• IEC 61190-1-2 : 3.0

    Current The latest, up-to-date edition.

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

    Publisher:  International Electrotechnical Committee

    Published: 

    Available Formats:  PDF - English - French, Hardcopy - English - French
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