IEC 61760-1:2006
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
31-12-2021
Superseded by
Language(s)
English, English - French
Published date
10-04-2006
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope and object
1.1 Scope
1.2 Object
2 Normative references
3 Terms and definitions
4 Requirements for component design and component
specifications
4.1 General requirement
4.2 Packaging
4.3 Labelling of product packaging
4.4 Component marking
4.5 Storage and transportation
4.6 Component outline and design
4.7 Mechanical stress
4.8 Component reliability assurance
4.9 Additional requirements for compatibility with
lead-free soldering
5 Specification of assembly process conditions
5.1 General
5.2 Securing the component on the substrate prior
to soldering
5.3 Mounting methods
5.4 Cleaning (where applicable)
5.5 Removal and/or replacement of SMDs
6 Typical process conditions
6.1 Soldering processes, temperature/time profiles
6.2 Typical cleaning conditions for assemblies
7 Requirements for components and component specifications
related to suitability with various mounting processes
7.1 General
7.2 Wettability
7.3 Resistance to dissolution of metallization
7.4 Resistance to soldering heat
7.5 Resistance to cleaning solvent
7.6 Soldering profiles
7.7 Bonding strength test for the component glue interface
test
Bibliography
IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
| Committee |
TC 91
|
| DevelopmentNote |
A Bilingual edition has been published on 19/02/2014. (02/2014) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| OVE/ONORM EN 61760-1 : 2006 | Identical |
| NEN EN IEC 61760-1 : 2006 | Identical |
| PN EN 61760-1 : 2006 | Identical |
| BS EN 61760-1:2006 | Identical |
| EN 61760-1:2006 | Identical |
| NF EN 61760-1 : 2014 | Identical |
| DIN EN 61760-1:2006-10 | Identical |
| CEI EN 61760-1 : 2007 | Identical |
| I.S. EN 61760-1:2006 | Identical |
| UNE-EN 61760-1:2006 | Identical |
| PNE-prEN 61760-1 | Identical |
| BS EN 62137-3:2012 | Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints |
| CEI EN 62137-1-4 : 2010 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
| I.S. EN 62137-1-5:2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
| IEC 62884-3:2018 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 3: Frequency aging test methods |
| NF EN 60512-16-21 : 2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| I.S. EN 61810-1:2015 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| NF EN 62314 : 2006 | SOLID-STATE RELAYS |
| 14/30311384 DC : 0 | BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| 11/30258040 DC : 0 | BS EN 61810-1 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL REQUIREMENTS |
| 06/30155911 DC : DRAFT SEP 2006 | BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| BS EN 61188-5-1:2002 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements |
| BS EN 140101:2008 | Blank Detail Specification. Fixed low power film resistors |
| I.S. EN 60738-1:2006 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 140402:2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| NF EN 60115-2 : 2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| EN 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| EN 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| EN 140101:2008 | Blank Detail Specification: Fixed low power film resistors |
| EN 62137-1-3:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| EN 60738-1:2006/A1:2009 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| EN 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| EN 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
| EN 60115-2:2015 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| EN 62137:2004/corrigendum:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
| EN 140402:2015/A1:2016 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60738-1 : 2006 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 62137-1-5 : 2010 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
| 02/203604 DC : DRAFT MAR 2002 | IEC 61810-1. ED.2 - ELEMENTARY RELAYS - PART 1: SAFETY-RELATED AND GENERAL REQUIREMENTS |
| 12/30254697 DC : 0 | BS ISO 16525-9 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS |
| BS EN 62314:2006 | Solid-state relays |
| 07/30161526 DC : 0 | BS EN 60115-8 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| NF EN 62137-1-5 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
| BS ISO 16525-9:2014 | Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics |
| BS EN 62137-1-5:2009 | Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test |
| 09/30207307 DC : 0 | BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
| BS EN 61810-1:2015 | Electromechanical elementary relays General and safety requirements |
| CEI EN 61810-1 : 2016 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| I.S. EN 60115-8:2012 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
| I.S. EN 60115-8-1:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60068-2-82:2007 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| I.S. EN 140401:2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| CEI EN 60068-2-58 : 2016 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| I.S. EN 61188-5-4:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| IEC 60115-8-1:2014 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| I.S. EN 140100:2008 | SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| CEI EN 60068-3-13 : 1ED 2017 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| BS EN 62137:2004 | Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| BS EN 62137-1-3:2009 | Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test |
| BS EN 60115-2:2015 | Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
| 06/30153438 DC : DRAFT JULY 2006 | BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION |
| CEI EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| BS CECC 200025:1998 | Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities |
| BS EN 140401-801 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| BS EN 140401-803 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| CEI CECC 200025 : 2000 | PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES |
| 04/30112673 DC : DRAFT APR 2004 | IEC 62314 ED.1 - SOLID-STATE RELAYS |
| BS EN 61188-5-4:2007 | Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides |
| BS EN 60512-16-21:2012 | Connectors for electronic equipment. Tests and measurements Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses |
| 06/30155905 DC : DRAFT SEP 2006 | BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| BS EN 62137-1-2:2007 | Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test |
| 14/30317306 DC : 0 | BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| EN IEC 62884-3:2018 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators – Part 3: Frequency aging test methods |
| BS EN 140402 : 2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 140401-804:2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| I.S. EN 61188-5-6:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
| I.S. EN 140101-806:2009 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
| BS EN 140401-804 : 2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| BS EN 140401:2009 | Blank Detail Specification. Fixed low power film surface mount (SMD) resistors |
| NF EN 140402-801 : 2005 | DETAIL SPECIFICATION: FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5, 1, 2 |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| I.S. EN 62137-1-2:2007 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| NF EN 61810-1 : 2015 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| IEC 62137-4:2014 | Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
| IEC 61810-1:2015 | Electromechanical elementary relays - Part 1: General and safety requirements |
| EN 140401-804:2011/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| BS EN 140100:2008 | Sectional specification. Fixed low power film resistors |
| 07/30149142 DC : 0 | BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| NF EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| 11/30252855 DC : 0 | BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
| 10/30237986 DC : 0 | BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
| 08/30186808 DC : DRAFT JULY 2008 | BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
| CEI EN 62137-1-3 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
| BS EN 140401-802 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| BS EN 60068-3-13:2016 | Environmental testing Supporting documentation and guidance on Test T. Soldering |
| CEI EN 62314 : 2007 | SOLID-STATE RELAYS |
| 11/30243259 DC : 0 | BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| UTEC 90 720-1 : 2000 | ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES |
| BS EN 62137-1-4:2009 | Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test |
| BS EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| 09/30209389 DC : 0 | BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
| BS EN 60068-2-82:2007 | Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components |
| NF EN 62137-1-4 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
| EN 61810-1:2015/AC:2018-04 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS (IEC 61810-1:2015/COR1:2018) |
| NF EN 62137-1-3 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
| I.S. EN 60068-3-13:2016 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| I.S. EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV)) |
| EN 140401-802:2007/A3:2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| I.S. EN 140101:2008 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
| I.S. EN 62137-1-3:2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST |
| I.S. EN 140401-802:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| I.S. EN 140401-803:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| I.S. EN 62137:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| I.S. EN 61188-5-1:2002 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
| IEC 60115-2:2014 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 60738-1:2006+AMD1:2009 CSV | Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification |
| BS EN 61188-5-6:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides |
| IEC 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
| ISO 16525-9:2014 | Adhesives — Test methods for isotropic electrically conductive adhesives — Part 9: Determination of high-speed signal-transmission characteristics |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| IEC 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| IEC 62314:2006 | Solid-state relays |
| IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| IEC 60512-16-21:2012 | Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| IEC 62137-1-1:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| 09/30210454 DC : DRAFT SEP 2009 | BS EN 60512-16-21 - CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| 12/30271778 DC : 0 | BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| CECC 200025 : 1998 | PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES |
| CEI EN 62391-1 : 2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 60068-2-82 : 2008 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| CEI EN 60115-2 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| CEI EN 140401 : 2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| BS EN 60115-8:2012 | Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| CEI EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| CEI EN 62137-1-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST |
| CEI EN 62137-3 : 2012 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| I.S. EN 60115-2:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| 05/30129971 DC : DRAFT FEB 2005 | EN 140402-801 - DETAIL SPECIFICATION - FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| I.S. EN 62137-3:2012 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV)) |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| BS EN 140101-806 : 2008 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
| I.S. EN 60122-1:2002 AMD 1 2018 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62137-1-4:2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
| CEI EN 60512-16-21 : 2013 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| NF EN 60068-2-82 : 2013 | ENVIRONMENTAL TESTING - PART 2-82 : TESTS - TEST XW1 : WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| I.S. EN 140401-801:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| I.S. EN 62314:2006 | SOLID-STATE RELAYS |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 140401-803 : 2007 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| EN 140101-806 : 2008 COR 2014 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
| EN 140401-801:2007/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 62137-3:2012 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| EN 60122-1:2002/A1:2018 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION (IEC 60122-1:2002/A1:2017) |
| EN 60115-8:2012 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
| EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| NF EN 61188-5-1 : 2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
| EN 140100:2008 | Sectional Specification: Fixed low power film resistors |
| EN 62314 : 2006 | SOLID-STATE RELAYS |
| EN 61188-5-4 : 2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 61340-5-3:2015 | Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
| IEC 60286-5:2003+AMD1:2009 CSV | Packaging of components for automatic handling - Part 5: Matrixtrays |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| ISO 8601:2004 | Data elements and interchange formats Information interchange Representation of dates and times |
| IEC 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
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