EN 60068-2-20:2008
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Superseded date
13-05-2021
Superseded by
Published date
25-09-2008
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FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of wire and tag terminations
4.1 Object and general description of the test
4.1.1 Test methods
4.1.2 Specimen preparation
4.1.3 Initial measurements
4.1.4 Accelerated ageing
4.2 Method 1: Solder bath
4.2.1 Description of the solder bath
4.2.2 Flux
4.2.3 Procedure
4.2.4 Test conditions
4.2.5 Final measurements and requirements
4.3 Method 2: Soldering iron at 350 degrees C
4.3.1 Description of soldering irons
4.3.2 Solder and flux
4.3.3 Procedure
4.3.4 Final measurements and requirements
4.4 Information to be given in the relevant specification
5 Test Tb: Resistance to soldering heat
5.1 Object and general description of the test
5.1.1 Test methods
5.1.2 Initial measurements
5.2 Method 1: Solder bath
5.2.1 Description of the solder bath
5.2.2 Flux
5.2.3 Procedure
5.2.4 Test conditions
5.2.5 De-wetting
5.3 Method 2: Soldering iron
5.3.1 Description of soldering iron
5.3.2 Solder and flux
5.3.3 Procedure
5.4 Recovery
5.5 Final measurements and requirements
5.6 De-wetting (if applicable)
5.7 Information to be given in the relevant specification
Annex A (informative) Example of apparatus for accelerated
steam ageing process
Annex B (normative) Specification for flux constituents
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.
| Committee |
CLC/SR 91
|
| DevelopmentNote |
Supersedes HD 323.2.20. (10/2008) Supersedes UNE 20501-2-20. (01/2012)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| OVE/ONORM EN 60068-2-20 : 2009 | Identical |
| NBN EN 60068-2-20 : 2009 | Identical |
| DIN EN 60068-2-20:2009-02 | Identical |
| I.S. EN 60068-2-20:2008 | Identical |
| NF EN 60068-2-20 : 2013 | Identical |
| UNE-EN 60068-2-20:2008 | Identical |
| IEC 60068-2-20:2008 | Identical |
| BS EN 60068-2-20:2008 | Identical |
| CEI EN 60068-2-20 : 2009 | Identical |
| NEN EN IEC 60068-2-20 : 2008 | Identical |
| PN EN 60068-2-20 : 2009 | Identical |
| PNE-EN 60068-2-20 | Identical |
| BS EN 62149-9:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier transceivers |
| BS EN 61643-312:2013 | Components for low-voltage surge protective devices Selection and application principles for gas discharge tubes |
| BS EN 62246-1:2015 | Reed switches Generic specification |
| I.S. EN 61810-1:2015 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| BS EN 60115-2:2015 | Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
| BS EN 60384-26-1:2010 | Fixed capacitors for use in electronic equipment Blank detail specification. Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte. Assessment level EZ |
| I.S. EN 60252-1:2011 | AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010 (EQV)) |
| BS EN 60939-1:2010 | Passive filter units for electromagnetic interference suppression Generic specification |
| CEI EN 61881-1 : 2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
| CEI EN 61747-10-1 : 2014 | LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
| BS EN 60127-2:2014 | Miniature fuses Cartridge fuse-links |
| BS EN 60539-1:2016 | Directly heated negative temperature coefficient thermistors Generic specification |
| BS EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement |
| BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
| UNE-EN 60252-1:2011 | AC motor capacitors -- Part 1: General - Performance, testing and rating - Safety requirements - Guidance for installation and operation |
| BS EN 61881-3 : 2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS |
| I.S. EN 61643-311:2013 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) (IEC 61643-311:2013 (EQV)) |
| I.S. EN 60939-3:2015 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
| I.S. EN 61881-1:2011 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
| I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| I.S. EN IEC 61643-331:2018 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTION - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| BS EN 60252-1 : 2011 | AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
| I.S. EN 62246-1-1:2013 | REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT (IEC 62246-1-1:2013 (EQV)) |
| I.S. EN 60252-2:2011 | AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010 (EQV)) |
| I.S. EN 60939-1:2010 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| EN 61881-1:2011 | Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors |
| EN 60384-26-1:2010 | Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ |
| EN 62246-1:2015 | Reed switches - Part 1: Generic specification |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| EN 60939-1:2010 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| EN 60127-4:2005/A2:2013 | Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| EN 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| EN 60684-2:2011 | Flexible insulating sleeving - Part 2: Methods of test |
| EN 60252-1 : 2011 AMD 1 2013 | AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010/A1:2013) |
| EN 60115-2:2015 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
| EN 61881-2 : 2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012) |
| EN 140402:2015/A1:2016 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60115-8:2012 | Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors |
| CEI EN 62149-4 : 2011 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
| CEI EN 60384-26-1 : 2011 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| BS EN 60068-2-83:2011 | Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| BS EN IEC 62246-1-1:2018 | Reed switches Generic specification. Blank detail specification |
| BS EN 60749-15:2010 | Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices |
| CEI EN 62739-1 : 2014 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
| I.S. EN 60115-8-1:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| CEI EN 61810-1 : 2016 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| I.S. EN 140402:2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| CEI EN 60384-26 : 2011 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| I.S. EN 140401-802:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
| I.S. EN 60115-8:2012 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
| I.S. EN 140401:2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60127-4 : 2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
| I.S. EN 61747-10-1:2013 | LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV)) |
| CEI EN 60068-2-58 : 2016 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 60068-2-83:2011 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV)) |
| CEI EN 61881-2 : 2013 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
| EN IEC 62246-1-1:2018 | Reed switches - Part 1-1: Generic specification - Blank detail specification |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| EN 62922:2017 | Organic light emitting diode (OLED) panels for general lighting - Performance Requirements |
| EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
| CEI EN 60068-3-13 : 1ED 2017 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 62739-1:2013 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV)) |
| BS EN 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality Generic specification and blank detail specification |
| BS EN 61643-311:2013 | Components for low-voltage surge protective devices Performance requirements and test circuits for gas discharge tubes (GDT) |
| CEI EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| CEI EN 62739-3 : 1ED 2017 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
| BS EN 61747-10-1:2013 | Liquid crystal display devices Environmental, endurance and mechanical test methods. Mechanical |
| BS EN 140401-803 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| BS EN 61169-1:2013 | Radio-frequency connectors Generic specification. General requirements and measuring methods |
| BS EN 62739-1:2013 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing |
| BS EN 61881-2:2012 | Railway applications. Rolling stock equipment. Capacitors for power electronics Aluminium electrolytic capacitors with non solid electrolyte |
| BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
| I.S. EN 60115-2:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| BS EN 61881-1:2011 | Railway applications. Rolling stock equipment. Capacitors for power electronics Paper/plastic film capacitors |
| 06/30155922 DC : 0 | BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS |
| BS EN 62246-1-1:2013 | Reed switches Generic specification. Quality assessment |
| BS EN 60684-2:2011 | Flexible insulating sleeving Methods of test |
| 14/30317306 DC : 0 | BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| CEI EN 62884-1 : 1ED 2018 | MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 140402 : 2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 60947-7-4:2013 | LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013 (EQV)) |
| I.S. EN 62246-1:2015 | REED SWITCHES - PART 1: GENERIC SPECIFICATION |
| BS EN 140401:2009 | Blank Detail Specification. Fixed low power film surface mount (SMD) resistors |
| EN IEC 61643-331:2018 | Components for low-voltage surge protective devices - Part 331: Performance requirements and test methods for metal oxide varistors (MOV) |
| I.S. EN 62884-1:2017 | MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
| CEI EN 60068-2-83 : 2012 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
| I.S. EN 62149-4:2010 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| EN 60749-15:2010/AC:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| BS EN 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods |
| BS EN 60384-26:2010 | Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte |
| BS EN 60689:2009 | Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values |
| BS EN 60939-3:2015 | Passive filter units for electromagnetic interference suppression Passive filter units for which safety tests are appropriate |
| I.S. EN 60684-2:2011 | FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST (IEC 60684-2:2011) |
| CEI EN 60947-7-4 : 2014 | LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
| 08/30186808 DC : DRAFT JULY 2008 | BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
| BS EN 140401-802 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| 14/30311384 DC : 0 | BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| BS EN 60068-3-13:2016 | Environmental testing Supporting documentation and guidance on Test T. Soldering |
| UNE-EN 60947-7-4:2014 | Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors |
| BS EN 62922:2017 | Organic light emitting diode (OLED) panels for general lighting. Performance requirements |
| BS EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality Generic specification |
| EN 60939-3:2015/AC:2016-04 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE (IEC 60939-3:2015/COR1:2016) |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| I.S. EN 62739-3:2017 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
| BS EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| CEI EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| EN IEC 61076-3-119:2018 | Connectors for electrical and electronic equipment - Product requirements - Part 3-119: Rectangular connectors - Detail specification for shielded and unshielded, free and fixed 10-way connectors with push-pull coupling for industrial environments for data transmission with frequencies up to 100 MHz |
| BS EN 60252-2 : 2011 | AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
| BS EN 60749-20:2009 | Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
| BS EN 61810-1:2015 | Electromechanical elementary relays General and safety requirements |
| I.S. EN 60127-6:2014 | MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
| EN 61810-1:2015/AC:2018-04 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS (IEC 61810-1:2015/COR1:2018) |
| I.S. EN IEC 62246-1-1:2018 | REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION |
| I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 60068-3-13:2016 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| I.S. EN 61643-312:2013 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 (EQV) + CORRIGENDUM JUL. 2013 (EQV)) |
| I.S. EN 60539-1:2016 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| BS EN 60947-7-4:2013 | Low-voltage switchgear and controlgear Ancillary equipment. PCB terminal blocks for copper conductors |
| CEI EN 62246-1-1 : 2014 | REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
| EN 140401-802:2007/A3:2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 60127-2:2014 | MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS |
| I.S. EN 61020-1:2009 | ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 140401-803:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| I.S. EN 61169-1:2013 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
| I.S. EN 62391-1:2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| EN 61169-1:2013/AC:2016-02 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013) |
| EN 60539-1:2016/AC:2017-09 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| EN 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification |
| EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
| EN 62739-1 : 2013 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013) |
| I.S. EN 60384-26-1:2010 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| CEI EN 60115-2 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| CEI EN 60684-2 : 2012 | FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
| CEI EN 140401 : 2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| CEI EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| BS EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment Generic specification |
| UNE-EN 61020-1:2011 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| BS EN 62149-4:2010 | Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application |
| BS EN 60127-6:2014 | Miniature fuses Fuse-holders for miniature fuse-links |
| CEI EN 60068-2-69 : 2008 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| CEI EN 60539-1 : 2009 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60384-26:2010 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| I.S. EN 61881-2:2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012 (EQV)) |
| I.S. EN IEC 61076-3-119:2018 | CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ |
| I.S. EN 60127-4:2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
| I.S. EN 60749-20:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| I.S. EN 60862-1:2015 | SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62149-9:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
| I.S. EN 61881-3:2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012 (EQV)) |
| I.S. EN 61811-1:2015 | ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
| CEI EN 60939-1 : 2011 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 140401-803 : 2007 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| EN 61747-10-1:2013 | Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods – Mechanical |
| EN 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
| EN 62149-4:2010 | Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application |
| EN 61643-311:2013 | Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT) |
| EN 60115-8:2012 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| EN 60127-2:2014 | Miniature fuses - Part 2: Cartridge fuse-links |
| EN 62246-1-1:2013 | Reed switches - Part 1-1: Generic specification - Quality assessment |
| EN 60252-2 : 2011 AMD 1 2013 | AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010/A1:2013) |
| EN 60068-2-83 : 2011 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011) |
| EN 61881-3:2012/A1:2013 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012/A1:2013) |
| EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| EN 62391-1:2016/AC:2016-12 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016) |
| EN 60127-6:2014 | Miniature fuses - Part 6: Fuse-holders for miniature fuse-links |
| EN 60947-7-4 : 2013 | LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013) |
| EN 62149-9:2014 | Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers |
| EN 60384-26:2010 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| EN 61643-312 : 2013 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 + CORRIGENDUM JUL. 2013) |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 60068-2-66:1994 | Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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