• IEC 61190-1-3 : 2.1

    NA Status of Standard is Unknown

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

    Publisher:  International Electrotechnical Committee

    Published:  10-11-2010

    Available Formats:  PDF - English, Hardcopy - English
    More Info on product formats

    Add To Cart

    add to cart

    • Publisher

      International Electrotechnical Committee
    • Category

    • Sub Category

    • Looking for Subscription Services?

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective