DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
SAE AIR 6127 : 2017
|
MANAGING HIGHER VOLTAGES IN AEROSPACE ELECTRICAL SYSTEMS |
BS EN 61182-2-2:2012
|
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
MIL-DTL-21097 Revision H:2017
|
Connectors, Electrical, Printed Wiring Board, General Purpose General Specification for |
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
I.S. EN 61182-2-2:2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
MIL-HDBK-1861 Revision B:2013
|
Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
I.S. EN 140402-801:2015
|
DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
BS EN 50155:2017
|
Railway applications. Rolling stock. Electronic equipment |
16/30282633 DC : 0
|
BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
EN 140402-801:2015
|
Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
EN 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IPC 2222 GERMAN : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC CM 770 : E
|
COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
IPC 2222 FRENCH : A2010
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
MIL-PRF-50884 Revision F:2014
|
Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
IPC 4554 CHINESE : -
|
SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IPC 2224 : 0
|
SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS |
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK |
MIL-DTL-29563 Revision B:2014
|
ANTENNA SYSTEM, AIMS SHIPBOARD, ELECTRONICALLY STEERED OE-120/UPX |
IPC 6012 RUSSIAN : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
DEFSTAN 00-970(PT0)/9(2012) : 2012
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 08-107/3(2013) : 2013
|
GENERAL REQUIREMENTS FOR THE DESIGN OF ELECTROTECHNICAL AND NAVAL WEAPON EQUIPMENT |
IPC J STD 001 SWEDISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4821 : 0
|
SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
MIL P 50884 : E
|
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
IPC J STD 001 RUSSIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 TURKISH : E2010
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
DEFSTAN 00-970(PT0)/17(2016) : 2016
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
IPC 2223 CHINESE : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
IPC 2225 : 0
|
SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
DEFSTAN 00-970(PT0)/7(2011) : 2011
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
DEFSTAN 00-970(PT0)/14(2014) : 2014
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
MIL-PRF-55110 Revision H:2014
|
Printed Wiring Board, Rigid, General Specification for |
IPC 9241 : 2016
|
GUIDELINES FOR MICROSECTION PREPARATION |
MIL-PRF-31032-2 Revision C:2017
|
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
IPC 2611 : 0
|
GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION |
IPC 2612-1 : 0
|
SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING SYMBOL GENERATION METHODOLOGY |
MIL-PRF-31032-1 Revision D:2017
|
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
IPC 2222 CHINESE : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 2612 : 0
|
SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING DOCUMENTATION (SCHEMATIC AND LOGIC DESCRIPTIONS) |
IPC 2316 : 0
|
DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS |
IPC 4553 : A
|
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC 2524 : 0
|
PWB FABRICATION DATA QUALITY RATING SYSTEM |
MIL-DTL-7788 Revision H:2011
|
PANELS, INFORMATION, INTEGRALLY ILLUMINATED |
IPC 6010 SERIES : LATEST
|
IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
IPC 4761 : 0
|
DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
IPC 2588 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
DEFSTAN 00-970(PT0)/13(2014) : 2014
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
IPC 2583 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
DEFSTAN 00-970(PT0)/11(2013) : 2013
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
MIL-DTL-917 Revision F:2014
|
ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
DEFSTAN 00-970(PT0)/15(2015) : 2015
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
MIL-PRF-31032-4 Revision C:2017
|
PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
MIL-PRF-31032-6 Revision B:2017
|
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
DEFSTAN 00-970(PT0)/12(2014) : 2014
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
IPC 2152 : 0
|
STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
MIL-PRF-31032-3 Revision C:2017
|
PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
IPC SM 840 : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC 2223 GERMAN : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
IPC HDBK 830 : A
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
MIL-PRF-31032-5 Revision B:2017
|
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
IPC J STD 001 HUNGARIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 GERMAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC SM 840 CHINESE : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC 4553 CHINESE : A
|
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC 6013 GERMAN : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC HDBK 840 : 0
|
SOLDER MASK HANDBOOK |
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 2582 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
MIL-PRF-3098 Revision L:2017
|
CRYSTAL UNITS, QUARTZ, GENERAL SPECIFICATION FOR |
DEFSTAN 00-970(PT0)/8(2011) : 2011
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
IPC PWB-CRT-SG : A2007
|
PCB DESIGNERS CERTIFICATION STUDY GUIDE |
IPC 7351 GERMAN : B
|
Basic requirements for SMT design and SMD patch guideline |
IPC 2614 : 0
|
SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION |
IPC 4556 : 0
|
SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS |
DEFSTAN 00-970(PT0)/10(2013) : 2013
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
IPC J STD 001 ROMANIAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL STD 11991 : A
|
GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC D 422 : 0
|
DESIGN GUIDE FOR PRESS FIT RIGID PRINTED BOARD BACK PLANES |
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
DEFSTAN 00-970(PT0)/16(2015) : 2015
|
DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
IPC 7095 : C
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
I.S. EN 61189-3-719:2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING |
PD IEC/TS 62647-1:2012
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IPC 7351 : B
|
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
13/30295427 DC : 0
|
BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
I.S. EN 50155:2017-11
|
RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 2222 : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL-DTL-22442 Revision G:2009
|
CABLE ASSEMBLIES, AIRCRAFT AUDIO, GENERAL SPECIFICATION FOR |
IEEE 1725-2011
|
IEEE Standard for Rechargeable Batteries for Cellular Telephones |
MIL-DTL-21097-15 Revision G:2005
|
CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD MALE ADAPTER, CONTACT SPACING: 0.200, ALTERNATE DUAL ROW, TYPE CS, BLADE CONTACT (NO MOUNTING PROVISION) |
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
NASA KSC E 165 : 2009
|
ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
MIL-DTL-39024 Revision C:2014
|
JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR |
NASA MSFC STD 3425 : 2006
|
MULTIPROGRAM/PROJECT COMMON-USE DOCUMENT DESIGN STANDARD FOR RIGID PRINTED CIRCUIT BOARDS AND ASSEMBLIES |
NASA MSFC STD 2907 : 2006
|
WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
NASA STD 5005 : 2013
|
STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
NASA STD 5005(INT) : 2007
|
THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
NASA KSC DE 512-SM : 2012
|
FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
NASA KSC STD E 0001 : 2008
|
DESIGN OF ELECTRICAL CONTROL AND MONITORING SYSTEMS, EQUIPMENT (GSE), AND PANELS, STANDARD FOR |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
EN 50155:2017
|
Railway applications - Rolling stock - Electronic equipment |
CSA N290.14 : 2015
|
QUALIFICATION OF DIGITAL HARDWARE AND SOFTWARE FOR USE IN INSTRUMENTATION AND CONTROL APPLICATIONS FOR NUCLEAR POWER PLANTS |
NASA JSC 27301 : 2009
|
MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
IPC 4554 : 0
|
SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
IEC TS 62647-1:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
MIL-DTL-55302 Revision G:2009
|
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES |
MIL-DTL-21097-14 Revision F:2005
|
CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD MALE ADAPTER, CONTACT SPACING: 0.200, ALTERNATE DUAL ROW, TYPE CS, BLADE CONTACT (MOUNTING PROVISION A) |
MIL-DTL-21097-3 Revision F:2005
|
CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD COMPOSITE, ADAPTER, CONTACT SPACING (.200) INDIVIDUAL CONTACTS, TYPE CS |
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
IEC PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
IEC PAS 62647-1:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
IEC 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
PD IEC/PAS 62647-1:2011
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC 61189-3-719:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
IEC PAS 62293:2001
|
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
BS EN 140402-801:2015
|
Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
BS EN 16602-70-12:2016
|
Space product assurance. Design rules for printed circuit boards |
PD IEC/PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
EN 16602-70-12:2016
|
Space product assurance - Design rules for printed circuit boards |
BS EN 61189-3-719:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
IPC 1902 : 1998
|
GRID SYSTEMS FOR PRINTED CIRCUITS |
PD IEC/TS 62647-22:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
EN 61189-3-719:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling |
ASME Y14.24 : 2012
|
TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
ASME Y14.100 : 2017
|
ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
ASME Y14.31 : 2014
|
UNDIMENSIONED DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
SAE AIR7374:2024
|
Aging Mechanisms of Electrical Insulation Materials in a High Energy System |