IEC 61747-1:1998+AMD1:2003 CSV
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Liquid crystal and solid-state display devices - Part 1: Generic specification
Amended by
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
12-08-2014
Superseded by
Language(s)
English - French
Published date
15-05-2003
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Terminology
3.1 Physical concepts
3.2 General terms
3.3 Terms related to ratings and characteristics
4 Technical aspects
4.1 Order of precedence
4.2 Terminology, units and symbols
4.3 Preferred values of temperature, humidity and pressure
4.4 Marking
4.4.1 Device identification
4.4.2 Device traceability
4.4.3 Packing
4.5 Categories of assessed quality
4.6 Screening
4.7 Handling
5 Quality assessment procedures
5.1 Eligibility for qualification approval
5.1.1 Primary stage of manufacture
5.2 Commercially confidential information
5.3 Formation of inspection lots
5.4 Structurally similar devices
5.5 Granting of qualification approval
5.6 Quality conformance inspection
5.6.1 Division into groups and subgroups
5.6.2 Inspection requirements
5.6.3 Supplementary procedure for reduced inspection
5.6.4 Sampling requirements for small lots
5.6.5 Certified records of released lots (CRRL)
5.6.6 Delivery of devices subjected to destructive or
non-destructive tests
5.6.7 Delayed deliveries
5.6.8 Supplementary procedure for deliveries
5.7 Statistical sampling procedures
5.7.1 AQL sampling plans
5.7.2 LTPD sampling plans
5.8 Endurance tests
5.9 Endurance tests where the failure rate is specified
5.9.1 General
5.9.2 Selection of samples
5.9.3 Failure
5.9.4 Endurance test time and sample size
5.9.5 Procedure to be used if the number of failures
exceeds the acceptance number
5.10 Accelerated test procedures
5.11 Capability approval
6 Test and measurement procedures
6.1 Standard atmospheric conditions for electrical and
optical measurements
6.2 Physical examination
6.2.1 Visual examination
6.2.2 Dimensions
6.2.3 Permanence of marking
6.3 Electrical and optical measurements
6.3.1 General conditions and precautions
6.4 Environmental tests
Annex A (informative) Cross references index
Annex B (informative) Examples of outline drawings of
liquid-crystal display cells
Annex C (normative) Orientation of LCD modules
Annex D (normative) Lot tolerance percentage defective
(LTPD) sampling plans
Bibliography
Defines general procedures for quality assessment to be used in the IECQ system and gives general rules for measuring methods of electrical and optical characteristics, rules for climatic and mechanical tests, and rules for endurance tests.This consolidated version consists of the first edition (1998) and its amendment 1 (2003). Therefore, no need to order amendment inaddition to this publication.
| DevelopmentNote |
Supersedes IEC 60747-5 (07/2004) Also numbered as BS EN 61747-1. (01/2006) Stability Date: 2016. (11/2012)
|
| DocumentType |
Standard
|
| Pages |
81
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NEN IEC 61747-1 : 1998 | Identical |
| NEN EN IEC 61747-1 : 1999 AMD 1 2003 | Identical |
| I.S. EN 61747-1:2000 AMD 1 2003 | Identical |
| PN EN 61747-1 : 2005 | Identical |
| SN EN 61747-1 : 1999 AMD 1 2003 | Identical |
| UNE-EN 61747-1:1999 | Identical |
| BIS IS 15934-1 : 2012 | Identical |
| BS IEC 61747-1 : 1998 AMD 10788 | Identical |
| CEI EN 61747-1 : 2004 | Identical |
| EN 61747-1:1999/A1:2003 | Identical |
| DIN EN 61747-1:2003-12 | Identical |
| I.S. EN 61747-2-1:2013 | LIQUID CRYSTAL DISPLAY DEVICES - PART 2-1: PASSIVE MATRIX MONOCHROME LCD MODULES - BLANK DETAIL SPECIFICATION (IEC 61747-2-1:2013 (EQV)) |
| 10/30234593 DC : 0 | BS EN 61747-5-4 ED.1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 5-4: ENVIRONMENTAL, ENDURANCE AND MECHANICALTEST METHODS - MECHANICAL TESTING GUIDELINES FOR DISPLAY COVER GLASS FOR DISPLAY COVER GLASS FOR MOBILE DEVICES |
| BS IEC 62679-1-1:2014 | Electronic paper displays Terminology |
| CEI EN 61747-4-1 : 2005 | LIQUID CRYSTAL DISPLAY DEVICES - PART 4-1: MATRIX COLOUR LCD MODULES - ESSENTIAL RATINGS AND CHARACTERISTICS |
| CEI EN 61747-10-1 : 2014 | LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
| CEI EN 61747-30-1 : 2013 | LIQUID CRYSTAL DISPLAY DEVICES - PART 30-1: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - TRANSMISSIVE TYPE |
| I.S. EN 61747-6-3:2011 | LIQUID CRYSTAL DISPLAY DEVICES - PART 6-3: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - MOTION ARTIFACT MEASUREMENT OF ACTIVE MATRIX LIQUID CRYSTAL DISPLAY MODULES |
| EN 61747-5-2 : 2011 | LIQUID CRYSTAL DISPLAY DEVICES - PART 5-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - VISUAL INSPECTION OF ACTIVE MATRIX COLOUR LIQUID CRYSTAL DISPLAY MODULES |
| EN 61747-5-3:2010 | LIQUID CRYSTAL DISPLAY DEVICES - PART 5-3: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - GLASS STRENGTH AND RELIABILITY |
| EN 61747-2:1999 | Liquid crystal and solid-state display devices - Part 2: Liquid crystal display modules - Sectional specification |
| EN 61747-6-3 : 2011 | LIQUID CRYSTAL DISPLAY DEVICES - PART 6-3: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - MOTION ARTIFACT MEASUREMENT OF ACTIVE MATRIX LIQUID CRYSTAL DISPLAY MODULES |
| CEI EN 62595-2 : 2013 | LCD BACKLIGHT UNIT - PART 2: ELECTRO-OPTICAL MEASUREMENT METHODS OF LED BACKLIGHT UNIT |
| 14/30273272 DC : 0 | BS ISO 18383 - PHOTOGRAPHY - DIGITAL CAMERAS - SPECIFICATION GUIDELINE |
| 02/206627 DC : DRAFT JUN 2002 | IEC 61747-4-2. ED.1.0 - LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 4-2: MATRIX COLOUR LCD MODULES - ESSENTIAL RATING AND CHARACTERISTICS |
| BS IEC 61747-3 : 1998 AMD 10786 | LIQUID CRYSTAL AND SOLID STATE DISPLAY DEVICES - SECTIONAL SPECIFICATION FOR LIQUID CRYSTAL DISPLAY (LCD) CELLS |
| NF EN 61747-5-3 : 2010 | LIQUID CRYSTAL DISPLAY DEVICES - PART 5-3: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - GLASS STRENGTH AND RELIABILITY |
| I.S. EN 61747-30-1:2012 | LIQUID CRYSTAL DISPLAY DEVICES - PART 30-1: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - TRANSMISSIVE TYPE (IEC 61747-30-1:2012 (EQV)) |
| 07/30168025 DC : 0 | BS EN 61747-5-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 5-2: VISUAL INSPECTION OF ACTIVE MATRIX COLOUR LIQUID CRYSTAL DISPLAY MODULES |
| CEI EN 61747-5-2 : 2012 | LIQUID CRYSTAL DISPLAY DEVICES - PART 5-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - VISUAL INSPECTION OF ACTIVE MATRIX COLOUR LIQUID CRYSTAL DISPLAY MODULES |
| BS EN 61747-3-1:2006 | Liquid crystal display devices Liquid crystal display (LCD) cells. Blank detail specification |
| I.S. EN 61747-4-1:2005 | LIQUID CRYSTAL DISPLAY DEVICES - PART 4-1: MATRIX COLOUR LCD MODULES - ESSENTIAL RATINGS AND CHARACTERISTICS |
| CEI EN 61747-4 : 2013 | LIQUID CRYSTAL DISPLAY DEVICES - PART 4: LIQUID CRYSTAL DISPLAY MODULES AND CELLS - ESSENTIAL RATINGS AND CHARACTERISTICS |
| I.S. EN 61747-10-1:2013 | LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV)) |
| CEI EN 61747-6-3 : 2012 | LIQUID CRYSTAL DISPLAY DEVICES - PART 6-3: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - MOTION ARTIFACT MEASUREMENT OF ACTIVE MATRIX LIQUID CRYSTAL DISPLAY MODULES |
| I.S. EN 61747-5-3:2010 | LIQUID CRYSTAL DISPLAY DEVICES - PART 5-3: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - GLASS STRENGTH AND RELIABILITY |
| 09/30199792 DC : 0 | BS EN 61747-6-1 ED.2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 6-1: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - TRANSMISSIVE TYPE |
| BS EN 61747-10-1:2013 | Liquid crystal display devices Environmental, endurance and mechanical test methods. Mechanical |
| BS ISO 18383:2015 | Photography. Digital cameras. Specification guideline |
| 07/30170138 DC : 0 | BS EN 61747-6-3 - LIQUID CRYSTAL DISPLAY DEVICES - PART 6-3: MOTION ARTIFACT MEASUREMENT OF ACTIVE MATRIX LIQUID CRYSTAL DISPLAY MODULES |
| BIS IS 15934-2 : 2012 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 2: LIQUID CRYSTAL DISPLAY MODULES - SECTIONAL SPECIFICATION |
| BS EN 61747-4:2012 | Liquid crystal display devices Liquid crystal display modules and cells. Essential ratings and characteristics |
| 11/30251376 DC : 0 | BS EN 61747-40-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 40-1: MECHANICAL TESTING GUIDELINES FOR DISPLAY COVER GLASS FOR MOBILE DEVICES |
| BS EN 61747-6-3:2011 | Liquid crystal display devices Measuring methods for liquid crystal display modules. Motion artifact measurement of active matrix liquid crystal display modules |
| IEC TR 62728:2011 | Display technologies - LCD, PDP and OLED - Overview and explanation of differences in terminology |
| CEI EN 61747-6-2 : 2012 | LIQUID CRYSTAL DISPLAY DEVICES - PART 6-2: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - REFLECTIVE TYPE |
| IEC 61747-5-3:2009 | Liquid crystal display devices - Part 5-3: Environmental, endurance and mechanical test methods - Glass strength and reliability |
| I.S. EN 61747-5-2:2011 | LIQUID CRYSTAL DISPLAY DEVICES - PART 5-2: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - VISUAL INSPECTION OF ACTIVE MATRIX COLOUR LIQUID CRYSTAL DISPLAY MODULES |
| CEI EN 61747-5-3 : 2011 | LIQUID CRYSTAL DISPLAY DEVICES - PART 5-3: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - GLASS STRENGTH AND RELIABILITY |
| BIS IS 16178 : 2014 | DISPLAY TECHNOLOGIES LCD, PDP AND OLED - OVERVIEW AND EXPLANATION OF DIFFERENCES IN TERMINOLOGY |
| IEC 62679-1-1:2014 | Electronic paper displays - Part 1-1: Terminology |
| IEC 62595-2-1:2016 | Display lighting unit - Part 2-1: Electro-optical measuring methods of LED backlight unit |
| IEC 61747-10-1:2013 | Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical |
| I.S. EN 61747-4:2012 | LIQUID CRYSTAL DISPLAY DEVICES - PART 4: LIQUID CRYSTAL DISPLAY MODULES AND CELLS - ESSENTIAL RATINGS AND CHARACTERISTICS (IEC 61747-4:2012 (EQV)) |
| 09/30192488 DC : 0 | BS EN 62595 ED.1 - MEASUREMENT METHODS OF LED BACKLIGHT UNIT FOR LIQUID CRYSTAL DISPLAYS |
| 12/30244653 DC : 0 | BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION |
| BS EN 61747-2-1:2013 | Liquid crystal display devices Passive matrix monochrome LCD modules. Blank detail specification |
| BS EN 62595-2:2013 | LCD backlight unit Electro-optical measurement methods of LED backlight unit |
| BS EN 61747-5-2:2011 | Liquid crystal display devices Environmental, endurance and mechanical test methods. Visual inspection of active matrix colour liquid crystal display modules |
| CEI EN 61747-3 : 2007 | LIQUID CRYSTAL DISPLAY DEVICES - PART 3: LIQUID CRYSTAL DISPLAY (LCD) CELLS - SECTIONAL SPECIFICATION |
| BIS IS 15934-4-1 : 2014 | LIQUID CRYSTAL DISPLAY DEVICES - PART 4: MATRIX COLOUR LCD MODULES - SECTION 1: ESSENTIAL RATINGS AND CHARACTERISTICS |
| PD IEC/TR 62728:2011 | Display technologies. LCD, PDP and OLED. Overview and explanation of differences in terminology |
| I.S. EN 62595-2:2013 | LCD BACKLIGHT UNIT - PART 2: ELECTRO-OPTICAL MEASUREMENT METHODS OF LED BACKLIGHT UNIT (IEC 62595-2:2012 (EQV)) |
| BS IEC 61747-40-1:2013 | Liquid crystal display devices Mechanical testing of display cover glass for mobile devices. Guidelines |
| ISO 18383:2015 | Photography — Digital cameras — Specification guideline |
| IEC 61747-6-3:2011 | Liquid crystal display devices - Part 6-3: Measuring methods for liquid crystal display modules - Motion artifact measurement of active matrix liquid crystal display modules |
| IEC 61747-4:2012 | Liquid crystal display devices - Part 4: Liquid crystal display modules and cells - Essential ratings and characteristics |
| IEC 61747-6-2:2011 | Liquid crystal display devices - Part 6-2: Measuring methods for liquid crystal display modules - Reflective type |
| IEC 61747-2-1:2013 | Liquid crystal display devices - Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification |
| IEC 61747-30-1:2012 | Liquid crystal display devices - Part 30-1: Measuring methods for liquid crystal display modules - Transmissive type |
| IEC 62595-2:2012 | LCD backlight unit - Part 2: Electro-optical measurement methods of LED backlight unit |
| IEC 61747-5-2:2011 | Liquid crystal display devices - Part 5-2: Environmental, endurance and mechanical test methods - Visual inspection of active matrix colour liquid crystal display modules |
| EN 61747-3 : 2006 | LIQUID CRYSTAL DISPLAY DEVICES - PART 3: LIQUID CRYSTAL DIPLAY (LCD) CELLS - SECTIONAL SPECIFICATION |
| EN 61747-2-1:2013 | Liquid crystal display devices - Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification |
| BS EN 61747-30-1:2012 | Liquid crystal display devices Measuring methods for liquid crystal display modules. Transmissive type |
| BS EN 61747-5-3:2010 | Liquid crystal display devices Environmental, endurance and mechanical test methods. Glass strength and reliability |
| BS EN 61747-4-1:2004 | Liquid crystal display devices Matrix colour LCD modules. Essential ratings and characteristics |
| BS EN 61747-6-2:2011 | Liquid crystal display devices Measuring methods for liquid crystal display modules. Reflective type |
| CEI EN 61747-2-1 : 2014 | LIQUID CRYSTAL DISPLAY DEVICES - PART 2-1: PASSIVE MATRIX MONOCHROME LCD MODULES - BLANK DETAIL SPECIFICATION |
| 11/30247384 DC : 0 | BS EN 61747-4 - LIQUID CRYSTAL DISPLAY DEVICES - PART 4: LIQUID CRYSTAL DISPLAY MODULES AND CELLS - ESSENTIAL RATINGS AND CHARACTERISTICS |
| BS EN 61747-3:2006 | Liquid crystal display devices Liquid crystal display (LCD) cells. Sectional specification |
| 18/30373509 DC : DRAFT APR 2018 | BS EN 61747-30-3 - LIQUID CRYSTAL DISPLAY DEVICES - PART 30-3: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - MOTION ARTIFACT MEASUREMENT OF ACTIVE MATRIX LIQUID CRYSTAL DISPLAY MODULES |
| BIS IS 15934-4 : 2014 | LIQUID CRYSTAL AND SOLID STATE DISPLAY DEVICES - PART 4: LIQUID CRYSTAL DISPLAY MODULES AND CELLS - ESSENTIAL RATINGS AND CHARACTERISTICS |
| 07/30161587 DC : 0 | BS EN 61747-6-2 - LIQUID CRYSTAL DISPLAY DEVICES - PART 6-2: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - REFLECTIVE TYPE |
| I.S. EN 61747-3:2006 | LIQUID CRYSTAL DISPLAY DEVICES - PART 3: LIQUID CRYSTAL DIPLAY (LCD) CELLS - SECTIONAL SPECIFICATION |
| I.S. EN 61747-6-2:2011 | LIQUID CRYSTAL DISPLAY DEVICES - PART 6-2: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - REFLECTIVE TYPE |
| EN 61747-4:2012 | Liquid crystal display devices - Part 4: Liquid crystal display modules and cells - Essential ratings and characteristics |
| EN 61747-10-1:2013 | Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods – Mechanical |
| EN 61747-6-2:2011 | Liquid crystal display devices - Part 6-2: Measuring methods for liquid crystal display modules - Reflective type |
| EN 62595-2:2013 | LCD backlight unit - Part 2: Electro-optical measurement methods of LED backlight unit |
| EN 61747-30-1 : 2012 | LIQUID CRYSTAL DISPLAY DEVICES - PART 30-1: MEASURING METHODS FOR LIQUID CRYSTAL DISPLAY MODULES - TRANSMISSIVE TYPE (IEC 61747-30-1:2012) |
| EN 61747-4-1:2004 | Liquid crystal display devices - Part 4-1: Matrix colour LCD modules - Essential ratings and characteristics |
| EN 61747-3-1 : 2006 | LIQUID CRYSTAL DISPLAY DEVICES - PART 3-1: LIQUID CRYSTAL DISPLAY (LCD) CELLS - BLANK DETAIL SPECIFICATION |
| IEC 60050-351:2013 | International Electrotechnical Vocabulary (IEV) - Part 351: Control technology |
| IEC 60747-4:2007+AMD1:2017 CSV | Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors |
| IEC 60068-4:1987 | Environmental testing. Part 4: Information for specification writers - Test summaries |
| IEC 60050-31:1959 | International Electrotechnical Vocabulary (IEV) - Part 31: Signalling and security apparatus for railways |
| IEC 60050-541:1990 | International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits |
| IEC 60050-131:2002 | International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory |
| IEC 60050-394:2007 | International Electrotechnical Vocabulary (IEV) - Part 394: Nuclear instrumentation - Instruments, systems, equipment and detectors |
| IEC 60747-7:2010 | Semiconductor devices - Discrete devices - Part 7: Bipolar transistors |
| IEC 60068-2-5:2010 | Environmental testing - Part 2-5: Tests - Test Sa: Simulated solar radiation at ground level and guidance for solar radiation testing |
| IEC 60068-2-70:1995 | Environmental testing - Part 2-70: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands |
| IEC 60068-2-18:2017 | Environmental testing - Part 2-18: Tests - Test R and guidance: Water |
| IEC 60050-702:1992 | International Electrotechnical Vocabulary (IEV) - Part 702: Oscillations, signals and related devices |
| IEC 60747-7-2:1989 | Semiconductor devices - Discrete devices - Part 7: Bipolartransistors - Section Two: Blank detail specification forcase-rated bipolar transistors for low-frequency amplification |
| IEC 60068-2-43:2003 | Environmental testing - Part 2-43: Tests - Test Kd: Hydrogen sulphide test for contacts and connections |
| IEC 60068-2-68:1994 | Environmental testing - Part 2-68: Tests - Test L: Dust and sand |
| IEC 60050-731:1991 | International Electrotechnical Vocabulary (IEV) - Part 731: Optical fibre communication |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60617-9:1996 | Graphical symbols for diagrams - Part 9: Telecommunications - Switching and peripheral equipment |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| IEC 60050-806:1996 | International Electrotechnical Vocabulary (IEV) - Part 806: Recording and reproduction of audio and video |
| IEC 60748-5:1997 | Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits |
| IEC 60747-3:2013 | Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes |
| IEC 60747-12-6:1997 | Semiconductor devices - Part 12-6: Optoelectronic devices - Blank detail specification for avalanche photodiodes with/without pigtail, for fibre optic systems or subsystems |
| IEC 60191-2R:1995 | Sixteenth supplement |
| IEC 60747-12:1991 | Semiconductor devices - Part 12: Sectional specification foroptoelectronic devices |
| IEC 60748-2-1:1991 | Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays) |
| IEC 60050-716-1:1995 | International Electrotechnical Vocabulary (IEV) - Part 716-1: Integrated services digital network (ISDN) - General aspects |
| IEC 60050-691:1973 | International Electrotechnical Vocabulary (IEV) - Part 691: Tariffs for electricity |
| IEC 60191-2G:1978 | Seventh supplement |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60050-811:1991 | International Electrotechnical Vocabulary (IEV) - Part 811: Electric traction |
| IEC 60050-481:1996 | International Electrotechnical Vocabulary (IEV) - Part 481: Primary cells and batteries |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60191-3C:1987 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Third supplement |
| IEC 60050-531:1974 | International Electrotechnical Vocabulary (IEV) - Part 531: Electronic tubes |
| IEC 60068-3-1A:1978 | Environmental testing - Part 3: Background information - First supplement |
| IEC 60748-11-1:1992 | Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits |
| IEC 60068-2-60:2015 RLV | Environmental testing - Part 2-60: Tests - Test Ke: Flowing mixed gas corrosion test |
| IEC 60068-5-2:1990 | Environmental testing - Part 5-2: Guide to drafting of test methods - Terms and definitions |
| IEC 60747-7-1:1989 | Semiconductor devices - Discrete devices - Part 7: Bipolartransistors - Section One: Blank detail specification forambient-rated bipolar transistors for low and high-frequencyamplification |
| IEC 60747-8-1:1987 | Semiconductor devices - Discrete devices - Part 8: Field-effecttransistors - Section One: Blank detail specification forsingle-gate field-effect transistors up to 5 W and 1 GHz |
| IEC 60050-605:1983 | International Electrotechnical Vocabulary (IEV) - Part 605: Generation, transmission and distribution of electricity - Substations |
| IEC 60050-601:1985 | International Electrotechnical Vocabulary (IEV) - Part 601: Generation, transmission and distribution of electricity - General |
| IEC 60050-721:1991 | International Electrotechnical Vocabulary (IEV) - Part 721: Telegraphy, facsimile and data communication |
| IEC 60617-10:1996 | Graphical symbols for diagrams - Part 10: Telecommunications - Transmission |
| IEC 60068-3-1:2011 | Environmental testing - Part 3-1: Supporting documentation and guidance - Cold and dry heat tests |
| IEC 60050-60:1970 | International Electrotechnical Vocabulary (IEV) - Part 60: Radiocommunications. |
| IEC 60050-471:2007 | International Electrotechnical Vocabulary (IEV) - Part 471: Insulators |
| IEC 60191-2D:1971 | Fourth supplement |
| IEC 60068-2-49:1983 | Basic environmental testing procedures - Part 2-49: Tests - Guidance to test Kc: Sulphur dioxide test for contacts and connections |
| ISO 2859:1974 | Sampling procedures and tables for inspection by attributes |
| IEC 60050-411:1996 | International Electrotechnical Vocabulary (IEV) - Part 411: Rotating machinery |
| IEC 60050-151:2001 | International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices |
| ISO 1101:2017 | Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
| IEC 60617-3:1996 | Graphical symbols for diagrams - Part 3: Conductors and connecting devices |
| IEC 60748-2-7:1992 | Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories |
| IEC 60050-441:1984 | International Electrotechnical Vocabulary (IEV) - Part 441: Switchgear, controlgear and fuses |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60068-2-57:2013 | Environmental testing - Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method |
| IEC 60068-2-50:1983 | Environmental testing. Part 2: Tests. Tests Z/AFc: Combined cold/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens |
| IEC 60050-212:2010 | International Electrotechnical Vocabulary (IEV) - Part 212: Electrical insulating solids, liquids and gases |
| IEC 60191-2L:1982 | Eleventh supplement |
| IEC 60617-6:1996 | Graphical symbols for diagrams - Part 6: Production and conversion of electrical energy |
| IEC 60050-845:1987 | International Electrotechnical Vocabulary (IEV) - Part 845: Lighting |
| IEC 60068-5-1:1991 | Environmental testing - Part 5-1: Guide to drafting of test methods - General principles |
| IEC 60050-722:1992 | International Electrotechnical Vocabulary (IEV) - Part 722: Telephony |
| IEC 60068-3-2:1976 | Basic environmental testing procedures - Part 3-2: Background information - Combined temperature/low air pressure tests |
| IEC 60050-221:1990 | International Electrotechnical Vocabulary (IEV) - Part 221: Magnetic materials and components |
| IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
| IEC 60050-486:1991 | International Electrotechnical Vocabulary (IEV) - Part 486: Secondary cells and batteries |
| IEC 60068-2-39:2015 | Environmental testing - Part 2-39: Tests - Tests and guidance: Combined temperature or temperature and humidity with low air pressure tests |
| IEC 60050-704:1993 | International Electrotechnical Vocabulary (IEV) - Part 704: Transmission |
| IEC 60191-1B:1970 | Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement |
| IEC 60747-12-5:1997 | Semiconductor devices - Part 12-5: Optoelectronic devices - Blank detail specification for pin-photodiodes with/without pigtail, for fibre optic systems or subsystems |
| IEC 60747-2-1:1989 | Semiconductor devices - Discrete devices - Part 2: Rectifier diodes- Section One: Blank detail specification for rectifier diodes(including avalanche rectifier diodes), ambient and case-rated, upto 100 A |
| IEC 60050-891:1998 | International Electrotechnical Vocabulary (IEV) - Part 891: Electrobiology |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| IEC 60747-2-2:1993 | Semiconductor devices - Discrete devices - Part 2: Rectifier diodes - Section 2: Blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100 A |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
| IEC 60191-2F:1976 | Sixth supplement |
| IEC 60748-2-6:1991 | Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits |
| IEC 60747-7-3:1991 | Semiconductor devices - Discrete devices - Part 7: Bipolartransistors - Section three: Blank detail specification for bipolartransistors for switching applications |
| IEC 60068-2-31:2008 | Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens |
| IEC 60191-2K:1981 | Tenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60747-5-2:1997+AMD1:2002 CSV | Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics |
| IEC 60748-4-2:1993 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC) |
| IEC 60050-551:1998 | International Electrotechnical Vocabulary (IEV) - Part 551: Power electronics |
| IEC 60191-1A:1969 | Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - First supplement |
| IEC 60068-2-64:2008 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
| IEC 60068-2-53:2010 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| IEC 60191-1C:1974 | Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Third supplement |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| IEC 60068-3-3:1991 | Environmental testing - Part 3-3: Guidance - Seismic test methods for equipments |
| IEC 60747-5-3:1997+AMD1:2002 CSV | Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods |
| IEC 60050-801:1994 | International Electrotechnical Vocabulary (IEV) - Part 801: Acoustics and electroacoustics |
| IEC 60050-426:2008 | International Electrotechnical Vocabulary (IEV) - Part 426: Equipment for explosive atmospheres |
| IEC 60747-3-1:1986 | Semiconductor devices - Discrete devices - Part 3: Signal(including switching) and regulator diodes - Section One: Blankdetail specification for signal diodes, switching diodes andcontrolled-avalanche diodes |
| IEC 60191-2H:1978 | Eigth supplement |
| IEC 60191-3B:1978 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60617-5:1996 | Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes |
| IEC 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| IEC 60747-12-3:1998 | Semiconductor devices - Part 12-3: Optoelectronic devices - Blank detail specification for light-emitting diodes- Display application |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60191-2A:1967 | First supplement to Publication 191-2 (1966) Mechanical standardization of semiconductor devices - Part 2: Dimensions Part 2: Dimensions |
| IEC 60191-2B:1969 | Second supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60050-715:1996 | International Electrotechnical Vocabulary (IEV) - Part 715: Telecommunication networks, teletraffic and operation |
| IEC 60747-3-2:1986 | Semiconductor devices - Discrete devices - Part 3: Signal(including switching) and regulator diodes - Section Two: Blankdetail specification for voltage-regulator diodes andvoltage-reference diodes,excluding temperature-compensatedprecision reference diodes |
| IEC 60068-2-47:2005 | Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests |
| IEC 60748-11:1990 | Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60050-55:1970 | International Electrotechnical Vocabulary (IEV) - Part 55: Telegraphy and telephony |
| IEC 60747-8:2010 | Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
| IEC 60050-131A:1982 | International Electrotechnical Vocabulary (IEV) - Part 131A: Electric and magnetic circuits - Polyphase circuits and components |
| ISO 8601:2004 | Data elements and interchange formats Information interchange Representation of dates and times |
| IEC 60050-421:1990 | International Electrotechnical Vocabulary (IEV) - Part 421: Power transformers and reactors |
| IEC 60050-701:1988 | International Electrotechnical Vocabulary (IEV) - Part 701: Telecommunications, channels and networks |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60050-603:1986 | International Electrotechnical Vocabulary (IEV) - Part 603: Generation, transmission and distribution of electricity - Power systems planning and management |
| IEC 60027-3:2002 | Letter symbols to be used in electrical technology - Part 3: Logarithmic and related quantities, and their units |
| IEC 60050-714:1992 | International Electrotechnical Vocabulary (IEV) - Part 714: Switching and signalling in telecommunications |
| IEC 60050-466:1990 | International Electrotechnical Vocabulary (IEV) - Part 466: Overhead lines |
| IEC 60747-12-2:1995 | Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems |
| IEC 60050-446:1983 | International Electrotechnical Vocabulary (IEV) - Part 446: Electrical relays |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60617-1:1985 | Graphical symbols for diagrams. Part 1: General information, general index. Cross-reference tables |
| IEC 60191-2J:1980 | Ninth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60068-2-10:2005 | Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth |
| IEC 60191-2S:1995 | Seventeenth supplement |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60747-8-3:1995 | Semiconductor devices - Discrete devices - Part 8: Field-effect transistors - Section 3: Blank detail specification for case-rated field effect transistors for switching applications |
| IEC 60068-2-9:1975 | Environmental testing - Part 2: Tests. Guidance for solar radiation testing |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60050-821:1998 | International Electrotechnical Vocabulary (IEV) - Part 821: Signalling and security apparatus for railways |
| IEC 60748-2-5:1992 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB) |
| IEC 60617-13:1993 | Graphical symbols for diagrams - Part 13: Analogue elements |
| IEC 60068-2-61:1991 | Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence |
| IEC 60191-3D:1988 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fourth supplement |
| IEC 60050-726:1982 | International Electrotechnical Vocabulary (IEV) - Part 726: Transmission lines and waveguides |
| IEC 60191-2C:1970 | Third supplement |
| IEC 60050-841:2004 | International Electrotechnical Vocabulary (IEV) - Part 841: Industrial electroheat |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
| IEC 60617-7:1996 | Graphical symbols for diagrams - Part 7: Switchgear, controlgear and protective devices |
| IEC 60617-8:1996 | Graphical symbols for diagrams - Part 8: Measuring instruments, lamps and signalling devices |
| IEC 60068-2-42:2003 | Environmental testing - Part 2-42: Tests - Test Kc: Sulphur dioxide test for contacts and connections |
| IEC 60747-12-4:1997 | Semiconductor devices - Part 12-4: Optoelectronic devices - Blank detail specification for pin-FET modules with/without pigtail, for fibre optic systems or subsystems |
| IEC 60050-121:1998 | International Electrotechnical Vocabulary (IEV) - Part 121: Electromagnetism |
| IEC 60050-321:1986 | International Electrotechnical Vocabulary (IEV) - Part 321: Instrument transformers |
| IEC 60050-461:2008 | International Electrotechnical Vocabulary (IEV) - Part 461: Electric cables |
| IEC 60191-2Q:1990 | fifteenth complement |
| IEC 60748-4-1:1993 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC) |
| IEC 60050-561:2014 | International Electrotechnical Vocabulary (IEV) - Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection |
| IEC 60191-3A:1976 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement |
| IEC 60748-2-9:1994 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories |
| IEC 60050-826:2004 | International Electrotechnical Vocabulary (IEV) - Part 826: Electrical installations |
| IEC 60748-22:1997 | Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
| IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
| IEC 60068-2-75:2014 | Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests |
| IEC 60748-3-1:1991 | Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers |
| IEC 60027-2:2005 | Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60748-2-10:1994 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories |
| IEC 60747-5-1:1997+AMD1:2001+AMD2:2002 CSV | Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General |
| IEC 60068-2-28:1990 | Environmental testing - Part 2: Tests. Guidance for damp heat tests |
| IEC 60748-2:1997 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits |
| IEC 60068-2-8:1960 | Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test H: Storage |
| IEC 60617-4:1996 | Graphical symbols for diagrams - Part 4: Passive components |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| IEC 60191-5:1997 | Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB) |
| IEC 60050-26:1968 | International Electrotechnical Vocabulary (IEV) - Part 26: Nuclear power plants for electric energy generation |
| IEC 60191-3F:1994 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Sixth supplement |
| IEC 60748-20-1:1994 | Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60050-111:1996 | International Electrotechnical Vocabulary (IEV) - Part 111: Physics and chemistry |
| IEC 60747-8-2:1993 | Semiconductor devices - Discrete devices - Part 8: Field-effect transistors - Section two: Blank detail specification for field-effect transistors for case-rated power amplifier applications |
| IEC 60748-2-8:1993 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories |
| IEC 60027-4:2006 | Letter symbols to be used in electrical technology - Part 4: Rotating electric machines |
| IEC 60191-2U:1997 | Nineteenth supplement |
| IEC 60747-6:2016 | Semiconductor devices - Part 6: Discrete devices - Thyristors |
| IEC 60068-2-48:1982 | Environmental testing - Part 2: Tests. Guidance on the application of the tests of IEC 68 to simulate the effects of storage |
| IEC 60068-2-55:2013 | Environmental testing - Part 2-55: Tests - Test Ee and guidance - Loose cargo testing including bounce |
| IEC 60050-705:1995 | International Electrotechnical Vocabulary (IEV) - Part 705: Radio wave propagation |
| IEC 60050-602:1983 | International Electrotechnical Vocabulary (IEV) - Part 602: Generation, transmission and distribution of electricity - Generation |
| IEC 60748-21-1:1997 | Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures |
| IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60748-21:1997 | Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures |
| IEC 60191-2N:1987 | Thirteenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60050-448:1995 | International Electrotechnical Vocabulary (IEV) - Part 448: Power system protection |
| IEC 60027-2B:1980 | Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60748-3:1986 | Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits |
| IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| IEC 60050-712:1992 | International Electrotechnical Vocabulary (IEV) - Part 712: Antennas |
| IEC 60050-851:2008 | International Electrotechnical Vocabulary (IEV) - Part 851: Electric welding |
| IEC 60748-2-4:1992 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB |
| IEC 60747-12-1:1995 | Semiconductor devices - Part 12: Optoelectronic devices - Section 1: Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fibre optic systems and sub-systems |
| IEC 60747-6-3:1993 | Semiconductor devices - Discrete devices - Part 6: Thyristors - Section Three: Blank detail specification for reverse blocking triode thyristors, ambient and case-rated, for currents greater than 100 A |
| IEC 60050-581:2008 | International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment |
| IEC 60068-2-52:2017 | Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) |
| IEC 60050-723:1997 | International Electrotechnical Vocabulary (IEV) - Part 723: Broadcasting: Sound, television, data |
| IEC 60068-2-65:2013 | Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method |
| IEC 60747-11:1985 | Semiconductor devices. Discrete devices. Part 11: Sectionalspecification for discrete devices |
| IEC 60050-881:1983 | International Electrotechnical Vocabulary (IEV) - Part 881: Radiology and radiological physics |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 60027-2A:1975 | Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics - First supplement |
| IEC 60747-2:2016 | Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
| IEC 60050-371:1984 | International Electrotechnical Vocabulary (IEV) - Part 371: Telecontrol |
| IEC 60191-3E:1990 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fifth supplement |
| IEC 60748-4:1997 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
| IEC 60191-2P:1988 | Fourteenth supplement |
| IEC 60617-11:1996 | Graphical symbols for diagrams - Part 11: Architectural and topographical installation plans and diagrams |
| IEC 60068-2-51:1983 | Environmental testing. Part 2: Tests. Tests Z/BFc: Combined dry heat/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens |
| IEC 60050-393:2003 | International Electrotechnical Vocabulary (IEV) - Part 393: Nuclear instrumentation - Physical phenomena and basic concepts |
| IEC 60617-2:1996 | Graphical symbols for diagrams - Partie 2: Symbol elements, qualifying symbols and other symbols having general application |
| IEC 60191-2M:1983 | Twelfth supplement |
| IEC 60191-2E:1974 | Fifth supplement |
| IEC 60747-6-2:1991 | Semiconductor devices - Discrete devices - Part 6: Thyristors -Section Two: Blank detail specification for bidirectional triodethyristors (triacs), ambient or case-rated, up to 100 A |
| IEC 60617-12:1997 | Graphical symbols for diagrams - Part 12: Binary logic elements |
| IEC 60747-6-1:1989 | Semiconductor devices - Discrete devices - Part 6: Thyristors -Section One: Blank detail specification for reverse blocking triodethyristors, ambient and case-rated, up to 100 A |
| IEC 60068-2-46:1982 | Basic environmental testing procedures - Part 2-46: Tests - Guidance to test Kd: Hydrogen sulphide test for contacts and connections |
| IEC 60050-725:1994 | International Electrotechnical Vocabulary (IEV) - Part 725: Space radiocommunications |
| IEC 60068-2-59:1990 | Environmental testing. Part 2: Tests. Test Fe: Vibration - Sine-beat method |
| IEC 60748-22-1:1997 | Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
| IEC 60191-2T:1996 | Eighteenth supplement |
| IEC 60068-2-56:1988 | Environmental testing - Part 2: Tests. Test Cb: Damp heat, steady state, primarily for equipment |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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