCUIT, LINEAR, DUAL, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON |
| DSCC V62/18621:2022 | MICROCIRCUIT, DIGITAL, MICROCONTROLLER,MONOLITHIC SILICON |
| DSCC 91639E:2023 | MICROCIRCUIT, LINEAR, CMOS QUAD DIFFERENTIAL LINE DRIVER, MONOLITHIC SILICON |
| DSCC 87801E:2023 | MICROCIRCUIT, LINEAR, MICROPROCESSOR COMPATIBLE, 12-BIT D/A CONVERTER, MONLITHIC SILICON |
| DSCC 99549E:2023 | MICROCIRCUIT, HYBRID, LINEAR, 12 VOLT, SINGLE CHANNEL, DC/DC CONVERTER |
| DSCC 01517G:2022 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION-HARDENED, 3.3 V, 32K X 8-BIT PROM, MONOLITHIC SILICON |
| DSCC 77049L:2023 | MICROCIRCUIT, DIGITAL-LINEAR, TTL DUAL PERIPHERAL DRIVERS, MONOLITHIC SILICON |
| DSCC 15236C:2022 | MICROCIRCUIT, LINEAR, 30 V, LOW NOISE, RAIL TO RAIL INPUT/OUTPUT, LOW POWER QUAD OPERATIONAL AMPLIFIER, MONOLITHIC SILICON |
| DSCC 92218E:2023 | MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL EDGE TRIGGERED D FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON |
| DSCC 89705D:2023 | MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, QUAD 2-INPUT MULTIPLEXER WITH THREE-STATE NONINVERTING OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON |
| DSCC 11224E:2023 | MICROCIRCUIT, HYBRID, LINEAR, SINGLE CHANNEL, DC-DC CONVERTER |
| DSCC 89802D:2023 | MICROCIRCUIT, LINEAR, PRECISION, 10-VOLT VOLTAGE REFERENCE, MONOLITHIC SILICON |
| DSCC 81023P:2023 | MICROCIRCUIT, LINEAR, BI-FET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON |
| DSCC 17232B:2023 | MICROCIRCUIT, HYBRID, LINEAR, SINGLE CHANNEL, DC-DC CONVERTER |
| DSCC 99545E:2023 | MICROCIRCUIT, HYBRID, LINEAR, 6.3 VOLT,SINGLE CHANNEL, DC/DC CONVERTER |
| DSCC 06233D:2023 | MICROCIRCUIT, DIGITAL, RADIATION HARDENED, LOW VOLTAGE CMOS, MINIMUM SKEW ONE-TO-EIGHT CLOCK DRIVER, LVTTL COMPATIBLE INPUTS AND OUTPUTS, MONOLITHIC SILICON |
| IPC 5702 : 0 | GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL I 38535 : B (1) | INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR |
| MIL-PRF-31032-6 Revision B:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| MIL STD 750-2 : A | MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999 |
| MIL-PRF-31032-5 Revision B:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| MIL-PRF-3098 Revision L:2017 | CRYSTAL UNITS, QUARTZ, GENERAL SPECIFICATION FOR |
| IPC 4556 : 0 | SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| MIL-M-38510-301 Revision F:2004 | Microcircuits, Digital, Bipolar Low-Power Schottky TTL, Flip-Flops, Cascadable, Monolithic Silicon |
| BS EN 61751:1998 | Laser modules used for telecommunication. Reliability assessment |
| MIL-C-85521 Base Document:1983 | Concentrator, Oxygen, GGU-7/A |
| MIL-DTL-3933 Revision L:2014 | Attenuators, Fixed, Space Level, Non-Space Level General Specification for |
| MIL-HDBK-217 Revision F:1991 | RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
| MIL C 2212 : G | CONTROLLER, ELECTRIC MOTOR AC OR DC AND ASSOCIATED SWITCHING DEVICES |
| MIL-R-81876 Revision B:1988 | RECEIVER, TRANSMITTER RADIO SET AN/APX-100(V) |
| MIL S 19500/474 : D | SEMICONDUCTOR DEVICE, SILICON, MULTIPLE DIODE ARRAYS, TYPES 1N5768, 1N5772, 1N5774, 1N6100, 1N6101, IN6496, 1N6506, 1N6507, 1N6508, 1N6509, 1N6510, 1N6511, JAN, JANTX, JANTXV AND JANS |
| MIL-PRF-39010-15 Base Document:2013 | COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, CERAMIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY |
| MIL-R-63993 Revision A:1988 | RESISTOR NETWORK, THICK FILM, FIXED AND TRIMMABLE |
| SAE AS6171/4 | Techniques for Suspect/Counterfeit EEE Parts Detection by Delid/Decapsulation Physical Analysis Test Methods |
| DSCC 87075 : F | RESISTOR, FIXED, FILM, CHIP, FLANGE MOUNT, DOUBLE TAB, HIGH POWER 10 WATTS |
| DSCC 09023 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201 |
| DSCC 00003 : C#CAN | FILTER, EMI, HYBRID |
| BS EN 62005-9-1:2015 | Fibre optic interconnecting devices and passive components. Reliability Qualification of passive optical components |
| SAE ARP5764 | Aerospace Active Inceptor Systems for Aircraft Flight and Engine Controls |
| MIL-M-38510 Revision J:1991 | MICROCIRCUITS, SPECIFICATION FOR |
| DSCC 94010 : F | FILTER, EMI, HYBRID |
| MIL A 28875 : 0 | AMPLIFIER, RADIO FREQUENCY AND MICROWAVE, SOLID STATE, GENERAL SPECIFICATION FOR |
| MIL-STD-1389 Revision D:1989 | DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES |
| MIL-M-38510-346 Revision C:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Transparent and Octal D Type Latches, Cascadable, Monolithic Silicon |
| 13/30279449 DC : 0 | BS EN 62149-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 3: MODULATOR-INTEGRATED LASER DIODE TRANSMITTERS FOR 2.5-GBIT/S TO 40-GBIT/S FIBRE OPTIC TRANSMISSION SYSTEMS |
| MIL-E-48630 Base Document:1986 | ELECTRONIC ASSEMBLY, FOR MINES, M718A1/M741A1, SYSTEM |
| DSCC 85141 : C | DELAY LINE, THREE DELAY LINE UNITS, 14 PIN DIP COMPATIBLE, TTL INTERFACED |
| MIL-F-48267 Base Document:1973 | FUZE TIMER, MINE (INTEGRATED CIRCUIT) |
| DSCC SMD 5962-06232 : 0 | MICROCIRCUIT, DIGITAL, RADIATION HARDENED, SPACEWIRE PHYSICAL LAYER TRANSCEIVER, MONOLITHIC SILICON |
| MIL-I-48632 Base Document:1986 | INTEGRATED CIRCUIT, DIGITAL CMOS CONTROL AND TIMING BASE, MONOLITHIC, SILICON |
| 11/30250232 DC : 0 | BS EN 60749-26 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 26: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) |
| 02/203838 DC : DRAFT MAR 2002 | |
| MIL-P-24423 Base Document:1970 | PROPULSION AND AUXILIARY CONTROL CONSOLES AND ASSOCIATED CONTROL AND INSTRUMENTATION EQUIPMENT, NAVAL SHIPBOARD USE, BASIC DESIGN REQUIREMENTS |
| MIL-M-24791-2 Base Document:1995 | MODULE, FIBER OPTIC, RECEIVER, DIGITAL, 160 MBD, ASSOCIATED DETAIL SPECIFICATION FOR |
| MIL-M-38510-250 Base Document:1986 | MICROCIRCUITS, DIGITAL, CMOS, 512 X 9 BIT, FIRST IN - FIRST OUT DUAL PORT MEMORY (FIFO), MONOLITHIC SILICON |
| UNE-EN 62005-9-1:2016 | Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components |
| MIL M 38510/220 : A | MICROCIRCUIT DIGITAL 8192 BIT MOS ULTRAVIOLET ERASABLE PROGRAMMABLE READ ONLY MEMORY (EPROM) MONOLITHIC SILICON |
| MIL-M-38510-249 Revision A:1990 | MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 1,048,576/1-BIT DYNAMIC RANDOM ACCESS (DRAM), MONOLITHIC SILICON |
| MIL-STD-100 Revision G:1997 | ENGINEERING DRAWINGS |
| MIL-M-38510-313 Revision B:2003 | Microcircuits, Digital, Bipolar Low-Power Schottky TTl, Schmitt Trigger Positive Nand Gates and Inverters, Monolithic Silicon |
| MIL-E-63399 Revision B:1981 | ELECTRONICS-MCD ASSEMBLY FOR MINE, ANTITANK: HE, M75 |
| MIL-STD-976 Revision B:1988 | CERTIFICATION REQUIREMENTS FOR JAN MICROCIRCUITS |
| ASTM E 2311 : 2004 | Standard Practice for QCM Measurement of Spacecraft Molecular Contamination in Space |
| DSCC 91020 : F | FILTER, EMI, HYBRID |
| DOD-STD-35-37 Revision A:1978 | AUTOMATED ENGINEERING DOCUMENT PREPARATION SYSTEM INDUCTORS |
| MIL-I-85671 Base Document:1987 | INDICATOR, FREQUENCY CHANNEL ID-2121A/ARC, ID-2229A/ARC AND ID-2303/ARC |
| MIL-S-49433 Base Document:1984 | SURFACE ACOUSTIC WAVE DEVICES, GENERAL SPECIFICATION FOR |
| BS IEC 62396-1 : 2016 | PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 1: ACCOMMODATION OF ATMOSPHERIC RADIATION EFFECTS VIA SINGLE EVENT EFFECTS WITHIN AVIONICS ELECTRONIC EQUIPMENT |
| TR NWT 000468 : ISSUE 1 | RELIABILITY ASSURANCE PRACTICES FOR OPTOELECTRONIC DEVICES IN CENTRAL OFFICE APPLICATIONS |
| MIL-M-38510-106 Revision B:2005 | Microcircuits, Linear, Voltage Follower Operational Amplifiers, Monolithic Silicon |
| MIL-M-38510-321 Revision C:2003 | Microcircuits, Digital, Low-Power Schottky TTL, Buffers/Drivers, Open Collector Output, High Voltage, Monolithic Silicon |
| MIL-M-38510-657 Revision A:2006 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, BUFFER GATES, MONOLITHIC SILICON |
| MIL-M-38510-765 Revision A:2005 | Microcircuits, Digital, Advanced CMOS, Shift Registers, Monolithic Silicon, Positive Logic |
| MIL-M-38510-327 Revision B:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Counters, Monolithic Silicon |
| MIL-M-38510-302 Revision D:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, BUFFERS, MONOLITHIC SILICON |
| MIL-M-38510-50 Revision F:2004 | MICROCIRCUITS, DIGITAL, CMOS, NAND GATES, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-112 Revision B:2004 | Microcircuits, Linear, Voltage Comparators, Monolithic Silicon |
| MIL-M-38510-152 Revision C:2005 | Microcircuits, Digital, TTL, Data Decoders/Demultiplexers, Monolithic Silicon |
| MIL-M-38510-757 Revision C:2003 | Microcircuits, Digital, Advanced CMOS, Buffer Gates, Monolithic Silicon, Positive Logic |
| MIL-M-38510-71 Revision D:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, FLIP-FLOPS, CASCADABLE, MONOLITHIC SILICON |
| MIL-M-38510-156 Revision C:2005 | Microcircuits, Digital, TTL, Data Encoders, Monolithic Silicon |
| MIL-M-38510-311 Revision C:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, MAGNITUDE COMPARATORS, MONOLITHIC SILICON |
| MIL-M-38510-207 Revision E:2007 | MICROCIRCUIT, DIGITAL, 256-BIT, SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON |
| MIL-M-38510-335 Revision C:2004 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, Quadruple, 2 Input or Gates, Monolithic Silicon |
| MIL-S-19500-517 Base Document:1977 | SEMICONDUCTOR DEVICE, SILICON, DIODE ARRAY, TYPE 1N6101 JAN, JANTX, AND JANTXV |
| MIL-M-38510-472 Revision A:1983 | MICROCIRCUIT, DIGITAL, CMOS, 512 WORD X 8 BIT STATIC READ ONLY MEMORY (ROM) MONOLITHIC SILICON |
| MIL-M-38510-45 Revision B:1984 | MICROCIRCUITS, DIGITAL, TTL, LOW POWER, BISTABLE LATCHES, MONOLITHIC SILICON |
| MIL-M-38510-376 Base Document:1983 | MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, SHIFT REGISTERS, CASCADABLE, MONOLITHIC SILICON |
| MIL-M-38510-403 Revision A:1983 | MICROCIRCUITS, DIGITAL, NMOS, 2048 WORD X 8 BIT STATIC READ ONLY MEMORY (ROM) MONOLITHIC SILICON. |
| MIL-M-38510-485 Base Document:1989 | MICROCIRCUITS, DIGITAL, CMOS, SILICON GATE, MONOLITHIC, 8-BIT MICROPROCESSOR |
| MIL-M-38510-442 Revision A:1983 | MICROCIRCUITS, DIGITAL, SCHOTTKY, TTL, D-TYPE REGISTER, WITH THREE-STATE OUTPUT, MONOLITHIC SILICON |
| MIL-M-38510-244 Revision B:1984 | MICROCIRCUITS, DIGITAL, NMOS, 65,536 BIT, DYNAMIC RANDOM ACCESS MEMORY (DRAM), MONOLITHIC SILICON |
| MIL-M-38510-483 Revision A:1984 | MICROCIRCUITS, DIGITAL, N-CHANNEL, SILICON GATE MONOLITHIC COUNTER/TIMER UNIT |
| MIL-M-38510-481 Revision A:1984 | MICROCIRCUIT, DIGITAL, N-CHANNEL, SILICON GATE MONOLITHIC DUAL SERIAL INPUT/OUTPUT CONTROLLER. |
| MIL-M-38510-402 Revision A:1983 | MICROCIRCUITS, DIGITAL, MOS, 1024 BITS STATIC RANDOM ACCESS MEMORY (RAM), MONOLITHIC SILICON |
| MIL STD 1836 : NOTICE 1 | STANDARDIZATION & CONTROL PROGRAM FOR PARTS, MATERIALS & PROCESSES USED IN INTERCONTINENTAL BALLISTIC MISSILE WEAPON SYSTEMS |
| BS EN 45502-2-3:2010 | Active implantable medical devices Particular requirements for cochlear and auditory brainstem implant systems |
| MIL-D-60031 Revision A:1978 | DETONATOR, ELECTRIC M69 LOADING, ASSEMBLING AND PACKING |
| MIL-M-38510-508 Revision A:2006 | MICROCIRCUITS, MEMORY, DIGITAL, CMOS ONE-TIME PROGRAMMABLE ARRAY LOGIC, MONOLITHIC SILICON |
| MIL-A-63117 Base Document:1977 | AMPLIFIER, HYBRID, RADIO FREQUENCY FOR XM122 FIRING DEVICE RECEIVER |
| 07/30170374 DC : DRAFT AUG 2007 | BS EN 61751-2 - LASER MODULES USED FOR TELECOMMUNICATIONS - RELIABILITY ASSESSMENT - PART 2: TECHNICAL REPORT ON LASER MODULE DEGRADATION |
| MIL-M-38510-401 Revision A:1983 | MICROCIRCUITS, DIGITAL, N-CHANNEL, SILICON-GATE, MONOLITHIC PERIPHERAL INTERFACE ADAPTER |
| BS IEC 60300-3.7 : 1999 | DEPENDABILITY MANAGEMENT - APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE |
| MIL-M-63323 Revision A:1981 | MICROCIRCUIT, LINEAR, VOLTAGE COMPARATORS |
| MIL-M-38510-332 Revision C:2003 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, Octal Buffers, Monolithic Silicon |
| MIL-M-38510-15 Revision B:2005 | Microcircuits, Digital, TTL, Bistable Latches, Monolithic Silicon |
| MIL-HDBK-817 Base Document:1994 | SYSTEM DEVELOPMENT RADIATION HARDNESS ASSURANCE |
| MIL-M-38510-656 Revision A:2005 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, FLIP-FLOPS, MONOLITHIC SILICON |
| MIL-M-38510-306 Revision E:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Shift Registers, Cascadable, Monolithic Silicon |
| MIL-M-38510-190 Revision D:2005 | MICROCIRCUITS, LINEAR, CMOS/ANALOG MULTIPLEXERS/DEMULTIPLEXERS WITH OVERVOLTAGE PROTECTION, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL R 83726/20 : C (2) | RELAY, SOLID STATE, TIME DELAY (ON OPERATE) TYPE 1, CLASS C, SPST, 250 MILLIAMPERES, FIXED TIME, .05 TO 500 SECONDS |
| MIL-F-24713 Base Document:1989 | FREQUENCY CHANGER, STATIC, AIR COOLED (NAVAL SHIPBOARD) |
| SAE ARP6001 | Aerospace - Passive Side Stick Unit General Requirements for Fly by Wire Transport and Business |
| MIL-A-85652 Base Document:1984 | AMPLIFIER-MIXER AM-7157/DKT-59 |
| MIL-M-38510-43 Revision B:1984 | MICROCIRCUIT, DIGITAL, TTL, LOW POWER, PRIORITY ENCODERS, MONOLITHIC SILICON |
| MIL-PRF-55182 Revision J:2017 | RESISTOR, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, AND SPACE LEVEL, GENERAL SPECIFICATION FOR |
| MIL-M-38510-651 Revision B:2005 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, NOR GATES, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-22 Revision D:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, HIGH-SPEED TTL, FLIP-FLOPS, MONOLITHIC SILICON |
| MIL-E-11991 Revision E:1983 | ELECTRONIC, ELECTRICAL, AND ELECTRO-MECHANICAL EQUIPMENT, GUIDED MISSILE AND ASSOCIATED WEAPON SYSTEMS, GENERAL SPECIFICATION FOR |
| MIL-M-38510-23 Revision D:2003 | Microcircuits, Digital, TTL, High Speed, Nand Gates Monolithic Silicon |
| MIL-M-38510-352 Revision A:2004 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, Nand Buffers, Monolithic Silicon |
| MIL-M-38510-305 Revision C:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, OR GATES, MONOLITHIC SILICON |
| MIL M 64020D : 1989 | MICROCIRCUIT, AMPLIFIER, BIPOLAR, HIGH FREQUENCY, FRONT END |
| SAE AS 6171/10 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS |
| CSA 6.19-17 | Residential carbon monoxide alarming devices |
| I.S. EN 16602-70-08:2015 | SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS |
| DSCC SMD 5962-90548 : 0 | MICROCIRCUIT, DIGITAL, CMOS, SCSI BUS CONTROLLER, MONOLITHIC SILICON |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 62149-6:2003 | Fibre optic active components and devices - Performance standards - Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers |
| IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
| ASTM D 2442 : 1975 : R2001 | Standard Specification for Alumina Ceramics for Electrical and Electronic Applications |
| ASTM F 97 : 1972 : R1997 : EDT 1 | Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration |
| ASTM F 1262M : 2014 : REDLINE | Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric) |
| IEC 60749-12:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
| IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
| I.S. EN 61751:1999 | LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT |
| DSCC 07004 : C | FILTER, EMI, HYBRID, 28 V DC |
| DSCC 98027 : C | FILTER, EMI, HYBRID |
| MIL-HDBK-344 Revision A:1993 | ENVIRONMENTAL STRESS SCREENING (ESS) OF ELECTRONIC EQUIPMENT |
| MIL-M-38510-128 Revision A:2004 | Microcircuits, Linear, Programmable Voltage References, Monolithic Silicon |
| MIL-M-38510-312 Revision C:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, 4-BIT BINARY FULL ADDERS WITH FAST CARRY, MONOLITHIC SILICON |
| MIL-M-38510-502 Revision A:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR FIELD PROGRAMMABLE LOGIC ARRAY (FPLA) 16 X 48 X 8, MONOLITHIC SILICON |
| DSCC 13011 : A | FILTER, EMI, HYBRID, 28 V DC |
| DSCC 86001 : F | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS, 1 AMPERE, 60 V DC MAXIMUM |
| 09/30207352 DC : 0 | BS EN 62149-4 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
| ISO 14708-7:2013 | Implants for surgery Active implantable medical devices Part 7: Particular requirements for cochlear implant systems |
| MIL-M-38510-32 Revision A:1983 | MICROCIRCUIT, DIGITAL, DTL, MONOSTABLE MULTIVIBRATOR, MONOLITHIC SILICON |
| DSCC 06024 : B | FILTER, EMI, HYBRID, 28V DC |
| 15/30323391 DC : 0 | BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| SAE AIR5271 | A Guideline for Application of High-Density Fiber Optic Interconnects to Aerospace Platforms |
| DEFSTAN 00-38/1(1991) : INTERIM | GUIDELINES FOR THE EVALUATION OF MICROPROCESSORS FOR AVIONICS APPLICATIONS |
| MIL-PRF-32560-5 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED, ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-PRF-32560-4 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, UNSHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-M-38510-124 Revision D:2004 | Microcircuits, Linear, Precision Voltage References, Monolithic Silicon |
| 13/30277892 DC : 0 | BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| MIL-PRF-55310-29 Revision C:2011 | OSCILLATOR, CRYSTAL CONTROLLED, TYPE 1 (CRYSTAL OSCILLATOR (XO)), 0.2 MHZ THROUGH 85 MHZ, HERMETIC SEAL, SQUARE WAVE, HCMOS |
| MIL-M-38510-46 Revision B:1984 | MICROCIRCUITS, DIGITAL, TTL, LOW POWER, DATA SELECTORS MULTIPLEXERS, MONOLITHIC SILICON |
| MIL-M-38510-304 Revision C:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, AND-OR-INVERT GATES, MONOLITHIC SILICON |
| NASA MSFC STD 3619 : 2012 | MSFC COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION REQUIREMENTS FOR SPACE FLIGHT AND CRITICAL GROUND SUPPORT HARDWARE |
| MIL-M-38510-490 Revision A:1986 | MICROCIRCUIT, DIGITAL, N-CHANNEL, SILICON GATE, MONOLITHIC, 8 BIT MICROCOMPUTER |
| MIL-M-38510-173 Revision B:1984 | MICROCIRCUITS, DIGITAL, CMOS, DECODERS, ENCODER, AND DECODERS/DEMULTIPLEXERS MONOLITHIC SILICON, POSITIVE LOGIC |
| CEI EN 61751 : 1999 | LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT |
| MIL-M-38510-33 Revision A:1983 | MICROCIRCUIT, DIGITAL, FLIP FLOPS, MONOLITHIC SILICON |
| RF.AERO 90010 : 1990 | INFANT FAILURES ELIMINATION - STRESS SCREENING |
| MIL-M-38510-58 Revision D:2004 | MICROCIRCUITS, DIGITAL, CMOS, SWITCHES, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-117 Revision C:2005 | MICROCIRCUITS, LINEAR, ADJUSTABLE, POSITIVE, VOLTAGE REGULATORS, MONOLITHIC SILICON |
| MIL-M-38510-59 Revision D:2006 | MICROCIRCUITS, DIGITAL, CMOS, DECODER, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-131 Revision A:2003 | Microcircuits, Linear, Low Noise Operational Amplifiers, Monolithic Silicon |
| MIL-M-38510-53 Revision F:2004 | MICROCIRCUITS, DIGITAL, CMOS, COMPLIMENTARY PAIR PLUS INVERTER, AND-OR-SELECT EXCLUSIVE OR GATES, EXPANDABLE 8-INPUT GATE MONOLITHIC SILICON |
| MIL-M-38510-8 Revision F:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, BUFFERS/DRIVERS OPEN COLLECTOR OUTPUT, HIGH VOLTAGE, MONOLITHIC SILICON |
| MIL-M-38510-361 Revision B:2004 | Microcircuits, Digital, Bipolar, Low Power Schottky TTL, Registers, Cascadable, Monolithic Silicon |
| DSCC 11019 : 0 | INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805 |
| DSCC 11017 : 0 | INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0402 |
| MIL-M-38510-325 Revision D:2003 | Microcircuits, Digital, Bipolar, Low-Power, Schottky TTL, Flip-Flops, Cascadable, Monolithic Silicon |
| MIL-M-38510-10 Revision D:2005 | Microcircuits, Digital, Bipolar, TTL, Decoders Monolithic Silicon |
| MIL-M-38510-108 Revision A:2003 | Microcircuits, Linear, Transistor Arrays, Monolithic Silicon |
| MIL-M-38510-21 Revision F:2006 | MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, LOW POWER, FLIP-FLOPS, MONOLITHIC SILICON |
| 07/30167056 DC : 0 | BS EN 62149-2 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES. PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES |
| MIL M 38510/274 : 0 | MICROCIRCUIT, MEMORY, DIGITAL, 65, 536 BIT, CMOS, ULTRAVIOLET ERASABLE PROGRAMMABLE READ-ONLY MEMORY (UVEPROM) MONOLITHIC SILICON |
| MIL-M-38510-103 Revision H:2005 | MICROCIRCUITS, LINEAR, VOLTAGE COMPARATORS, MONOLITHIC SILICON |
| MIL-C-85518 Base Document:1984 | COMPUTER SET, STANDARD AIRBORNE AN/AYK-14(V) GENERAL SPECIFICATION FOR |
| MIL-M-38510-328 Revision C:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Bus Transceivers with Three State Outputs, Monolithic Silicon |
| NASA HDBK 4002 : 2011 | MITIGATING IN-SPACE CHARGING EFFECTS - A GUIDELINE |
| MIL-PRF-49464 Revision C:2009 | CAPACITOR, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| GR 1312 CORE : ISSUE 3 | GENERIC REQUIREMENTS FOR OPTICAL FIBER AMPLIFIERS AND PROPRIETARY DENSE WAVELENGTH-DIVISION MULTIPLEXED SYSTEMS |
| MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
| MIL-HDBK-338 Revision B:1998 | ELECTRONIC RELIABILITY DESIGN HANDBOOK |
| DSCC 06004 : B | FILTER, EMI, HYBRID |
| MIL-S-48290 Base Document:1974 | SWITCH, ANTI-DISTURBANCE FOR M56 MINE |
| DOD HDBK 344 : A | ENVIRONMENTAL STRESS SCREENING (ESS) OF ELECTRONIC EQUIPMENT |
| MIL-PRF-83446 Revision D:2015 | COILS, RADIO-FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR |
| MIL R 28750 : C SUPP 1 | RELAYS, SOLID STATE, SEALED, OPTICALLY ISOLATED, ZERO VOLTAGE TURN ON, 25 AMPERES, 250 VOLTS MAXIMUM, 45-440 HZ, POWER SWITCHING |
| MIL-M-38510-51 Revision F:2004 | MICROCIRCUITS, DIGITAL, CMOS, FLIP-FLOPS AND LATCHES, MONOLITHIC SILICON |
| MIL-M-38510-76 Revision C:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR SCHOTTKY TTL, CASCADABLE, SHIFT REGISTERS, MONOLITHIC SILICON |
| MIL-M-38510-350 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Quad 2-Port Registers, Cascadable, Monolithic Silicon |
| MIL-M-38510-14 Revision E:2005 | Microcircuits, Digital, TTL, Data Selectors/Multiplexers, Monolithic Silicon |
| MIL-M-38510-340 Revision D:2003 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, and Gates, Monolithic Silicon |
| MIL-HDBK-780 Revision D:2004 | STANDARD MICROCIRCUIT DRAWINGS |
| MIL-M-38510-337 Revision B:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Decoders, Monolithic Silicon |
| MIL-M-38510-119 Revision B:2004 | Microcircuits, Linear, Low Power, Low Noise, BI-FET Operational Amplifiers, Monolithic Silicon |
| MIL-M-38510-12 Revision J:2005 | Microcircuits, Digital, Bipolar, TTL, Monostable Multivibrators, Monolithic Silicon |
| MIL-M-38510-27 Revision B:2008 | Microcircuit, Digital, TTL, Low Power, Multiple NOR Gates, Monolithic Silicon |
| MIL-M-38510-129 Revision B:2004 | MICROCIRCUITS, MONOLITHIC SILICON INTERFACE, DUAL PERIPHERAL DRIVERS |
| MIL-M-38510-101 Revision K:2005 | MICROCIRCUITS, LINEAR, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON |
| MIL-M-38510-339 Revision E:2011 | MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, DATA SELECTORS/MULTIPLEXERS WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON |
| MIL S 0081619 : C | SWITCH, SOLID STATE TRANSDUCER, (ANALOG AND DIGITAL) GENERAL SPECIFICATION FOR |
| MIL-M-38510-17 Revision B:2005 | Microcircuits, Digital, TTL, Flip-Flops, Monolithic Silicon |
| MIL-M-38510-505 Revision C:2006 | MICROCIRCUITS, DIGITAL, BIPOLAR PROGRAMMABLE LOGIC, MONOLITHIC SILICON |
| MIL-M-38510-383 Revision B:2004 | MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, OCTAL BUFFER GATES WITH THREE STATE OUTPUTS, MONOLITHIC SILICON |
| MIL-M-38510-300 Revision E:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, NAND GATES, MONOLITHIC SILICON |
| MIL-C-85248 Revision A:1984 | CAMERA, STILL PICTURE, PANORAMIC, KA-99A |
| MIL-M-38510-755 Revision B:2003 | Microcircuits, Digital, Advanced CMOS, Transceivers, Monolithic Silicon, Positive Logic |
| MIL-M-38510-150 Revision D:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, MAGNITUDE COMPARATORS, MONOLITHIC SILICON |
| MIL-PRF-39010-17 Base Document:2013 | Coils, Radio Frequency, Shielded, Molded, Fixed, Surface Mount Established Reliability & Non-Established Reliability |
| MIL-HDBK-280 Base Document:1985 | NEUTRON HARDNESS ASSURANCE GUIDELINES FOR SEMICONDUCTOR DEVICES AND MICROCIRCUITS |
| MIL D 83532 : A (3) SUPP 1 | DELAY LINES, ACTIVE |
| MIL BULL 103 : AC NOTICE 1 | LIST OF STANDARD MICROCIRCUIT DRAWINGS |
| MIL-M-38510-41 Revision C:1983 | MICROCIRCUIT, DIGITAL, TTL, LOW POWER, & OR INVERT GATES, MONOLITHIC SILICON |
| MIL-M-38510-202 Revision B:1984 | MICROCIRCUITS, DIGITAL, 1024 BIT BIPOLAR PROGRAMMABLE READ-ONLY MEMORY (P-ROM), MONOLITHIC SILICON |
| MIL-M-38510-465 Revision A:1986 | MICROCIRCUITS, DIGITAL, INTEGRATED INJECTION LOGIC (I[2]L), PARALLEL 16-BIT MICROPROCESSOR, MONOLITHIC SILICON |
| MIL-M-38510-138 Base Document:1987 | MICROCIRCUIT, LINEAR, VOLTAGE-TO-FREQUENCY CONVERTERS, MONOLITHIC SILICON |
| MIL-A-23547 Revision E:1977 | ANTENNA COUPLER, CU-9370/UR |
| MIL-M-38510-113 Revision C:2011 | MICROCIRCUITS, LINEAR, 8 BIT, DIGITAL-TO-ANALOG CONVERTERS, MONOLITHIC SILICON |
| MIL-M-38510-122 Revision C:2004 | Microcircuits, Linear, High Slew Rate Operational Amplifiers, Monolithic Silicon |
| MIL-M-38510-319 Revision C:2003 | Microcircuits, Digital, Low-Power Schottky TTL, 4 by 4 Register File, Cascadable, Monolithic Silicon |
| MIL-M-38510-329 Revision B:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Parity Checker, Monolithic Silicon |
| MIL-M-38510-151 Revision B:2005 | Microcircuits, Digital, Bipolar, TTL, Schmitt-Trigger Nand Gates, Monolithic Silicon |
| MIL-M-38510-148 Revision B:2004 | Microcircuits, Linear, Adjustable, Precision Voltage Reference, Shunt Regulator, Monolithic Silicon |
| MIL-M-38510-4 Revision D:2004 | Microcircuits, Digital TTL, Multiple Nor Gates, Monolithic Silicon |
| MIL-M-38510-338 Revision B:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Arithmetic Logic Units,Monolithic Silicon |
| MIL-M-38510-125 Revision B:2005 | MICROCIRCUITS, LINEAR, SAMPLE AND HOLD CIRCUITS, MONOLITHIC SILICON |
| MIL-M-38510-380 Revision B:2004 | Microcircuits, Digital, Bipolar, Advanced Low Power Schottky TTL, Binary Counters, Cascadable, Monolithic Silicon |
| MIL-E-85082 Revision A:1992 | ENCODERS, SHAFT ANGLE TO DIGITAL, GENERAL SPECIFICATION FOR |
| DSCC 09026 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805 |
| MIL-M-38510-344 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Decade Counters, Monolithic Silicon |
| MIL-PRF-39010-20 Base Document:2013 | Coils, Radio Frequency, Molded, Iron Core, Fixed, Surface Mount Established Reliability & Non-Established Reliability |
| MIL-M-38510-159 Revision B:1986 | MICROCIRCUITS, DIGITAL, TTL, SHIFT REGISTERS, MONOLITHIC SILICON |
| MIL-M-38510-212 Base Document:1987 | MICROCIRCUITS, DIGITAL, 35,536 BIT SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON |
| MIL-M-38510-471 Revision A:1983 | MICROCIRCUITS, DIGITAL, CMOS SOS 1024 BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| TR NWT 000870 : ISSUE 1 | ELECTROSTATIC DISCHARGE CONTROL IN THE MANUFACTURE OF TELECOMMUNICATIONS EQUIPMENT |
| SAE ARP6328 | Guideline for Development of Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition Systems |
| IEC TS 62396-1:2006 | Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
| BS EN 16602-60:2015 | Space product assurance. Electrical, electronic and electromechanical (EEE) components |
| I.S. EN 62149-3:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 3: MODULATOR-INTEGRATED LASER DIODE TRANSMITTERS FOR 2,5-GBIT/S TO 40-GBIT/S FIBRE OPTIC TRANSMISSION SYSTEMS |
| DSCC SMD 5962-92080 : A | MICROCIRCUIT, LINEAR, BUS TRANSCEIVER, DIFFERENTIAL, RS485, MONOLITHIC SILICON |
| PD ES 59008-2:1999 | Data requirements for semiconductor die Vocabulary |
| I.S. EN 62005-9-1:2015 | FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - RELIABILITY - PART 9-1: QUALIFICATION OF PASSIVE OPTICAL COMPONENTS |
| SAE AS6171/6 | Techniques for Suspect/Counterfeit EEE Parts Detection by Acoustic Microscopy (AM) Test Methods |
| MIL-PRF-32560 Base Document:2016 | COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-32560-1 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, CONFORMAL COATED, ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-PRF-32560-6 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, OPEN CONSTRUCTION ESTABLISHED RELIABILITY, SURFACE MOUNT, 0603 SIZE |
| ASTM F 1467 : 2011-10 | GUIDE FOR USE OF AN X-RAY TESTER ([APPROXIMATE] 10 KEV PHOTONS) IN IONIZING RADIATION EFFECTS TESTING OF SEMICONDUCTOR DEVICES AND MICROCIRCUITS |
| IEC PAS 62239:2001 | Electronic component management plans |
| ASTM E 1161 : 2009 : R2014 | Standard Practice for Radiologic Examination of Semiconductors and Electronic Components |
| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| I.S. EN 62149-6:2003 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 6: 650-NM 250-MBIT/S PLASTIC OPTICAL FIBRE TRANSCEIVERS |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| IEC PAS 62686-1:2011 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| EN 62149-3:2014 | Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems |
| NASA GSFC STD 6001 : 2016 | CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| EN 16602-60:2015 | Space product assurance - Electrical, electronic and electromechanical (EEE) components |
| EN 16602-60-05:2014 | Space product assurance - Generic procurement requirements for hybrids |
| SAE AIR 1277 : 2005 | COOLING OF MILITARY AVIONIC EQUIPMENT |
| MIL-HDBK-1331 Revision A:2003 | PARAMETERS TO BE CONTROLLED FOR THE SPECIFICATION OF MICROCIRCUITS |
| DSCC 94028 : E | FILTER, EMI AND TRANSIENT SUPPRESSION, HYBRID |
| DSCC SMD 5962-91568 : 0 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ONE-TIME PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON |
| BS EN 16602-60-05:2014 | Space product assurance. Generic procurement requirements for hybrids |
| NASA MSFC SPEC 1198 : 1960 | SCREENING REQUIREMENTS FOR NONSTANDARD ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS |
| PD IEC/TS 62239-2:2017 | Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan |
| ARINC 628-5 : 2013 | CABIN EQUIPMENT INTERFACES (CEI) - PART 5: CABIN ELECTRICAL EQUIPMENT AND WIRING INSTALLATION GUIDELINES |
| MIL-M-38510-307 Revision D:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, DECODERS, MONOLITHIC SILICON |
| MIL-PRF-39010-16 Base Document:2013 | COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, FERRITE CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY |
| MIL-M-38510-142 Base Document:1988 | MICROCIRCUITS, LINEAR, HIGH SPEED TRACK AND HOLD AMPLIFIER, HYBRID, SILICON |
| MIL-M-38510-30 Revision C:2008 | Microcircuits, Digital, DTL, NAND Gates Monolithic Silicon |
| MIL-HDBK-816 Base Document:1994 | Guidelines for Developing Radiation Hardness Assurance Device Specifications |
| MIL R 5757 : K | RELAYS, ELECTROMAGNETIC, GENERAL SPECIFICATION FOR |
| MIL M 38510/237 : B | MICROCIRCUIT DIGITAL MOS 4096 BIT STATIC RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| MIL-M-38510-372 Revision B:2004 | Microcircuits, Digital, Bipolar, Advanced Low Power Schottky TTL, Flip-Flops Cascadable, Monolithic Silicon |
| MIL R 55342 : C | RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL M 38510/275 : 0 | MICROCIRCUITS, MEMORY, DIGITAL 65,536 BIT, CMOS, ULTRAVIOLET ERASABLE, PROGRAMMABLE, READ-ONLY MEMORY (UVEPROM), MONOLITHIC SILICON |
| MIL-M-38510-136 Revision A:1995 | MICROCIRCUITS, LINEAR, PRECISION VOLTAGE REFERENCES, MONOLITHIC SILICON |
| DSCC 87035 : C | DELAY LINE, ACTIVE, TRIPLE, 14-PIN DIP COMPATIBLE, LOW POWER SCHOTTKY |
| MIL-M-38510-70 Revision C:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, NAND GATES, MONOLITHIC SILICON |
| MIL-M-38510-375 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Low Power-Schottky TTL, or Gates, Monolithic Silicon |
| MIL-M-38510-62 Revision B:2005 | MICROCIRCUIT, DIGITAL, ECL, AND/NAND GATES, MONOLITHIC SILICON |
| MIL-M-38510-314 Revision C:2003 | Microcircuits, Digital, Low-Power Schottky, TTL, Monostable Multivibrators, Monolithic Silicon |
| MIL-M-48646 Base Document:1986 | MICROCIRCUIT, DIGITAL, SCO/DLA MULTICHIP CMOS |
| MIL-M-63324 Revision A:1981 | MICROCIRCUIT, DIGITAL, CMDS, SPECIAL PURPOSE NOR GATE |
| MIL-S-63256 Revision C:1987 | SAFETY AND ARMING DEVICE, GUIDED MISSILE: M143 (M143E1) LOGIC CIRCUIT HYBRID FOR |
| MIL-PRF-39010-21 Base Document:2013 | Coils, Radio Frequency, Molded, Ferrite Core, Fixed, Surface Mount Established Reliability & Non-Established Reliability |
| UNI CEI EN 45502-2-3 : 2010 | ACTIVE IMPLANTABLE MEDICAL DEVICES - PART 2-3: PARTICULAR REQUIREMENTS FOR COCHLEAR AND AUDITORY BRAINSTEM IMPLANT SYSTEMS |
| MIL-M-38510-460 Revision A:1984 | MICROCIRCUIT, DIGITAL, INTEGRATED INJECTION LOGIC (12L), PARALLEL 16 BIT MICROPROCESSOR, MONOLITHIC SILICON |
| MIL-HDBK-339 Base Document:1984 | CUSTOM LARGE SCALE INTEGRATED CIRCUIT DEVELOPMENT & ACQUISITION FOR SPACE VEHICLES |
| MIL-M-38510-177 Revision B:1984 | MICROCIRCUIT, DIGITAL, CMOS, SCHMIDTT TRIGGERS, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| MIL-PRF-83446-41 Base Document:2015 | COILS, RADIO FREQUENCY, CHIP, FIXED, UNSHIELDED, MOLDED, SURFACE MOUNT |
| MIL-M-38510-470 Revision A:1983 | MICROCIRCUITS, DIGITAL, CMOS MONOLITHIC 8-BIT MICROPROCESSOR (FIXED INSTRUCTION) |
| MIL-PRF-32560-3 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, UNSHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
| MIL-R-28894 Base Document:1986 | RELAY, HYBRID OR SOLID STATE, SENSORS, ESTABLISHED RELIABILITY GENERAL SPECIFICATION FOR |
| MIL-M-38510-24 Revision B:2005 | Microcircuits, Digital, TTL, Nand Buffers, High Speed, Monolithic Silicon |
| MIL-M-38510-140 Revision A:2004 | Microcircuits, Linear, Monolithic and Hybrid Silicon, Microprocessor Compatible, 12 Bit Analog-to-Digital Converters |
| MIL-M-38510-171 Revision C:2004 | Microcircuits, Digital, CMOS, or Gates, Monolithic Silicon, Positive Logic |
| MIL-M-38510-245 Revision B:2006 | Microcircuits, Digital, CMOS, 4096 Bit, Static Random Access Memory (SRAM), Bulk Silicon and Silicon on Sapphire |
| MIL-M-38510-133 Revision B:2004 | Microcircuits, Linear, 10-BIT Digital-To-Analog Converter, Monolithic Silicon |
| MIL-M-38510-320 Revision D:2003 | Microcircuits, Digital, Bipolar Low-Power Schottky TTL. Counters, Cascadable, Monolithic Silicon |
| MIL-M-38510-371 Revision B:2004 | Microcircuits, Digital, Bipolar, Advanced, Low-Power Schottky TTL, Flip-Flops, Monolithic Silicon |
| MIL-M-38510-336 Revision B:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Shift Registers, Cascadable, Monolithic Silicon |
| MIL-M-38510-82 Revision C:2005 | Microcircuits, Digital, Bipolar, Schottky TTL, Magnitude Comparators, Monolithic Silicon |
| MIL-M-38510-351 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Hex Bus Drivers with 3-State Outputs, Monolithic Silicon |
| MIL-R-83726-19 Revision H:2016 | RELAYS, HYBRID, TIME DELAY (ON OPERATE), TRACK MOUNTED, TYPE 1, CLASS B, 10 AMPERES, 2PDT, HERMETICALLY SEALED, FIXED TIME, 0.1 TO 300 SECONDS |
| MIL-C-49468 Base Document:1990 | CRYSTAL UNITS, QUARTZ, PRECISION, GENERAL SPECIFICATION FOR |
| CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| MIL-M-38510-381 Base Document:1984 | MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED LOW-POWER SCHOTTKY, TTL, CASCADABLE, DECADE COUNTERS, MONOLITHIC SILICON |
| MIL-N-63400 Base Document:1981 | NETWORKS CAPACITOR-RESISTOR |
| MIL-M-38510-161 Revision A:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, COMMON OR GATES, MONOLITHIC SILICON |
| JSSG-2009 Revision A:2013 | Air Vehicle Subsystems |
| MIL-M-38510-40 Revision B:2005 | MICROCIRCUITS, DIGITAL, TTL, HIGH SPEED, AND-OR-INVERT GATES, MONOLITHIC SILICON |
| MIL-PRF-27-372 Base Document:2012 | Transformers and Inductors (Audio, Power and High-Power Pulse), Inductor, Surface Mount, Leadless |
| MIL-M-38510-139 Revision C:2004 | MICROCIRCUITS, LINEAR, INTERNALLY TRIMMED ANALOG MULTIPLIER, HYBRID AND MONOLITHIC SILICON |
| MIL-M-38510-111 Revision A:2003 | Microcircuits, Analog Switch with Driver, Monolithic and Multi-Chip Silicon |
| MIL-M-38510-310 Revision D:2002 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, AND GATES, MONOLITHIC SILICON |
| MIL-M-38510-315 Revision D:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, COUNTERS, CASCADABLE, MONOLITHIC SILICON |
| MIL-M-38510-762 Revision B:2005 | MICROCIRCUITS, DIGITAL, ADVANCED CMOS, MULTIPLEXERS, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-175 Revision C:2004 | MICROCIRCUITS, DIGITAL, CMOS, POSITIVE LOGIC, FLIP-FLOPS AND MONOSTABLE MULTIVIBRATOR, MONOLITHIC SILICON |
| MIL-M-38510-109 Revision B:2004 | Microcircuits, Linear, Precision Timers, Monolithic Silicon |
| MIL-M-38510-208 Revision F:2013 | Microcircuit, Digital, 4096-Bit Schottky, Bipolar, Programmable Read-Only Memory (PROM), Monolithic Silicon |
| MIL-M-38510-377 Revision A:2004 | Microcircuits, Digital, Bipolar, Low Power Schottky TTL, Decoders, Monolithic Silicon |
| MIL-M-38510-107 Revision D:2004 | Microcircuits, Linear, Positive, Voltage Regulators, Monolithic Silicon |
| DSCC 09025 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603 |
| MIL-R-63319 Revision A:1981 | RESISTOR NETWORK, FIXED, FILM (EXTERNALLY TRIMMABLE) |
| MIL-R-83516 Revision C:2017 | Relays, Reed, Dry, General Specification for (No S/S Document) |
| MIL-M-38510-440 Revision C:1986 | MICROCIRCUITS, DIGITAL, FOUR BIT MICROPROCESSOR SLICE MONOLITHIC SILICON |
| DSCC 87042 : E | RELAY, SOLID STATE, HERMETICALLY SEALED, ISOLATED, BI-DIRECTIONAL, 0.95 A, 60 V DC, ANALOG SIGNAL SWITCHING, SPST (N.O.), CMOS AND TTL CONTROL INPUTS |
| MIL-N-49098 Revision A:1990 | NAVIGATIONAL SET, DOPPLER AN/ASN-128()(XE-2) |
| MIL I 83452 : LATEST | INDICATOR, TAPE TYPE, GENERAL SPECIFICATION FOR |
| DSCC 87034 : D | RELAYS, SOLID STATE, OPTICALLY ISOLATED, HERMETICALLY SEALED, 240 MILLIAMPERES, +/-85 V DC BIDIRECTIONAL, ANALOG SIGNAL SWITCHING SPST (N.O.), CMOS AND TTL CONTROL INPUTS, FAST SWITCHING |
| MIL-PRF-28750 Revision J:2017 | RELAYS, SOLID STATE, GENERAL SPECIFICATION FOR |
| MIL-R-83520 Base Document:1983 | RELAYS, ELECTROMECHANICAL, GENERAL PURPOSE, NON-HERMETICALLY SEALED, PLASTIC ENCLOSURE (UST COVER) |
| MIL R 83536 : SUPP 1 | RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY |
| MIL-PRF-19500-486 Revision J:2015 | COUPLER, OPTOELECTRONIC, SEMICONDUCTOR DEVICE, SOLID STATE, TYPES 4N22, 4N23, AND 4N24, JAN, JANTX, JANTXV, AND JANS |
| MIL-PRF-19500-474 Revision J:2016 | Semiconductor Devices, Unitized, Multiple Diode Arrays, Silicon Types 1N5768, 1N5770, 1N5772, 1N5774, 1N6100, 1N6101, 1N6496, 1N6506, 1N6507, 1N6508, 1N6509, 1N6510, and 1N6511 JAN, JANTX, JANTXV, and JANS |
| MIL-I-48634 Base Document:1986 | INTEGRATED CIRCUIT, DIGITAL, CMOS LOGIC ARRAY MONOLITHIC, SILICON |
| MIL-HDBK-814 Base Document:1994 | IONIZING DOSE AND NEUTRON HARDNESS ASSURANCE GUIDELINES FOR MICROCIRCUITS AND SEMICONDUCTOR DEVICES |
| MIL C 83446 : B | COIL, RADIO FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR |
| MIL-M-38510-506 Revision A:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON |
| MIL-M-38510-74 Revision C:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, AND-OR-INVERT GATES, MONOLITHIC SILICON |
| MIL-M-38510-174 Revision B:2004 | MICROCIRCUITS, DIGITAL, CMOS, INVERTER, NAND BUFFER DRIVER, STROBED HEX INVERTER/BUFFER, VOLTAGE LEVEL SHIFTER MONOLITHIC, SILICON, POSITIVE LOGIC |
| MIL-M-38510-343 Revision B:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, Binary Counters, Monolithic Silicon |
| MIL-M-38510-75 Revision C:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, EXCLUSIVE OR GATES, MONOLITHIC SILICON |
| DSCC 88062 : G | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 2.1 AMPERES, 60 V DC, ANALOG SIGNAL SWITCHING, SPST (N.O.), TTL/CMOS CONTROL INPUTS, SHORT CIRCUIT PROTECTED, OUTPUT SWITCH STATUS |
| MIL-M-38510-104 Revision C:2003 | Microcircuits, Linear, Line Drivers and Receivers, Monolithic Silicon |
| MIL-M-38510-530 Revision A:1994 | MICROCIRCUITS, DIGITAL, N-CHANNEL, SILICON GATE MONOLITHIC 16-BIT MICROPROCESSOR (FIXED INSTRUCTION) |
| MIL-M-38510-316 Revision E:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Cascadable Latches,Monolithic Silicon |
| MIL-M-38510-115 Revision B:2004 | Microcircuits, Linear, Negative, Voltage Regulators, Monolithic Silicon |
| MIL-M-38510-7 Revision C:2005 | Microcircuits, Digital, TTL, Exclusive or Gates, Monolithic Silicon |
| DSCC 86031 : K | RELAY, SOLID STATE, OPTICALLY ISOLATED, 10 AMPERE LOAD AT 250 V AC, DC INPUT CONTROL |
| MIL-PRF-83726-21 Revision H:2015 | RELAY, SOLID-STATE, TIME DELAY (ON OPERATE), TYPE 1, CLASS C, SPST, 250 MILLIAMPERES, VARIABLE TIME, 0.05 TO 500 SECONDS |
| DSCC 89099 : H | RESISTOR, FIXED, FILM, CHIP, FLANGE MOUNT, SINGLE TAB, HIGH POWER, 10 WATTS |
| MIL-A-81327 Revision A:1985 | ACOUSTIC LOCATING DEVICE (FOR TORPEDO MK 46 MOD O) |
| MIL-M-38510-752 Revision C:2003 | Microcircuits, Digital, Advanced CMOS, and Gates, or Gates, Monolithic Silicon, Positive Logic |
| MIL-M-38510-658 Revision A:2006 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, DECODERS, MONOLITHIC SILICON, POSITIVE LOGIC |
| DSCC 85006 : F | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 1.O AMPERE, 60 V DC, SPST (N.O.), CMOS INPUT |
| 11/30246255 DC : 0 | BS EN 62396-1 - PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 1: ACCOMMODATION OF ATMOSPHERIC RADIATION EFFECTS VIA SINGLE EVENT EFFECTS WITHIN AVIONICS ELECTRONIC EQUIPMENT |
| MIL-PRF-27-367 Revision A:2006 | INDUCTOR, POWER, HIGH CURRENT, SURFACE MOUNT |
| DSCC 89116 : E | RELAY, SOLID STATE, HERMETICALLY SEALED, OPTICALLY ISOLATED, 0.25 TO 1.0 AMPERE, +/-80 V DC TO +/-350 V DC, ANALOG SIGNAL SWITCHING, SPST (NO), TTL CONTROL INPUTS |
| MIL-PRF-83446-42 Base Document:2015 | COIL, RADIO FREQUENCY, CHIP, FIXED, SHIELDED, MOLDED SURFACE MOUNT |
| UNE-EN 45502-2-3:2010 | Active implantable medical devices -- Part 2-3: Particular requirements for cochlear and auditory brainstem implant systems |
| MIL M 38510/236 : 0 | MICROCIRCUITS DIGITAL MOS 4096 BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
| SAE AS6171/7 | Techniques for Suspect/Counterfeit EEE Parts Detection by Electrical Test Methods |
| MIL-M-38510-758 Revision B:2005 | MICROCIRCUITS, DIGITAL, ADVANCED CMOS, DECODER/DEMULTIPLEXER, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-170 Revision C:2004 | Microcircuits, Digital, CMOS, and Gates, Monolithic Silicon, Positive Logic |
| MIL-STD-1772 Revision B:1990 | CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUITS FACILITIES AND LINES |
| MIL-DTL-28803-1 Revision E:2013 | DISPLAY, OPTOELECTRONIC, SEGMENTED READOUT, BACKLIGHTED, STYLE 2 (LIGHT EMITTING DIODE), RFI SHIELDED, MOISTURE SEALED, HIGH IMPACT SHOCK, TYPE R01 |
| MIL-M-38510-143 Base Document:1987 | MICROCIRCUITS, LINEAR, INSTRUMENTATION AMPLIFIERS, MONOLITHIC SILICON |
| MIL-M-63321 Revision A:1981 | MICROCIRCUIT, DIGITAL, CMOS (FINAL LOGIC) |
| MIL M 38510/232 : NOTICE 2 | MICROCIRCUITS SCHOTTKY TTL 576 BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON |
| MIL-M-38510-484 Revision A:1984 | MICROCIRCUITS, DIGITAL, N-CHANNEL, SILICON GATE, MONOLITHIC, PARALLEL INPUT/OUTPUT CONTROLLER |
| CEI UNI EN 45502-2-3 : 2010 | ACTIVE IMPLANTABLE MEDICAL DEVICES - PART 2-3: PARTICULAR REQUIREMENTS FOR COCHLEAR AND AUDITORY BRAINSTEM IMPLANT SYSTEMS |
| MIL-M-38510-552 Base Document:1989 | MICROCIRCUITS, DIGITAL, CMOS, TIMING CONTROL UNIT, MONOLITHIC SILICON |
| MIL-D-87157-2 Base Document:1987 | DISPLAYS, DIODE, LIGHT EMITTING, SOLID STATE, RED, ALPHANUMERIC, WITH ON BOARD DECODER DRIVER |
| 17/30318744 DC : 0 | BS ISO 20188 - SPACE SYSTEMS - PRODUCT ASSURANCE REQUIREMENTS FOR COMMERCIAL SATELLITES |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| DSCC 10016 : A | FILTER, EMI, HYBRID, 5 AMP |
| DSCC 85014 : H | DELAY LINE, ACTIVE, 10 TAPS, 14 PIN DIP, TTL INTERFACED |
| DSCC 85019 : E | DELAY LINES, PROGRAMMABLE 16 PIN COMPATIBLE, 3 BIT, TTL COMPATIBLE |
| MIL-R-83726-18 Revision H:2016 | RELAYS, HYBRID, TIME DELAY (ON RELEASE), TRACK MOUNTED, TYPE 2A, CLASS B, 10 AMPERES, 2PDT, HERMETICALLY SEALED, FIXED TIME, 0.1 TO 300 SECONDS |
| MIL-M-38510-318 Revision A:1983 | MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, BINARY MULTIPLIER, CASCADABLE, MONOLITHIC SILICON |
| MIL-M-38510-662 Base Document:1988 | MICROCIRCUITS, DIGITAL, HIGH SPEED, CMOS DATA SELECTORS/MULTIPLEXERS, MONOLITHIC SILICON |
| MIL M 38510/276 : 0 | MICROCIRCUIT, MEMORY, DIGITAL, 262,144 BIT, CMOS, ULTRAVIOLET ERASABLE PROGRAMMABLE READ-ONLY MEMORY (UVEPROM) MONOLITHIC SILICON |
| MIL-M-38510-482 Revision A:1984 | MICROCIRCUIT DIGITAL N CHANNEL, SILICON GATE MONOLITHIC DIRECT MEMORY ACCESS CONTROLLER. |
| MIL-M-38510-157 Revision A:1983 | MICROCIRCUITS, DIGITAL, TTL, MULTIPLE PORT REGISTERS, MONOLITHIC SILICON |
| MIL M 38510/219 : A | MICROCIRCUIT DIGITAL 4096 BIT CMOS ULTRAVIOLET ERASABLE PROGRAMMABLE READ ONLY MEMORY (EPROM) MONOLITHIC SILICON |
| NASA JSC HDBK 07-001 : 2012 | HIGH ENERGY/LET RADIATION EEE PARTS CERTIFICATION HANDBOOK |
| DSCC 09024 : 0 | CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402 |
| IEEE DRAFT 1554 : D15D 2005 | PRACTICE FOR INERTIAL SENSOR TEST EQUIPMENT, INSTRUMENTATION, DATA ACQUISITION, AND ANALYSIS |
| BS EN 62149-3:2014 | Fibre optic active components and devices. Performance standards Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems |
| MIL C 49464 : A | CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY |
| MIL-M-38510-607 Revision A:1992 | MICROCIRCUITS, DIGITAL, CMOS, SEMICUSTOM (GATE ARRAY) DEVICES, MONOLITHIC SILICON |
| MIL O 55310 : C | OSCILLATOR, CRYSTAL, GENERAL SPECIFICATION FOR |
| MIL R 83726 : B | RELAY, HYBRID, TIME DELAY (ON RELEASE), CLASS B, TYPE LIA, HERMETICALLY SEALED, DPDT, 10 AMPERES, ADJUSTABLE TIME DELAY (EXTERNAL RESISTOR)O.1 TO 500 SECONDS |
| EIA 4899 : 2001 | STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| MIL-F-48370 Revision A:1985 | FUZE M934E6, HYBRID MICROCIRCUITS FOR |
| MIL-HDBK-263 Revision B:1994 | ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT |
| MIL-M-38510-379 Revision A:1985 | MICROCIRCUITS, DIGITAL, ADVANCED LOW POWER SCHOTTKY TTL, UNIVERSAL MULTIPLEXER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON |
| MIL-M-38510-25 Revision E:2005 | Microcircuits, Digital, Bipolar, TTL, Low Power, Counters, Monolithic Silicon |
| BS PD IEC 62239 : 2001 | ELECTRONIC COMPONENT MANAGEMENT PLANS |
| MIL-M-55565 Revision C:1988 | MICROCIRCUITS, PACKAGING OF |
| MIL-PRF-39010-18 Base Document:2013 | Coils, Radio Frequency, Shielded, Molded, Fixed, Surface Mount Established Reliability & Non-Established Reliability |
| MIL-M-38510-57 Revision F:2005 | Microcircuits, Digital, CMOS, Static Shift Register, Monolithic Silicon, Positive Logic |
| MIL-M-38510-121 Revision B:2004 | Microcircuits, Linear Monolithic and Multichip, Silicon 12 Bit Digital-to-Analog Converters |
| MIL-M-38510-123 Revision B:2004 | Microcircuits, Linear, Cmos, Negative Logic, Analog Switch, Monolithic Silicon |
| MIL-PRF-83726-20 Revision G:2015 | RELAY, SOLID-STATE, TIME DELAY (ON OPERATE), TYPE 1, CLASS C, SPST, 250 MILLIAMPERES, FIXED TIME, 0.05 TO 500 SECONDS |
| MIL-HDBK-815 Base Document:1994 | DOSE-RATE HARDNESS ASSURANCE GUIDELINES |
| MIL-M-38510-80 Revision F:2006 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, AND GATES, MONOLITHIC SILICON |
| MIL-M-38510-206 Revision D:2005 | Microcircuit, Digital, 4096 Bit Schottky, Bipolar, Programmable Read-Only Memory (PROM) |
| MIL-M-38510-480 Revision B:1983 | MICROCIRCUIT, DIGITAL, N-CHANNEL, SILICON GATE MONOLITHIC 8 BIT MICROPROCESSOR |
| MIL-R-83726-27 Revision M:2016 | Relays, Hybrid, Time Delay, Voltage Sensitive, Delay on Drop-Out, Class A, Type V, Hermetically Sealed (Potted), SPDT, 2 Ampere, Track Mounted (No S/S Document) |
| MIL-PRF-6106 Revision P:2014 | Relays, Electromagnetic General Specification for |
| MIL-M-38510-60 Revision B:2004 | Microcircuits, Digital, ECL, Multiple NOR Gates, Monolithic Silicon |
| MIL-P-48189 Revision D:1992 | PROJECTILE, 155MM, HE, M692 AND M731 HOUSING, TIMING AND FUZING FOR |
| MIL-M-38510-9 Revision E:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, SHIFT REGISTERS, MONOLITHIC SILICON |
| MIL-M-38510-201 Revision D:2005 | MICROCIRCUIT, DIGITAL, 512-BIT, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON |
| DSCC 11016 : A | FILTER, EMI, HYBRID |
| DSCC SMD 5962-87666 : B | MICROCIRCUIT, LINEAR, DUAL RS232 TRANSCEIVERS, MONOLITHIC SILICON |
| BS EN 16602-60-13:2015 | Space product assurance. Requirements for the use of COTS components |
| ARINC 809-3 : 2014 | 3GCN - SEAT DISTRIBUTION SYSTEM |
| I.S. EN 16602-60-15:2014 | SPACE PRODUCT ASSURANCE - RADIATION HARDNESS ASSURANCE - EEE COMPONENTS |
| DSCC 95003 : D | FILTER, EMI, HYBRID |
| ARINC 628P2-9:2017 | CABIN EQUIPMENT INTERFACES - PART 2: CABIN MANAGEMENT AND ENTERTAINMENT SYSTEMS - SEAT INTERFACES |
| ISO 20188:2018 | Space systems — Product assurance requirements for commercial satellites |
| ARINC 804 : 2007 | FIBER OPTIC ACTIVE DEVICE SPECIFICATION |
| I.S. EN IEC 60749-13:2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 13: SALT ATMOSPHERE |
| ARINC 628P4A-3: 2005 | CABIN EQUIPMENT INTERFACES - PART 4A: CABIN MANAGEMENT AND ENTERTAINMENT SYSTEM - CABIN DISTRIBUTION SYSTEM - DAISY CHAIN |
| MIL-PRF-32560-2 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
| SAE AS12500 | Corrosion Prevention and Deterioration Control in Electronic Components and Assemblies |
| ARINC 765 : 2003 | ETHERNET SWITCH UNIT (ESU) |
| EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles - Performance requirements |
| SAE AS6171 | Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts |
| ASTM F 458 : 2013 | Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2 |
| ASTM F 1190 : 2018 : REDLINE | Standard Guide for Neutron Irradiation of Unbiased Electronic Components |
| IEC 60749-13:2018 | Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere |
| 17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| 16/30350012 DC : 0 | BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| IEC 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| DD IEC PAS 62686-1 : DRAFT JULY 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
| IEC 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
| BS EN 62149-6:2003 | Fibre optic active components and devices. Performance standards 650-nm 250-Mbit/s plastic optical fibre transceivers |
| PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| EN 61751:1998 | Laser modules used for telecommunication - Reliability assessment |
| EN 16602-60-13:2015 | Space product assurance - Requirements for the use of COTS components |
| EN 45502-2-3:2010 | Active implantable medical devices - Part 2-3: Particular requirements for cochlear and auditory brainstem implant systems |
| EN 16602-60-12:2014 | Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs) |
| EN 16602-60-15:2014 | Space product assurance - Radiation hardness assurance - EEE components |
| EN 16602-70-08:2015 | Space product assurance - Manual soldering of high-reliability electrical connections |
| ASTM D 2442 : 1975 : R1996 | Standard Specification for Alumina Ceramics for Electrical and Electronic Applications |
| MIL-M-38510-134 Base Document:1985 | MICROCIRCUITS, LINEAR, ANALOG-TO-DIGITAL CONVERTERS WITH 3-STATE BUFFERED 10 BIT OUTPUTS, MONOLITHIC SILICON |
| MIL-M-38510-222 Revision A:1983 | MICROCIRCUITS, DIGITAL, 32,768 BIT MOS, ULTRAVIOLET ERASABLE, PROGRAMMABLE READ-ONLY MEMORY (EPROM) MONOLITHIC SILICON |
| MIL A 87211 : NOTICE 1 | AIR DATA SYSTEMS REQUEST FOR ISSUE OTHER THAN DOD MUST BE SENT VIA; ASD ENES, WRIGHT PATTERSON, AFB OH 45433 6503 |
| MIL-STD-983 Revision A:1992 | SUBSTITUTION LIST FOR MICROCIRCUITS |
| DSCC 10015 : A | FILTER, EMI, HYBRID, 3 AMP |
| MIL R 914 : 0 | RESISTOR NETWORKS, FIXED, FILM, SURFACE MOUNT, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-PRF-39016 Revision H:2017 | Relays, Electromagnetic, Established Reliability, General Specification for |
| MIL-P-49452 Base Document:1989 | POWER SUPPLY 18 MM, MICROCHANNEL WAFER, GEN III, MX-10130()/UV |
| MIL T 21038 : D | TRANSFORMERS, PULSE, LOW POWER, GENERAL SPECIFICATION FOR |
| MIL-M-38510-72 Revision C:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, NAND BUFFERS, MONOLITHIC SILICON |
| MIL-M-38510-1 Revision F:2005 | Microcircuits, Digital, TTL, Nand Gates, Monolithic Silicon |
| MIL-M-38510-324 Revision D:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Octal Buffer Gates with Three State Outputs, Monolithic Silicon |
| MIL-M-38510-20 Revision D:2005 | Microcircuits, Digital, TTL, Low Power, NAND Gates ,Monolithic Silicon |
| MIL-M-38510-2 Revision G:2005 | MICROCIRCUITS, DIGITAL, TTL, FLIP-FLOPS, MONOLITHIC SILICON |
| MIL-M-38510-3 Revision G:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, NAND BUFFERS, MONOLITHIC SILICON |
| MIL-S-49433-1 Base Document:1984 | SURFACE ACOUSTIC WAVE DEVICES, BANDPASS FILTER |
| MIL-M-38510-370 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Low Power Schottky TTL, Nand Gates, Monolithic Silicon |
| MIL-C-64030 Base Document:1986 | CONTROL INDICATOR FOR DISPENSER AND MINES GROUND M131 |
| MIL-PRF-28776 Revision H:2017 | Relays, Hybrid, Established Reliability, General Specification for |
| MIL-PRF-83536 Revision F:2017 | RELAYS, ELECTROMAGNETIC, ESTABLISHED RELIABILITY, 25 AMPERES AND BELOW, GENERAL SPECIFICATION FOR |
| MIL C 17361 : F | CIRCUIT BREAKERS, AIR, ELECTRIC, INSULATED HOUSING (SHIPBOARD USE) |
| MIL-A-85672 Base Document:1987 | AMPLIFIER, RADIO FREQUENCY AM-7177A/ARC |
| ARINC 628-4B : 1999 | CABIN EQUIPMENT INTERFACES - PART 4B: CABIN MANAGEMENT AND ENTERTAINMENT SYSTEM CABIN DISTRIBUTION SYSTEM - STAR WIRING |
| EN IEC 60749-13:2018 | Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere |
| I.S. EN 16602-60-12:2014 | SPACE PRODUCT ASSURANCE - DESIGN, SELECTION, PROCUREMENT AND USE OF DIE FORM MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICS) |
| MIL-I-48331 Revision A:1979 | INTEGRATED CIRCUIT, DIGITAL, CMOS, TIME BASE AND SPECIAL PURPOSE FUNCTION GENERATOR, MONOLITHIC, SILICON |
| DSCC 96003 : F | FILTER, EMI, HYBRID |
| PD IEC/TR 62572-2:2008 | Fibre optic active components and devices. Reliability standards Laser module degradation |
| 09/30183239 DC : 0 | BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| MIL-M-38510-5 Revision D:2004 | Microcircuits, Digital, TTL, and-or-Invert Gates, Monolithic Silicon |
| MIL R 83516/4 : C | RELAYS, REED, DRY, DUAL IN-LINE PACKAGE (DIP), GENERAL PURPOSE, LOW-POWER COIL |
| MIL-P-11268 Revision L:1983 | PART, MATERIALS, AND PROCESSES USED IN ELECTRONIC EQUIPMENT |
| SAE ARP6109 | Electronic Engine Control Hardware Change Management |
| MIL-PRF-83726 Revision H:2017 | Relays, Hybrid and Solid State, Time Delay, General Specification for |
| MIL-DTL-5757 Revision N:2017 | RELAYS, ELECTROMAGNETIC, GENERAL SPECIFICATION FOR |
| MIL-P-49090 Revision D:1992 | POWER SUPPLY 25 MILLIMETER, MICROCHANNEL INVERTER |
| MIL-M-38510-78 Revision B:2005 | MICROCIRCUITS, DIGITAL, SCHOTTKY TTL, ARITHMETIC LOGIC UNIT/FUNCTION GENERATORS, MONOLITHIC SILICON |
| MIL-M-38510-114 Revision B:2003 | Microcircuits, Linear, Bi-Fet Operational Amplifiers, Monolithic Silicon |
| MIL-M-38510-63 Revision C:2006 | MICROCIRCUITS, DIGITAL, ECL, QUAD TRANSLATOR, MONOLITHIC SILICON |
| MIL-M-38510-79 Revision D:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, SCHOTTKY TTL, DATA SELECTORS/MULTIPLEXERS WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON |
| MIL-M-38510-19 Revision A:2005 | Microcircuits, Digital TTL, Parity Generators/Checkers, Monolithic Silicon |
| MIL-M-38510-153 Revision B:2005 | Microcircuits, Digital, TTL, Quadruple Bus Buffer Gates with Three-State Outputs, Monolithic Silicon |
| MIL-M-38510-209 Revision H:2014 | Microcircuit, Digital, 8192-Bit, Schottky, Bipolar, Programmable Read-Only Memory (PROM), Monolithic Silicon |
| MIL-M-38510-135 Revision G:2010 | MICROCIRCUITS, LINEAR, LOW OFFSET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON |
| MIL-M-38510-155 Revision C:2005 | MICROCIRCUITS, DIGITAL, TTL, HIGH SPEED, AND GATES MONOLITHIC SILICON |
| MIL-M-38510-650 Revision C:2005 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, NAND GATES, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-204 Revision F:2009 | Microcircuit, Digital, 2048-Bit, Schottky, Bipolar, Programmable Read-Only Memory (PROM), Monolithic Silicon |
| MIL-PRF-38534 Revision K:2017 | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| MIL-PRF-55310 Revision E:2006 | OSCILLATOR, CRYSTAL CONTROLLED, GENERAL SPECIFICATION FOR |
| MIL-A-63242 Revision A:1982 | AMPLIFIER, OPERATIONAL TRIPLE PROGRAMMABLE MICROPOWER |
| BS EN 16602-60-12:2014 | Space product assurance. Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs) |
| MIL R 55182 : F | RESISTORS, FIXED, FILM, ESTABLISHED RELIABILITY GENERAL SPECIFICATION FOR |
| MIL-M-38510-77 Revision B:2005 | MICROCIRCUITS, DIGITAL, SCHOTTKY TTL, DECODERS, MONOLITHIC SILICON |
| MIL-M-38510-341 Revision F:2004 | Microcircuits, Digital, Bipolar, Advanced, Schottky TTL, Flip-Flops, Cascadable, Monolithic Silicon |
| MIL-M-38510-18 Revision B:2005 | Microcircuits, Digital, TTL, Register File, Monolithic Silicon |
| MIL-M-38510-507 Revision B:2006 | MICROCIRCUITS, MEMORY, DIGITAL, CMOS ULTRAVIOLET ERASABLE PROGRAMMABLE ARRAY LOGIC, MONOLITHIC SILICON |
| MIL-M-38510-347 Revision A:2004 | Microcircuits, Digital, Bipolar, Advanced Schottky TTL, 8-Bit Identity Comparator, Monolithic Silicon |
| MIL-M-38510-81 Revision D:2005 | Microcircuits, Digital, Bipolar, Schottky TTL, Line Drivers, Monolithic Silicon |
| MIL-M-38510-116 Revision A:2004 | Microcircuits, Linear, CMOS Analog Switch with Driver, Monolithic Silicon |
| MIL-M-38510-334 Revision C:2003 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, AND-OR-INVERT Gates, Monolithic Silicon |
| MIL-M-38510-141 Revision B:2004 | Microcircuits, Linear, Darlington Transistor Array, Seven and Eight Gate, Monolithic Silicon |
| MIL-M-38510-130 Revision C:2004 | Microcircuits, Monolithic Silicon, Bipolar, Interface, Memory Core Drivers |
| MIL-M-38510-504 Revision B:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR PROGRAMMABLE LOGIC, MONOLITHIC SILICON |
| MIL-M-38510-653 Revision B:2006 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-35 Revision C:2005 | MICROCIRCUITS, DIGITAL CLOCK DRIVERS, MONOLITHIC SILICON |
| BS PD ES 59008-4.3 : 2000 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL |
| DSCC 85008 : H | DELAY LINES, ACTIVE, 5 TAPS, 14-PIN DIP, TTL INTERFACED |
| DSCC 06005 : C | FILTER, EMI, HYBRID |
| MIL-M-38510-754 Revision B:2005 | MICROCIRCUITS, DIGITAL, ADVANCED CMOS, LATCHES, MONOLITHIC SILICON |
| MIL-M-38510-126 Revision C:2004 | Microcircuits, Linear, Regulating, Pulse Width Modulator, Monolithic Silicon |
| MIL-M-38510-6 Revision D:2005 | MICROCIRCUITS, DIGITAL, TTL, BINARY FULL ADDERS, MONOLITHIC SILICON |
| MIL-M-38510-163 Revision B:2005 | MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, HEX BUS DRIVERS WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON |
| MIL-M-38510-11 Revision D:2005 | Microcircuits, Digital, TTL, Arithmetic Logic Units/Function Generators, Monolithic Silicon |
| MIL-M-38510-52 Revision E:2004 | Microcircuits, Digital, CMOS, NOR Gates, Monolithic Silicon, Positive Logic |
| MIL-M-38510-384 Revision A:2004 | MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, AND, OR, NAND AND NOR GATES, MONOLITHIC SILICON |
| MIL-M-38510-231 Revision C:2005 | MICROCIRCUITS, DIGITAL, SCHOTTKY TTL, 1024 BIT RANDOM ACCESS MEMORY (RAM), MONOLITHIC SILICON |
| MIL-M-38510-105 Revision A:2006 | MICROCIRCUIT, LINEAR, CMOS, HIGH LEVEL ANALOG SWITCH WITH DRIVER, MONOLITHIC SILICON |
| MIL-M-38510-349 Revision B:2004 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, Parity Checker, Monolithic Silicon |
| MIL-M-38510-118 Revision B:2005 | MICROCIRCUITS, LINEAR, ADJUSTABLE, NEGATIVE, VOLTAGE REGULATORS, MONOLITHIC SILICON |
| MIL-M-38510-751 Revision B:2005 | MICROCIRCUITS, DIGITAL, ADVANCED CMOS, NOR GATES, MONOLITHIC SILICON |
| MIL-M-38510-330 Revision C:2003 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, Nand Gates, Monolithic Silicon |
| MIL-M-24791-1 Base Document:1995 | MODULE, FIBER OPTIC, TRANSMITTER, DIGITAL, 160 MBD, ASSOCIATED DETAIL SPECIFICATION FOR |
| MIL-S-83519 Revision A:1984 | SPLICE, SHIELD TERMINATION, SOLDER STYLE, INSULATION, HEAT SHRINKABLE, ENVIRONMENT RESISTANT, GENERAL SPECIFICATION FOR |
| MIL-P-24764 Base Document:1991 | POWER SUPPLIES, SHIPBOARD, ELECTRONIC, GENERAL SPECIFICATION FOR |
| DSCC 13009 : B | FILTER, EMI, HYBRID, 28 V DC |
| MIL R 83726/21 : D | RELAYS, SOLID STATE, TIME DELAY (ON OPERATE) TYPE 1, CLASS C, SPST 250 MILLIAMPERES, VARIABLE TIME, .05 TO 500 SECONDS |
| MIL-M-38510-28 Revision C:2005 | MICROCIRCUITS, DIGITAL, TTL, LOW POWER SHIFT REGISTERS, MONOLITHIC SILICON |
| MIL-M-38510-555 Revision B:2006 | MICROCIRCUITS, DIGITAL, CMOS, REMOTE TERMINAL INTERFACE, MONOLITHIC SILICON |
| MIL-M-38510-756 Revision B:2005 | MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-M-38510-652 Revision B:2005 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, AND GATES, OR GATES, MONOLITHIC SILICON, POSITIVE LOGIC |
| MIL-STD-977 Base Document:1982 | TEST METHODS AND PROCEDURES FOR MICROCIRCUIT LINE CERTIFICATION |
| MIL-M-38510-309 Revision E:2003 | MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, DATA SELECTOR/MULTIPLEXER WITH THREE-STATE OUTPUTS, CASCADABLE, MONOLITHIC SILICON |
| MIL-M-38510-308 Revision B:2003 | Microcircuits, Digital, Bipolar, Low-Power Schottky TTL, Arithmetic Logic Units/Function Generators, Monolithic Silicon |
| MIL-DTL-28875 Revision C:2012 | Amplifiers, Radio-Frequency and Microwave, Solid-State, General Specification for |
| MIL-M-38510-246 Base Document:1987 | MICROCIRCUITS, MEMORY, DIGITAL, NMOS, 246,144-BIT DYNAMIC RANDOM ACCESS MEMORY (DRAM), MONOLITHIC SILICON |
| MIL-M-38510-654 Revision A:2006 | MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, LATCHES, MONOLITHIC SILICON |
| MIL-PRF-19500-548 Revision J:2015 | COUPLER, OPTOELECTRONIC, SEMICONDUCTOR DEVICE, SOLID STATE, THROUGH HOLE AND SURFACE MOUNT, TYPES 4N47, 4N48, AND 4N49, QUALITY LEVELS: JAN, JANTX, JANTXV, AND JANS |
| MIL-M-38510-56 Revision G:2005 | MICROCIRCUITS, DIGITAL, CMOS, COUNTERS/DIVIDERS, MONOLITHIC SILICON |
| MIL-PRF-32085 Base Document:2001 | RELAYS, ELECTROMAGNETIC, 270 V DC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-M-48647 Base Document:1986 | MICROCIRCUIT, DIGITAL, DECODER, LOGIC ARRAY |
| MIL-P-85576 Revision B:1987 | POWER SUPPLY PP-2581C/A |
| MIL-M-63320 Revision A:1981 | MICROCIRCUIT, DIGITAL, CMOS (INITIAL LOGIC) |
| MIL-STD-1331 Base Document:1969 | PARAMETER TO BE CONTROLLED FOR THE SPECIFICATION OF MICROCIRCUITS |
| MIL-M-38510-333 Revision C:2003 | Microcircuits, Digital, Bipolar Advanced Schottky TTL, Nor Gates, Monolithic Silicon |
| MIL-M-38510-382 Revision B:2004 | MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, D-TYPE LATCHES, CASCADABLE, MONOLITHIC SILICON |
| MIL-PRF-27-370 Revision B:2013 | INDUCTOR, POWER, HIGH CURRENT, SURFACE MOUNT |
| MIL-M-38510-486 Base Document:1989 | MICROCIRCUITS, DIGITAL, CMOS, SERIAL COMMUNICATIONS CONTROLLER, MONOLITHIC SILICON |
| MIL-R-63322 Revision A:1981 | RESISTOR NETWORK, FIXED, FILM (EXTERNALLY TRIMMABLE) |
| MIL-M-38510-221 Revision A:1983 | MICROCIRCUIT DIGITAL 16384 BIT MOS ULTRAVIOLET ERASABLE PROGRAMMABLE READ ONLY MEMORY (EPROM) MONOLITHIC SILICON |
| MIL M 38510/616 : NOTICE 3 | MICROCIRCUITS, DIGITAL, BIPOLAR, VHSIC, ADDRESS GENERATOR, MONOLITHIC SILICON |
| MIL-PRF-27-368 Revision B:2013 | INDUCTOR, POWER, SURFACE MOUNT |
| SAE AS83519C | Shield Termination, Solder Style, Insulated, Heat-Shrinkable, Environment Resistant General Specification For |
| IEC TR 62572-2:2008 | Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation |
| ARINC 628-4C : 2005 | CABIN EQUIPMENT INTERFACES (CEI) - PART 4C: CABIN MANAGEMENT AND ENTERTAINMENT SYSTEM - CABIN DISTRIBUTION SYSTEM - 2[ND] GENERATION - DAISY CHAIN |
| I.S. EN 16602-60-05:2014 | SPACE PRODUCT ASSURANCE - GENERIC PROCUREMENT REQUIREMENTS FOR HYBRIDS |
| ASTM E 1161 : 2009 | Standard Practice for Radiologic Examination of Semiconductors and Electronic Components |
| I.S. EN 45502-2-3:2010 | ACTIVE IMPLANTABLE MEDICAL DEVICES - PART 2-3: PARTICULAR REQUIREMENTS FOR COCHLEAR AND AUDITORY BRAINSTEM IMPLANT SYSTEMS |
| DSCC 10017 : A | FILTER, EMI, HYBRID, 8 AMP |
| SAE AS6081 | Fraudulent/Counterfeit Electronic Parts: Avoidance, Detection, Mitigation, and Disposition - Distributors |
| SAE AS 6171/5 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RADIOLOGICAL TEST METHODS |
| ASTM D 2442 : 1975 : R2007 | Standard Specification for Alumina Ceramics for Electrical and Electronic Applications |
| ASTM D 2442 : 1975 : R2016 | Standard Specification for Alumina Ceramics for Electrical and Electronic Applications |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62005-9-1:2015 | Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components |
| EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
| EN 62005-9-1:2015 | Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components |
| IEC 62396-1:2016 RLV | Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
| ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-HDBK-505 Base Document:1998 | Definitions of Item Levels, Item Exchangeability, Models, and Related Terms |
| ASTM E 801 : 2016 : REDLINE | Standard Practice for Controlling Quality of Radiographic Examination of Electronic Devices |
| ASTM D 3941 : 2014 : REDLINE | Standard Test Method for Flash Point by the Equilibrium Method With a Closed-Cup Apparatus |
| ASTM C 518 : 2017 : REDLINE | Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus |
| MIL-HDBK-1331 Revision A:2003 | PARAMETERS TO BE CONTROLLED FOR THE SPECIFICATION OF MICROCIRCUITS |
| ASTM E 720 : 2016 : REDLINE | Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron Spectra Employed in Radiation-Hardness Testing of Electronics |
| ASTM E 2450 : 2016 : REDLINE | Standard Practice for Application of CaF<inf>2</inf>(Mn) Thermoluminescence Dosimeters in Mixed Neutron-Photon Environments |
| ISO 14644-2:2015 | Cleanrooms and associated controlled environments Part 2: Monitoring to provide evidence of cleanroom performance related to air cleanliness by particle concentration |
| ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| ASTM D 1120 : 2017 : REDLINE | Standard Test Method for Boiling Point of Engine Coolants |
| MIL-PRF-38534 Revision J:2015 | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| ASTM F 526 : 2016 : REDLINE | Standard Test Method for Using Calorimeters for Total Dose Measurements in Pulsed Linear Accelerator or Flash X-ray Machines |
| MIL-STD-1686 Revision C:1995 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) |
| ASTM E 265 : 2015 : REDLINE | Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by Radioactivation of Sulfur-32 |
| MIL-HDBK-781 Revision A:1996 | RELIABILITY TEST METHODS, PLANS, AND ENVIRONMENTS FOR ENGINEERING DEVELOPMENT, QUALIFICATION AND PRODUCTION |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| ISO/ASTM 51275:2013 | Practice for use of a radiochromic film dosimetry system |
| MIL-STD-1916 Base Document:1996 | DOD PREFERRED METHODS FOR ACCEPTANCE OF PRODUCT |
| MIL-PRF-680 Revision C:2010 | DEGREASING SOLVENT |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| A-A-58092 Base Document:1997 | TAPE, ANTISEIZE, POLYTETRAFLUOROETHYLENE |
| ASTM E 721 : 2016 : REDLINE | Standard Guide for Determining Neutron Energy Spectra from Neutron Sensors for Radiation-Hardness Testing of Electronics |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| ASTM E 722 : 2014 : REDLINE | Standard Practice for Characterizing Neutron Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics |
| ASTM D 1331 : 2014 : REDLINE | Standard Test Methods for Surface and Interfacial Tension of Solutions of Paints, Solvents, Solutions of Surface-Active Agents, and Related Materials |
| ASTM E 668 : 2013 : REDLINE | Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in Radiation-Hardness Testing of Electronic Devices |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| ASTM E 1249 : 2015 : REDLINE | Standard Practice for Minimizing Dosimetry Errors in Radiation Hardness Testing of Silicon Electronic Devices Using Co-60 Sources |
| MIL-HDBK-217 Revision F:1991 | RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
| ASTM E 1250 : 2015 : REDLINE | Standard Test Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt-60 Irradiators Used in Radiation-Hardness Testing of Silicon Electronic Devices |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
| ASTM D 257 : 2014 : REDLINE | Standard Test Methods for DC Resistance or Conductance of Insulating Materials |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| ASTM E 666 : 2014 : REDLINE | Standard Practice for Calculating Absorbed Dose From Gamma or X Radiation |
| MIL-STD-1835 Revision D:2004 | ELECTRONIC COMPONENT CASE OUTLINES |
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