BS EN 61188-5-5:2007
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Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
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BS EN 61182-2-2:2012
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Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
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16/30333621 DC : 0
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BS EN 61188-7 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
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I.S. EN 61188-5-2:2003
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
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BS EN 61192-1:2003
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Workmanship requirements for soldered electronic assemblies General
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I.S. EN 61192-1:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
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I.S. EN 61191-2:2017
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
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BS EN 61191-3:2017
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Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
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IEC 61182-2:2006
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Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
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IEC 61191-4:2017
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Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
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BS EN 61191-1:2013
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Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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IEC 61188-5-3:2007
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Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
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EN 61188-5-6:2003
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Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
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EN 61182-2-2:2012
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Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
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EN 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
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I.S. EN 61191-1:2013
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
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EN 61191-3:2017
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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17/30352677 DC : 0
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BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
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I.S. EN 60352-5:2012-2015-10
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SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012 (EQV))
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BS ISO 16525-9:2014
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Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics
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IEC 61188-5-6:2003
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Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
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I.S. EN 61188-5-4:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
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PD IEC/TS 62647-1:2012
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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
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IEC 61191-2:2017
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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I.S. EN 61191-4:2017
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PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
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I.S. EN 61191-3:2017
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PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
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BS EN 60352-5:2012
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Solderless connections Press-in connections. General requirements, test methods and practical guidance
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CEI EN 60352-5 : 2013
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SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
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07/30169578 DC : 0
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BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
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BS EN 62326-4:1997
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Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
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BS EN 61188-5-4:2007
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Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
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I.S. EN 61188-5-3:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
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09/30204447 DC : 0
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BS EN 60352-5 - SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
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BS EN 61188-5-8:2008
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Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
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I.S. EN 61188-5-6:2003
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
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I.S. EN 61188-5-8:2008
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
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BS EN 61191-4:2017
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Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
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IEC TS 62647-1:2012
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
|
I.S. EN 61188-5-5:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
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BS EN 62326-4-1:1997
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Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
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IEC 61191-1:2013
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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EN 60352-5:2012/AC:2014
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SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012)
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BS EN 61188-5-6:2003
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Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
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ISO 16525-9:2014
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Adhesives — Test methods for isotropic electrically conductive adhesives — Part 9: Determination of high-speed signal-transmission characteristics
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IEC 61188-5-4:2007
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Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
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IEC 61182-2-2:2012
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Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
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15/30327712 DC : 0
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BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
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11/30255124 DC : 0
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BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
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IEC 61188-5-8:2007
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Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
|
IEC 61192-1:2003
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Workmanship requirements for soldered electronic assemblies - Part 1: General
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IEC 61188-5-5:2007
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Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
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IEC 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
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BS IEC 61182-2:2006
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Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
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IEC 61191-3:2017
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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IEC 60352-5:2012
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Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance
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I.S. EN 61182-2-2:2012
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PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
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BS EN 61188-5-3:2007
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Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
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EN 61191-2:2017
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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BS EN 61188-5-2:2003
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Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
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EN 61188-5-8:2008
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Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
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EN 61188-5-5:2007
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Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
|
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
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EN 61188-5-3:2007
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Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
|
EN 61192-1:2003
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Workmanship requirements for soldered electronic assemblies - Part 1: General
|
EN 61191-4:2017
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Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
|
EN 61188-5-4 : 2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
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