IPC T 50 : M
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
Available format(s)
Hardcopy
Superseded date
11-12-2021
Superseded by
Language(s)
English
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.Planned to provide definitions for terms commonly used in the electronics industry which have meanings specific to electronics.
| DevelopmentNote |
Supersedes MIL STD 429. Included in IPC C 102, IPC C 103, IPC C 105, IPC C 106, IPC C 107, IPC C 108 & IPC C 1000. (07/2009) H2008 Edition is still active in Chinese Language, See IPC T 50 CHINESE. (10/2011) K2013 Edition is still active in German Language, See IPC T 50 GERMAN. (05/2015) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| Pages |
132
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| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
| DOD-STD-2000-4 Revision A:1987 | GENERAL PURPOSE SOLDERING REQUIREMENT FOR ELECTRICAL AND ELECTRONIC EQUIPMENT |
| MIL-STD-2166 Base Document:1984 | CONNECTION, ELECTRICAL COMPLAINT PIN |
| DOD STD 2000/3 : A NOTICE 1 | CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY |
| IPC 9151 : D | PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
| DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
| MIL P 28809 : A | PRINTED WIRING ASSEMBLIES |
| MIL-HDBK-1861 Revision B:2013 | Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
| IPC 6017 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
| MIL-STD-1662 Revision C:1992 | ORDNANCE ALTERATION (ORDALT) INSTRUCTIONS, PREPARATION OF |
| MIL P 13949 : G (1) SUPP 1 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IPC 7801 : 0 | REFLOW OVEN PROCESS CONTROL STANDARD |
| DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| IEC PAS 63015:2016 | Definition of "Low-Halogen" for electronic products |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| PD IEC/PAS 61249-8-1:2014 | Qualification and performance of electrical insulating compound for printed wiring assemblies |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 2222 GERMAN : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2222 FRENCH : A2010 | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
| IPC FC 250 : A1986 | SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
| IPC P-MICRO : 2010 | PCB MULTI-ISSUE MICROSECTION WALL POSTER |
| MIL-C-28809 Revision B:1988 | CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7527 : 0 | REQUIREMENTS FOR SOLDER PASTE PRINTING |
| IPC 9262 : 2016 | SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT |
| IPC J STD 003 CHINESE : B | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC S 815 : B1987 | GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
| IPC SPVC-LAT1 : 2010 | ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA |
| IPC J STD 005 RUSSIAN : A | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 004 RUSSIAN : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 600 SWEDISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 JAPANESE : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 CHINESE : G | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 1601 GERMAN : - | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEGREES C) |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| IPC 9241 : 2016 | GUIDELINES FOR MICROSECTION PREPARATION |
| IPC A 600 GERMAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 600 POLISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 RUSSIAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 5704 : 0 | CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS |
| IPC 9592 : B | REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES |
| IPC 2222 CHINESE : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC S 804 : A1987 | PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC 4411 : A | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC 4204 CHINESE : A2011 AMD 1 2013 | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
| MIL-F-14256 Revision F:1993 | FLUX, SOLDERING, LIQUID (ROSIN BASE) |
| IPC 2583 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 4412 : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| MIL-P-46843 Revision C:1989 | PRINTED WIRING ASSEMBLIES PRODUCTION OF |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL-PRF-31032-6 Revision B:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC 7527 GERMAN : - | REQUIREMENTS FOR SOLDER PASTE PRINTING |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4412 CHINESE : B | SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
| MIL-PRF-31032-5 Revision B:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| IPC J STD 004 CHINESE : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 609 CHINESE : A | IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC ML 950 : C1980 | RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC SM 840 CHINESE : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC PWB-CRT-SG : A2007 | PCB DESIGNERS CERTIFICATION STUDY GUIDE |
| IPC 7351 GERMAN : B | Basic requirements for SMT design and SMD patch guideline |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 2141 : A | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC 4202 CHINESE : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 006 CHINESE : B-2 | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 005 CHINESE : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC A 600 FRENCH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4101 CHINESE : C2009 | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC FC 221 : A1984 | SPECIFICATION FOR FLAT COPPER CONDUCTORS FOR FLAT CABLES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 4101 GERMAN : C | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 9199 : 0 | STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC FC 213 : 1984 | PERFORMANCE SPECIFICATION FOR FLAT UNDERCARPET TELEPHONE CABLE |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-STD-100 Revision G:1997 | ENGINEERING DRAWINGS |
| DOD-STD-2000-2 Revision A:1986 | PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| DD IEC/PAS 61249-6-3:2011 | Specification for finished fabric woven from “E” glass for printed boards |
| IPC HDBK 4691 : 2015 | HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS |
| IPC 9194 : 0 | IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) APPLIED TO PRINTED BOARD ASSEMBLY MANUFACTURE GUIDELINE |
| IPC QS 95 : 1993 | GENERAL REQUIREMENTS FOR IMPLEMENTATION OF ISO 9000 QUALITY SYSTEMS |
| IEC PAS 62214:2001 | Generic performance specification for printed boards |
| IPC 1072 : 2015 AMD 1 2017 | INTELLECTUAL PROPERTY PROTECTION IN ELECTRONIC ASSEMBLY MANUFACTURING |
| IPC 7525 GERMAN : B | STENCIL DESIGN GUIDELINE |
| IPC 1756 : 2010 | MANUFACTURING PROCESS DATA MANAGEMENT |
| IEC PAS 61249-6-3:2011 | Specification for finished fabric woven from "E" glass for printed boards |
| IEC PAS 62213:2001 | Specification and characterization methods for nonwoven para-aramid reinforcement |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| 13/30295427 DC : 0 | BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| MIL-S-13949 Revision H:1993 | SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC PAS 62212:2001 | Specification and characterization methods for nonwoven "E" glass mat |
| IPC 6011 GERMAN : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 6903 : A2018 | TERMS AND DEFINITIONS FOR THE DESIGN AND MANUFACTURE OF PRINTED ELECTRONICS |
| ARINC 669 : 2004 | GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
| IPC 7525 CHINESE : B | STENCIL DESIGN GUIDELINES |
| EN 61760-4:2015/A1:2018 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| NASA MSFC STD 2907 : 2006 | WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC HDBK 630 : 0 | GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
| IPC SM 817 : A | GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
| IPC 9707 : 0 | SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
| IPC J STD 030 : A | SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS |
| IPC 1751 : A2010 + A1 2012 | GENERIC REQUIREMENTS FOR DECLARATION PROCESS MANAGEMENT |
| IPC 9709 : 0 | TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING |
| MIL-STD-2118 Base Document:1984 | FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR |
| BS EN 61760-4 : 2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IPC AM 372 : 1978 | ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
| DD IEC/PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
| IEC PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| 12/30262664 DC : DRAFT APR 2012 | BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| PD IEC/PAS 61249-8-5:2014 | Qualification and performance specification of permanent solder mask and flexible cover materials |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 9708 : 0 | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| IPC 9708 CHINESE : - | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| MIL-STD-2119 Revision A:1990 | DESIGN REQUIREMENTS FOR PRINTED WIRING ELECTRICAL BACKPLANE ASSEMBLIES |
| 12/30261600 DC : DRAFT MAR 2012 | BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| NASA STD 8739.1 : 2016 | WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
| IPC 9204 : 2017 | GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS |
| IPC 7525 : B | STENCIL DESIGN GUIDELINES |
| IPC 1755 : 0 | CONFLICT MINERALS DATA EXCHANGE STANDARD |
| IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC 1902 : 1998 | GRID SYSTEMS FOR PRINTED CIRCUITS |
| IPC 9850 : 0 | SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION |
| IPC 2547 : 0 | SECTIONAL REQUIREMENTS FOR SHOP-FLOOR EQUIPMENT COMMUNICATION MESSAGES (CAMX) FOR PRINTED CIRCUIT BOARD TEST, INSPECTION AND REWORK |
| IPC 7094 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
| IPC 4562 CHINESE : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| I.S. EN 61760-4:2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| IEC PAS 61249-8-1:2014 | Qualification and performance of electrical insulating compound for printed wiring assemblies |
| 13/30295424 DC : 0 | BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
| ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| ASME Y14.31 : 2014 | UNDIMENSIONED DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
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