IEC 60068-2-20:2008
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
31-12-2021
Superseded by
Language(s)
English, English - French
Published date
21-07-2008
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of wire and tag terminations
4.1 Object and general description of the test
4.1.1 Test methods
4.1.2 Specimen preparation
4.1.3 Initial measurements
4.1.4 Accelerated ageing
4.2 Method 1: Solder bath
4.2.1 Description of the solder bath
4.2.2 Flux
4.2.3 Procedure
4.2.4 Test conditions
4.2.5 Final measurements and requirements
4.3 Method 2: Soldering iron at 350 degrees C
4.3.1 Description of soldering irons
4.3.2 Solder and flux
4.3.3 Procedure
4.3.4 Final measurements and requirements
4.4 Information to be given in the relevant specification
5 Test Tb: Resistance to soldering heat
5.1 Object and general description of the test
5.1.1 Test methods
5.1.2 Initial measurements
5.2 Method 1: Solder bath
5.2.1 Description of the solder bath
5.2.2 Flux
5.2.3 Procedure
5.2.4 Test conditions
5.2.5 De-wetting
5.3 Method 2: Soldering iron
5.3.1 Description of soldering iron
5.3.2 Solder and flux
5.3.3 Procedure
5.4 Recovery
5.5 Final measurements and requirements
5.6 De-wetting (if applicable)
5.7 Information to be given in the relevant specification
Annex A (informative) Example of apparatus for accelerated
steam ageing process
Annex B (normative) Specification for flux constituents
Bibliography
IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2017. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| JIS C 60068-2-20:2022 | Identical |
| EN IEC 60068-2-20:2021 | Identical |
| OVE/ONORM EN 60068-2-20 : 2009 | Identical |
| GOST R IEC 60068-2-20 : 2015 | Identical |
| NF EN 60068-2-20 : 2013 | Identical |
| NEN EN IEC 60068-2-20 : 2008 | Identical |
| I.S. EN 60068-2-20:2008 | Identical |
| PN EN 60068-2-20 : 2009 | Identical |
| BS EN 60068-2-20:2008 | Identical |
| CEI EN 60068-2-20 : 2009 | Identical |
| EN 60068-2-20:2008 | Identical |
| DIN EN 60068-2-20:2009-02 | Identical |
| NBN C 83 355-4 : 1985 AMD 1 1990 | Identical |
| DIN IEC 60068-2-20:1991-04 | Identical |
| I.S. EN IEC 60068-2-20:2021 | Identical |
| UNE-EN 60068-2-20:2008 | Identical |
| BS EN IEC 60068-2-20:2021 | Identical |
| PNE-EN 60068-2-20 | Identical |
| NBN C 83 255 : 1984 | Identical |
| JIS C 0050:1996 | Identical |
| CEI 50-8/4 : 1998 | Identical |
| NFC 20 720 : 87 AMD 1 1988 | Identical |
| UNE 20501-2-20:1994 | Identical |
| NEN 10068-2-20 : 1988 | Identical |
| NF EN 60384-26 : 2011 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| BS EN 61337-1:2004 | Filters using waveguide type dielectric resonators Generic specification |
| BS EN 140200:1997 | Harmonized system of quality assessment for electronic components. Sectional specification: fixed power resistors |
| BS EN 60068-1:2014 | Environmental testing General and guidance |
| BS IEC 61189-5-4 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| ISO 2093:1986 | Electroplated coatings of tin — Specification and test methods |
| 16/30353588 DC : 0 | BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
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| 12/30274804 DC : 0 | BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
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| 05/30138794 DC : DRAFT SEP 2005 | |
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| BS IEC 60748-23-3:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Manufacturers\' self-audit checklist and report |
| BS CECC 40200:1981 | Harmonized system of quality assessment for electronic components: sectional specification: fixed power resistors |
| BS EN 61051-1:2008 | Varistors for use in electronic equipment Generic specification |
| 13/30279642 DC : 0 | BS EN 61811-1 - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
| BS CECC 16000-1:1992 | Harmonized system of quality assessment for electronic components. Generic specification: electromechanical all-or-nothing relays General |
| NF EN 62314 : 2006 | SOLID-STATE RELAYS |
| 14/30311384 DC : 0 | BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| BS EN 60384-26-1:2010 | Fixed capacitors for use in electronic equipment Blank detail specification. Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte. Assessment level EZ |
| 11/30258040 DC : 0 | BS EN 61810-1 - ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL REQUIREMENTS |
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| BS EN 62421:2007 | Electronics assembly technology. Electronic modules |
| BS 6201-3:1982 | Fixed capacitors for use in electronic equipment Specification for fixed capacitors for radio interference suppression. Selection of methods of test and general requirements |
| BS CECC 22000:1980 | Harmonized system of quality assessment for electronic components: generic specification: radio frequency coaxial connectors |
| BS EN 171000:2001 | Harmonized system of quality assessment for electronic components. Generic specification. Filters using waveguide type dielectric resonators |
| BS EN 61338-2:2004 | Waveguide type dielectric resonators Guidelines for oscillator and filter applications |
| BS EN ISO 4521:2008 | Metallic and other inorganic coatings. Electrodeposited silver and silver alloy coatings for engineering purposes. Specification and test methods |
| CEI EN 61881-1 : 2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
| BS EN 140202:1997 | Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level M) |
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| PREN ISO 9455-16 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| 10/30240248 DC : 0 | BS EN 60862-1 - SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| CEI EN 61747-10-1 : 2014 | LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
| BS EN 60749:1999 | Semiconductor devices. Mechanical and climatic test methods |
| 13/30286159 DC : 0 | BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| BS EN 60512-12-5:2006 | Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12e. Resistance to soldering heat, soldering iron method |
| BS EN 61248-6:1997 | Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for inductors on the basis of the capability approval procedure |
| 10/30184592 DC : 0 | BS EN 61643-311 ED 2.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: TEST SPECIFICATION FOR GAS DISCHARGE TUBES |
| BS EN 60127-2:2014 | Miniature fuses Cartridge fuse-links |
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| BS EN 60539-1:2016 | Directly heated negative temperature coefficient thermistors Generic specification |
| IEC 61196-9:2014 | Coaxial communication cables - Part 9: Sectional specification for RF flexible cables |
| DIN EN 138000 : 1997 | GENERIC SPECIFICATION; FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) |
| BS EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement |
| BS EN ISO 27874:2008 | Metallic coatings. Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes. Specification and test methods |
| DD IEC PAS 62246-2-1 : DRAFT 2008 | REED CONTACT UNITS - PART 2-1: HEAVY-DUTY REED SWITCHES - QUALITY ASSESSMENT SPECIFICATION |
| 13/30286167 DC : 0 | BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES |
| BS EN 61248-3:1997 | Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for power transformers on the basis of the capability approval procedure |
| NF EN 60384-1 : 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 03/104227 DC : DRAFT MAY 2003 | IEC 60393-6 ED.1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS |
| BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
| 05/30132097 DC : DRAFT JUNE 2005 | IEC 60679-1 ED 3 - QUARTZ CRYSTAL CONTROLLED OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 62211:2004 | Inductive components. Reliability management |
| BS EN 140101:2008 | Blank Detail Specification. Fixed low power film resistors |
| BS EN 61169-8:2007 | Radio-frequency connectors Sectional specification. RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock. Characteristic impedance 50 ohms (type BNC) |
| 07/30167467 DC : 0 | BS EN ISO 27874 - METALLIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
| 05/30135445 DC : DRAFT JUN 2005 | IEC 61169-8 - RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC) |
| BS CECC43003(1984) : 1984 AMD 7380 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS (DISC TYPE) |
| UNE-EN 60252-1:2011 | AC motor capacitors -- Part 1: General - Performance, testing and rating - Safety requirements - Guidance for installation and operation |
| BS EN 61881-3 : 2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS |
| BS EN 61881:2000 | Railway applications. Rolling stock equipment. Capacitors for power electronics |
| BS EN 165000-1:1996 | Film and hybrid integrated circuits Generic specification. Capability approval procedure |
| CEI EN 60068-2-21 : 2006 | ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
| BS EN 60127-6:2014 | Miniature fuses Fuse-holders for miniature fuse-links |
| BS CECC68000(1990) : AMD 9184 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: QUARTZ CRYSTAL UNITS |
| OVE/ONORM EN 61051-1 : 2009 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC PAS 62435:2005 | Electronic components - Long-duration storage of electronic components - Guidance for implementation |
| I.S. EN 61811-51:2002 | ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 51: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - NON-STANDARDIZED TYPES AND CONSTRUCTION |
| I.S. EN 168000:1994 | QUARTZ CRYSTAL UNITS (GENERIC SPECIFICATION) |
| I.S. EN 60738-1:2006 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60689:2009 | MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
| CEI EN 60689 : 2009 | MEASUREMENT AND TEST METHODS FOR TUNING FORK QUARTZ CRYSTAL UNITS IN THE RANGE FROM 10 KHZ TO 200 KHZ AND STANDARD VALUES |
| I.S. EN 61051-1:2008 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60400:2017 | LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
| I.S. EN 61810-7:2006 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
| CEI EN 60512-12-5 : 2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, IRON METHOD |
| I.S. EN 61643-311:2013 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) (IEC 61643-311:2013 (EQV)) |
| I.S. EN 140402:2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 61881-1:2011 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
| I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| I.S. EN 60068-1:2014 | ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
| I.S. EN 61248-5:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 5: SECTIONAL SPECIFICATION FOR PULSE TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
| I.S. EN IEC 61643-331:2018 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTION - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
| BS EN 60838-1 : 2017 | MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS (IEC 60838-1:2016) |
| I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
| BS EN 60252-1 : 2011 | AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
| BS EN 60238 : 2004 | EDISON SCREW LAMPHOLDERS |
| IEC 62391-1:2015 RLV | Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
| IEC 62391-1:2015 | Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification |
| NF EN 61249 5-4 : 1997 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
| BS EN 60068-2-21:2006 | Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices |
| NF EN 60939-3 : 2016 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
| I.S. EN 60512-12-2:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
| I.S. EN ISO 27874:2008 | METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
| I.S. EN 61248-1:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62246-1-1:2013 | REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT (IEC 62246-1-1:2013 (EQV)) |
| I.S. EN 60127-6:2014 | MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
| I.S. EN 60252-2:2011 | AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010 (EQV)) |
| IEC 61253-1:1993 | Piezoelectric ceramic resonators - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval |
| NF EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| NF EN 60115-2 : 2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| I.S. EN 61248-7:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 7: SECTIONAL SPECIFICATION FOR HIGH-FREQUENCY INDUCTORS AND INTERMEDIATE FREQUENCY TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
| I.S. EN 60939-1:2010 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| I.S. EN ISO 9455-16:2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| IEC 61643-331:2017 | Components for low-voltage surge protective devices - Part 331: Performance requirements and test methods for metal oxide varistors (MOV) |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| I.S. EN ISO 9455-10:2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
| NF EN 62391-1 : 2018 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| NF EN 60122-1 : 2003 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 16602-70-10:2015 | Space product assurance. Qualification of printed circuit boards |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| PD IEC/TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| UNI EN ISO 9455-16 : 2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| IEC 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| IEC 62211:2017 | Inductive components - Reliability management |
| IEC 62246-1:2015 | Reed switches - Part 1: Generic specification |
| IEC 62319-1:2005 | Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification |
| IEC 60127-2:2014 | Miniature fuses - Part 2: Cartridge fuse-links |
| 14/30309696 DC : 0 | BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| UNE-EN 60749-15:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| BS EN ISO 9455-16:2013 | Soft soldering fluxes. Test methods Flux efficacy test, wetting balance method |
| IEC 61249-5-4:1996 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks |
| IEC 60384-1:2016 RLV | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| EN 61881-1:2011 | Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors |
| EN 61337-1:2004 | Filters using waveguide type dielectric resonators - Part 1: Generic specification |
| EN 60384-26-1:2010 | Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ |
| NF EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| EN 61058-1:2002/A2:2008 | SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| EN 61811-51:2002 | Electromechanical all-or-nothing relays - Part 51: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Non-standardized types and construction |
| EN 61643-331:2003 | Components for low-voltage surge protective devices - Part 331: Specification for metal oxide varistors (MOV) |
| EN 60810 : 2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| EN 61019-1:2005 | Surface acoustic wave (SAW) resonators - Part 1: Generic specification |
| EN 61249-8-7:1996 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
| EN 62246-1:2015 | Reed switches - Part 1: Generic specification |
| EN 61249-5-4:1996 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks |
| EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
| EN 60127-4:2005/A2:2013 | Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
| EN 134000:1994 | Generic Specification: Variable capacitors (Qualification approval and capability approval) |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| EN 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| EN 61248-2:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 2: Sectional specification for signal transformers on the basis of the capability approval procedure |
| EN 60939-1:2010 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| EN 60068-2-44:1995 | Environmental testing - Part 2: Tests - Guidance on Test T: Soldering |
| EN 60689:2009 | Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values |
| EN 60684-2:2011 | Flexible insulating sleeving - Part 2: Methods of test |
| EN 140101:2008 | Blank Detail Specification: Fixed low power film resistors |
| CLC/TS 50466:2006 | Long duration storage of electronic components - Specification for implementation |
| EN 61797-1:1996 | Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores |
| EN 61747-5:1998 | Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
| EN 61204-6:2001 | Low-voltage power supplies, DC output - Part 6: Requirements for low-voltage power supplies of assessed performance |
| EN 129000:1993/A1:1995 | GENERIC SPECIFICATION - FIXED RF WOUND INDUCTORS |
| EN 62149-6:2003 | Fibre optic active components and devices - Performance standards - Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers |
| NF EN 62025-2 : 2005 | HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| EN 61051-1:2008 | Varistors for use in electronic equipment - Part 1: Generic specification |
| EN 60252-1 : 2011 AMD 1 2013 | AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010/A1:2013) |
| EN 61811-54:2002 | Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base |
| EN 62435-1:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
| EN 60738-1:2006/A1:2009 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| EN 62326-4-1:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 60838-2-1:1996/A2:2004 | MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 (IEC 60838-2-1:1994/A2:2004) |
| EN 60512-12-6:1996 | Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering |
| EN 60115-2:2015 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| EN 61248-4:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 4: Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability approval procedure |
| EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
| EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61881-2 : 2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012) |
| EN 140402:2015/A1:2016 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| EN 62319-1:2005 | Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification |
| EN 60169-21:1997 | Radio-frequency connectors - Part 21: Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with different versions of screw coupling - Characteristic impendance 50 ohms (types SC-A and SC-B) |
| EN 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IPC S 804 : A1987 | PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
| EN 117000:1991 | Generic Specification: Solid state all-or-nothing relays of assessed quality - Generic data and methods of test |
| EN 168000 : 1993 AMD 2 1998 | GENERIC SPECIFICATION - QUARTZ CRYSTAL UNITS |
| BS CECC 00802:1991 | Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality |
| 12/30268003 DC : 0 | BS EN 60939-3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: HARMONIZED STANDARD FOR PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
| BS EN 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods |
| 02/209660 DC : DRAFT OCT 2002 | IEC 60512-12-3, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT BASIC TESTING AND MEASUREMENTS - PART 12-3 - TEST 12C: SOLDERABILITY, DE-WETTING |
| BS EN 61747-5:1998 | Liquid crystal and solid-state display devices Environmental, endurance and mechanical test methods |
| 04/30126718 DC : DRAFT DEC 2004 | IEC 60189-1 ED.3 - LOW-FREQUENCY CABLES AND WIRES WITH PVC INSULATION AND PVC SHEATH - PART 1: GENERAL TEST AND MEASURING METHODS |
| 13/30278343 DC : 0 | BS EN 62246-1 - REED SWITCHES - PART 1: GENERIC SPECIFICATION |
| 17/30352704 DC : 0 | BS IEC 62149-10 ED1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 10: ROF (RADIO OVER FIBER) TRANSCEIVERS FOR MOBILE FRONTHAUL |
| BS IEC 61196-9:2014 | Coaxial communication cables Sectional specification for RF flexible cables |
| 06/30157868 DC : 0 | BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| NF EN 62246-1-1 : 2013 | REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
| BS CECC 43000(1982) : AMD 7315 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
| UTEC 96 029 : 2011 | ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION |
| 03/101947 DC : DRAFT FEB 2003 | IEC 60939-1 ED.2.0 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
| BS EN 60512-12-7:2001 | Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method |
| BS EN 62922:2017 | Organic light emitting diode (OLED) panels for general lighting. Performance requirements |
| 15/30332490 DC : 0 | BS EN 62211 - INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
| 02/203604 DC : DRAFT MAR 2002 | IEC 61810-1. ED.2 - ELEMENTARY RELAYS - PART 1: SAFETY-RELATED AND GENERAL REQUIREMENTS |
| BS EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
| 07/30165180 DC : 0 | BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE |
| CEI EN 62149-4 : 2011 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
| 05/30129049 DC : DRAFT FEB 2005 | IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| EN 60939-3:2015/AC:2016-04 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE (IEC 60939-3:2015/COR1:2016) |
| BS EN 61338-1:2005 | Waveguide type dielectric resonators Generic specification |
| BS EN 60512-12-1:2006 | Connectors for electronic equipment. Tests and measurements Soldering tests - Test 12a. Solderability, wetting, solder bath method |
| 11/30243259 DC : 0 | BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| CEI EN 60384-26-1 : 2011 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| 03/103741 DC : DRAFT FEB 2003 | IEC 61338-1 ED.1 - WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| NF EN 61643-311 : 2014 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) |
| BS EN 62326-4:1997 | Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification |
| BS EN 62314:2006 | Solid-state relays |
| BS EN 60252:1994 | A.C. motor capacitors |
| BS EN 61169-1:2013 | Radio-frequency connectors Generic specification. General requirements and measuring methods |
| NF EN 60068-3-13 : 2016 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| 10/30196657 DC : 0 | BS EN 61881-2 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
| IEC 60512-12-7:2001 | Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method |
| 09/30203267 DC : 0 | BS EN 60749-15 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
| BS CECC 41200:1979 | Harmonized system of quality assurance for electronic components: sectional specification: power potentiometers |
| BS EN 60068-2-83:2011 | Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| NF EN 61643-331 : 2003 | COMPOSANTS POUR PARAFOUDRES BASSE TENSION - PARTIE 331: SPECIFICATIONS POUR LES VARISTANCES A OXYDE METALLIQUE (MOV) |
| 17/30336631 DC : 0 | BS EN 62246-1-1 - REED SWITCHES - PART 1-1: DETAIL SPECIFICATION - QUALITY ASSESSMENT |
| 10/30234803 DC : 0 | BS EN 61169-1 ED.2 - RADIO FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
| NF EN 61020-1 : 2009 | ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 60749-15:2010 | Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices |
| 14/30296909 DC : 0 | BS EN 61643-331 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV) |
| BS EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality Generic specification |
| CEI EN 62739-1 : 2014 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
| I.S. EN 61249-8-7:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
| 12/30274800 DC : 0 | BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
| 09/30186180 DC : 0 | BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| BS EN 60738-1 : 2006 | THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| 05/30134428 DC : DRAFT JUN 2005 | |
| 09/30207307 DC : 0 | BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
| I.S. EN 61337-1:2005 | FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
| CSA E60127.6 : 2003 | MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
| CAN/CSA-E60127-6-03 (R2017) | Miniature Fuses - Part 6: Fuse-Holders for Miniature Cartridge Fuse-Links (Adopted CEI/IEC 127-6:1994, first edition, 1994-04, including Amendment 1:1996, with Canadian deviations) | Coupe-circuit miniatures - Partie 6: Ensembles-porteurs pour cartouches de coupe-circuit miniatures (norme CEI/IEC 127-6:1994 adoptée, première édition, 1994-04, y compris l\'Amendement 1:1996, avec exigences propres au Canada) |
| I.S. CLC TS 50466:2006 | LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
| CEI EN 60393-1 : 2010 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| EN IEC 61058-1:2018 | Switches for appliances - Part 1: General requirements |
| NF EN 60684-2 : 2012 | FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
| BS EN 61810-1:2015 | Electromechanical elementary relays General and safety requirements |
| NF EN 61881-1 : 2011 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| CEI EN 61810-1 : 2016 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| NF EN 61249 8-8 : 1998 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
| NF EN 62246-1 : 2015 | REED SWITCHES - PART 1: GENERIC SPECIFICATION |
| BS EN 138000:1997 | Harmonized system of quality assessment for electronic components. Generic specification: fixed inductors for electromagnetic interference suppression (inductors for which safety tests are required) |
| CEI EN 60384-26 : 2011 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| IEC 60810:2017 | Lamps, light sources and LED packages for road vehicles - Performance requirements |
| I.S. EN 16602-70-10:2015 | SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS |
| CEI EN 60512-12-1 : 2007 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
| I.S. EN 62435-5:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| I.S. EN 61019-1:2005 | SURFACE ACOUSTIC WAVE (SAW) RESONATORS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61071:2007 | CAPACITORS FOR POWER ELECTRONICS |
| I.S. EN 60115-8:2012 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
| I.S. EN 60115-8-1:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
| I.S. EN 61193-3:2013 | QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
| BS EN 61058-1 : 2002 | SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60512-12-1:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-1: SOLDERING TESTS - TEST 12A: SOLDERABILITY, WETTING, |
| I.S. EN 61058-1:2002 | SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| I.S. EN 60068-2-82:2007 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| I.S. EN 61248-4:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 4: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS FOR SWITCHED MODE POWER SUPPLIES (SMPS) ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
| I.S. EN 61248-3:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 3: SECTIONAL SPECIFICATION FOR POWER TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
| BS EN 60127-4 : 2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
| I.S. EN 61747-10-1:2013 | LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV)) |
| I.S. EN 60512-12-5:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD |
| CEI EN 60068-2-58 : 2016 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 61881-3:2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012 (EQV)) |
| I.S. EN 60068-2-83:2011 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV)) |
| IEC 60539-1:2016 | Directly heated negative temperature coefficient thermistors - Part 1: Generic specification |
| I.S. EN 61249-5-4:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS |
| I.S. EN 60512-12-4:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
| CEI EN 61881-2 : 2013 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| UNE-EN ISO 4521:2010 | Metallic and other inorganic coatings - Electrodeposited silver and silver alloy coatings for engineering purposes - Specification and test methods (ISO 4521:2008) |
| NF EN 60400 : 2008 AMD 2 2014 | LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
| NF EN 60939-1 : 2011 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| NF EN 61189-5 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| IEC PAS 61811-55:2000 | Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base |
| I.S. EN 60368-1:2000 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| IEC 61196-1-305:2015 | Coaxial communication cables - Part 1-305: Mechanical test methods - Solderability and resistance to soldering |
| I.S. EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| I.S. EN 61196-2:2003 | RADIO-FREQUENCY CABLES - PART 2: SECTIONAL SPECIFICATION FOR SEMI-RIGID RADIO-FREQUENCY AND COAXIAL CABLES WITH POLYTETRAFLUOROETHYLENE (PTFE) INSULATION |
| IEC 60115-8-1:2014 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| I.S. EN 140100:2008 | SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
| EN 62922:2017 | Organic light emitting diode (OLED) panels for general lighting - Performance Requirements |
| DIN EN ISO 9455-10:2013-01 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| DIN EN ISO 9455-16:2013-08 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| IEC 61204-6:2000 | Low-voltage power supplies, d.c. output - Part 6: Requirements for low-voltage power supplies of assessed performance |
| IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| IEC 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
| UNE-EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
| IEC 61338-2:2004 | Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
| IEC 60838-1:2016 RLV | Miscellaneous lampholders - Part 1: General requirements and tests |
| DIN EN ISO 27874:2009-01 | METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
| IEC 61058-1:2016 RLV | Switches for appliances - Part 1: General requirements |
| DIN EN 61270-1 : 1997 | CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
| VDE 0560-800 : 1998 | GENERIC SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC A.C. CAPACITORS WITH NON-SOLID ELECTROLYTE FOR USE WITH MOTORS |
| BIS IS/IEC 61058-1 : 2000(R2007) | SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| DIN VDE 0616-3 : 1992 | LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
| DIN EN 137000 : 1998-03 | GENERIC SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC A.C. CAPACITORS WITH NON-SOLID ELECTROLYTE FOR USE WITH MOTORS |
| DIN EN 60938-1 : 2008 | FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| BS 2011-1.1:1989 | Environmental testing General and guidance |
| VDE 0560-22 : 1997 | CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
| BS CECC 50000:1987 | Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices |
| VDE 0557-6 : 2001 | LOW-VOLTAGE POWER SUPPLIES, DC OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES OF ASSESSED PERFORMANCE |
| BS CECC17000(1992) : 1992 AMD 9626 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION - SOLID STATE ALL OR NOTHING RELAYS - GENERIC DATA AND METHODS OF TEST |
| CEI EN 60068-3-13 : 1ED 2017 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| CEI CLC/TS 50466 : 2006 | LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION |
| 02/209659 DC : DRAFT OCT 2001 | IEC 60512-12-2, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-2 - TEST 12B: SOLDERABILITY, WETTING, IRON METHOD |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| BS EN 61811-52:2002 | Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 20 mm x 10 mm base |
| 14/30309692 DC : 0 | BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
| I.S. EN 62739-1:2013 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV)) |
| BS CECC 64000:1990 | Harmonized system of quality assessment for electronic components: generic specification: film resistor networks |
| BS CECC 41300:1979 | Harmonized system of quality assessment for electronic components. Sectional specification: low power single-turn rotary potentiometers |
| 13/30287806 DC : 0 | BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| 09/30207352 DC : 0 | BS EN 62149-4 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
| IEC 61261-1:1994 | Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval |
| BS EN 61643-311:2013 | Components for low-voltage surge protective devices Performance requirements and test circuits for gas discharge tubes (GDT) |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| BS EN 60115-2:2015 | Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
| BS EN 60939-3:2015 | Passive filter units for electromagnetic interference suppression Passive filter units for which safety tests are appropriate |
| 06/30153438 DC : DRAFT JULY 2006 | BS IEC 60539-1 ED.2 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORES - PART 1: GENERIC SPECIFICATION |
| 12/30250506 DC : DRAFT MAR 2012 | BS EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
| BS EN 60838-2-1 : 1997 | MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 |
| CEI EN 62421 : 2008 | ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES |
| 11/30252855 DC : 0 | BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING |
| CEI EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| CEI EN 62739-3 : 1ED 2017 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
| 09/30207299 DC : DRAFT JULY 2009 | BS EN 60252-2 - AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
| BS EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| 97/231700 DC : DRAFT DEC 1997 | IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 12/30252220 DC : DRAFT MAR 2012 | BS EN 62604-1 - SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60238:2004 | EDISON SCREW LAMPHOLDERS (IEC 60238:2004 (EQV)) |
| BS EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
| BS EN 140000:1995 | Harmonized system of quality assessment for electronic components. Generic specification: fixed resistors |
| 11/30252972 DC : 0 | BS EN 61747-10-1 - LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL |
| BS IEC 61189-5-3 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| BS EN 61747-10-1:2013 | Liquid crystal display devices Environmental, endurance and mechanical test methods. Mechanical |
| NF EN 60068-2-83 : 2012 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
| 16/30338981 DC : 0 | BS EN 60934 - CIRCUIT-BREAKERS FOR EQUIPMENT (CBE) |
| BS EN 61019-1:2005 | Surface acoustic wave (SAW) resonators Generic specification |
| EN 60400:2017 | Lampholders for tubular fluorescent lamps and starterholders |
| BS EN 61811-53:2002 | Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 14 mm x 9 mm base |
| 08/30176905 DC : DRAFT JAN 2008 | BS EN 60684-2 - FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
| BS EN 140401-803 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| BS EN 61811-51:2002 | Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Non-standardized types and construction |
| I.S. EN 61337-2:2004 | FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 2: GUIDANCE FOR USE |
| BS EN 62739-1:2013 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS EN 60068-2-54:2006 | Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| 02/209662 DC : DRAFT OCT 2002 | IEC 60512-12-5, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-5 - TEST 12E: RESISTANCE TO SOLDERING HEAT, IRON METHOD |
| 10/30235844 DC : 0 | BS EN 61881-2 - RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITOR FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE |
| 02/209661 DC : DRAFT OCT 2002 | IEC 60512-12-4, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-4 - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
| BS EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
| BS 4584-103.2:1990 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials |
| 04/30112673 DC : DRAFT APR 2004 | IEC 62314 ED.1 - SOLID-STATE RELAYS |
| 13/30291353 DC : 0 | BS EN 60838-1 ED 5.0 - MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
| CEI EN 60368-1 : 2006 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 61204-6:2001 | Low voltage power supplies, d.c. output Requirements for low-voltage power supplies of assessed performance |
| BS EN 61881-2:2012 | Railway applications. Rolling stock equipment. Capacitors for power electronics Aluminium electrolytic capacitors with non solid electrolyte |
| BS EN 133000:1997 | Harmonized system of quality assessment for electronic components. Generic specification: passive filter units for electromagnetic interference suppression |
| BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
| BS IEC 60748-23-1:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
| BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
| BS EN 61881-1:2011 | Railway applications. Rolling stock equipment. Capacitors for power electronics Paper/plastic film capacitors |
| BS EN 120000:1996 | Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices |
| BS QC 763000(1990) : AMD 6754 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
| BIS IS/IEC 60862-1 : 2003 | SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| 06/30155922 DC : 0 | BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS |
| BS EN 61811-55:2002 | Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 11 mm x 7,5 mm (max.) base |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| BS EN 60252-2 : 2011 | AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
| 10/30184605 DC : 0 | BS EN 61643-313 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 313: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (GDT) |
| 07/30169004 DC : 0 | BS EN 60400 - LAMPHOLDERS FOR TUBULAR FLUORESCENT LAMPS AND STARTERHOLDERS |
| BS EN 168000:1996 | Harmonized system of quality assessment for electronic components. Generic specification: quartz crystal units |
| IEC 60326-9:1991 | Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections |
| BS EN 61811-54:2002 | Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 15 mm x 7,5 mm base |
| BS EN 62246-1-1:2013 | Reed switches Generic specification. Quality assessment |
| 15/30329267 DC : 0 | BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION |
| BS EN 61193-3:2013 | Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| BS EN 60684-2:2011 | Flexible insulating sleeving Methods of test |
| CSA E691 : 0 | THERMAL LINKS - REQUIREMENTS AND APPLICATION GUIDE |
| 14/30317306 DC : 0 | BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
| BS EN 60368-1:2000 | Piezoelectric filters Generic specification |
| CSA E60127.6 : 2003 : R2012 | MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
| CEI EN 62884-1 : 1ED 2018 | MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
| UNE-EN 61020-1:2011 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| NF EN 60938-1 : 2008 AMD 1 2008 | FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| IEC 61338-1-2:1998 | Waveguide type dielectric resonators - Part 1-2: General information and test conditions - Test conditions |
| GOST R IEC 60252-1 : 2005 | AC MOTOR CAPACITORS - PART 1: GENERAL. PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDE FOR INSTALLATION AND OPERATION |
| EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
| BS EN 167000:1993 | Harmonized system of quality assessment for electronic components. Generic specification: piezoelectric filters |
| IEC 60400:2017 | Lampholders for tubular fluorescent lamps and starterholders |
| I.S. EN ISO 4521:2008 | METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
| I.S. EN 60810:2015 | LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| BS EN 140402 : 2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 61189-5:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| BS EN 60934 : 2001 | CIRCUIT-BREAKERS FOR EQUIPMENT (CBE) |
| I.S. EN 140101-806:2009 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
| I.S. EN 60384-1:2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 60122-1 : 2004 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62922:2017 | ORGANIC LIGHT EMITTING DIODE (OLED) PANELS FOR GENERAL LIGHTING - PERFORMANCE REQUIREMENTS |
| I.S. EN 138000:1998 | FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) (GENERIC SPECIFICATION) |
| I.S. EN 61338-1:2005 | WAVEGUIDE TYPE DIELECTRIC RESONATORS - PART 1: GENERIC SPECIFICATION |
| BS EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles. Performance requirements |
| NF EN 60127-6 : 2014 | MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE CARTRIDGE FUSE-LINKS |
| BS EN 140401:2009 | Blank Detail Specification. Fixed low power film surface mount (SMD) resistors |
| I.S. EN 133000:1998 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION) |
| EN IEC 62246-1-1:2018 | Reed switches - Part 1-1: Generic specification - Blank detail specification |
| EN IEC 61643-331:2018 | Components for low-voltage surge protective devices - Part 331: Performance requirements and test methods for metal oxide varistors (MOV) |
| NF EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| PREN ISO 9455-10 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| I.S. EN 62884-1:2017 | MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
| CEI EN 60068-2-83 : 2012 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
| ISO 7587:1986 | Electroplated coatings of tin-lead alloys — Specification and test methods |
| I.S. EN 62149-4:2010 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
| I.S. EN 60393-1:2009 | POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60068-2-54:2006 | ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
| I.S. EN 62149-6:2003 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 6: 650-NM 250-MBIT/S PLASTIC OPTICAL FIBRE TRANSCEIVERS |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| IEC 61196-2:1995 | Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation |
| IEC PAS 60747-17:2011 | Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation |
| I.S. EN 61984:2009 | CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
| IEC PAS 62246-2-1:2008 | Reed contact units - Part 2-1: Heavy-duty reed switches - Quality assessment specification |
| I.S. EN 62319-1:2005 | POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| IEC 61196-9-1:2015 | Coaxial communication cables - Part 9-1: Flexible RF coaxial cables - Blank detail specification |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| IEC 60838-1:2016+AMD1:2017 CSV | Miscellaneous lampholders - Part 1: General requirements and tests |
| I.S. EN 61189-3:2008 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| I.S. EN 60938-1:1999 | FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| I.S. EN 60838-2-1:1997 | MISCELLANEOUS LAMPHOLDERS - PART 2: PARTICULAR REQUIREMENTS - SECTION 1: LAMPHOLDERS S14 |
| I.S. EN 61249-8-8:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
| IEC 61051-1:2007 | Varistors for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| IEC 60238:2016+AMD1:2017 CSV | Edison screw lampholders |
| I.S. EN 62211:2017 | INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
| I.S. EN 61747-5:1999 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| EN 140200 : 1996 AMD 1 2001 | FIXED POWER RESISTORS (SECTIONAL SPECIFICATION) |
| NF EN 61810-1 : 2015 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| IEC 60368-1:2000+AMD1:2004 CSV | Piezoelectric filters of assessed quality - Part 1: Genericspecification |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV | Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types |
| BS EN 14436:2004 | Copper and copper alloys. Electrolytically tinned strip |
| IEC 61169-1:2013 | Radio frequency connectors - Part 1: Generic specification - General requirements and measuring methods |
| IEC 61881-3:2012+AMD1:2013 CSV | Railway applications - Rolling stock equipment - Capacitors forpower electronics - Part 3: Electric double-layer capacitors |
| IEC 61643-311:2013 | Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT) |
| IEC 61249-8-7:1996 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
| IEC 61337-1:2004 | Filters using waveguide type dielectric resonators - Part 1: Generic specification |
| IEC 60068-2-83:2011 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| BS EN ISO 9455-17:2006 | Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
| IEC 61810-1:2015 | Electromechanical elementary relays - Part 1: General and safety requirements |
| IEC 61747-10-1:2013 | Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical |
| EN 60749-15:2010/AC:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 61007:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| EN ISO 4521:2008 | Metallic and other inorganic coatings - Electrodeposited silver and silver alloy coatings for engineering purposes - Specification and test methods (ISO 4521:2008) |
| UNI EN ISO 9455-10 : 2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| IEC 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification |
| EN ISO 27874:2008 | Metallic and other inorganic coatings - Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes - Specification and test methods (ISO 27874:2008) |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
| I.S. EN IEC 60810:2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| BS EN 60384-26:2010 | Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte |
| 05/30137416 DC : 0 | |
| BS EN 140100:2008 | Sectional specification. Fixed low power film resistors |
| NF EN 60068 2-69 : 2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| NF EN 60252-1 : 2011 AMD 1 2014 | AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| 12/30260802 DC : 0 | BS EN 62391-1 - FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 07/30149142 DC : 0 | BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| NF EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| CAN/CSA-C22.2 NO. 60947-7-4:18 | Low-voltage switchgear and controlgear ? Part 7-4: Ancillary equipment ? PCB terminal blocks for copper conductors (Trinational standard with NMX-J-538/7-4-ANCE and UL 60974-7-4) |
| BS EN 62149-9:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier transceivers |
| I.S. EN 62435-1:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| I.S. EN 143000:1994 | THERMISTORS (GENERIC SPECIFICATION) |
| BS CECC 40100:1981 | Harmonized system of quality assessment for electronic components: sectional specification: fixed low power non-wirewound resistors |
| BS EN 140203:1997 | Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level H) |
| I.S. EN 60684-2:2011 | FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST (IEC 60684-2:2011) |
| BS EN 60169-21:1997 | Radio-frequency connectors Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with different versions of screw coupling. Characteristic impedance 50 ohms (types SC-A and SC-B) |
| 03/103740 DC : DRAFT FEB 2003 | IEC 61337-1 ED.1 - FILTERS USING WAVEGUIDE TYPE DIELECTRIC RESONATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| CEI EN 60169-21 : 1998 | RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B) |
| 17/30363106 DC : DRAFT SEP 2017 | BS IEC 63138-1 ED.1.0 - MULTI-RADIO FREQUENCY CHANNEL CONNECTORS - PART 1: GENERIC SPECIFICATION-GENERAL REQUIREMENTS AND MEASURING METHODS |
| CEI EN 60947-7-4 : 2014 | LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS |
| 07/30168484 DC : 0 | BS EN 60749-20 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| 14/30280850 DC : 0 | BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| 08/30186808 DC : DRAFT JULY 2008 | BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
| DD CLC/TS 50466:2006 | Long duration storage of electronic components. Specification for implementation |
| BS EN 140201:1997 | Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level S) |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS CECC 40301:1988 | Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Fixed precision resistors |
| 13/30277857 DC : 0 | BS EN 62149-9 ED 1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
| BS EN 60068-3-13:2016 | Environmental testing Supporting documentation and guidance on Test T. Soldering |
| BS EN 140401-802 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| 12/30259014 DC : 0 | BS EN 60127-6 - MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS |
| CEI EN 60512-12-6 : 1997 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT/ BASIC TESTING PROCEDURES AND MEASURING METHODS - PART 12: SOLDERING TESTS - SECTION 6: TEST 12F: SEALING AGAINST FLUX AND CLEANING SOLVENTS IN MACHINE SOLDERING |
| BS EN 61270-1:1998 | Capacitors for microwave ovens General |
| BS EN 60512-12-2:2006 | Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12b. Solderability, wetting, soldering iron method |
| 10/30234015 DC : 0 | BS EN 62246-1-1 ED.1 - REED SWITCHES - PART 1-1: QUALITY ASSESSMENT SPECIFICATION |
| UNE-EN 60947-7-4:2014 | Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors |
| IEC 61045-1:1991 | Fixed film resistor networks for use in electronic equipment - Part 1: Generic specification |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| I.S. EN 62025-2:2005 | HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| I.S. EN 62739-3:2017 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
| I.S. EN 60252-1:2011 | AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010 (EQV)) |
| CEI EN 62314 : 2007 | SOLID-STATE RELAYS |
| CEI EN 61051-1 : 2010 | VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 61071:2007 | Capacitors for power electronics |
| BS EN 61007:1997 | Transformers and inductors for use in electronic and telecommunication equipment. Measuring methods and test procedures |
| BS EN 61248-5:1997 | Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for pulse transformers on the basis of the capability approval procedure |
| BS EN 62025-2:2005 | High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics |
| NF EN 62326 4-1 : 1998 | PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C |
| BS EN 61248-1:1997 | Transformers and inductors for use in electronic and telecommunication equipment Generic specification |
| BS EN IEC 62246-1-1:2018 | Reed switches Generic specification. Blank detail specification |
| BS EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| DIN EN 60252 : 1994 | CAPACITORS - MOTOR CAPACITORS |
| CEI 48-15 : 1998 | FLAT, QUICK-CONNECT TERMINATIONS |
| CEI EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| 09/30209389 DC : 0 | BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
| 06/30149145 DC : DRAFT OCT 2006 | IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| EN IEC 61076-3-119:2018 | Connectors for electrical and electronic equipment - Product requirements - Part 3-119: Rectangular connectors - Detail specification for shielded and unshielded, free and fixed 10-way connectors with push-pull coupling for industrial environments for data transmission with frequencies up to 100 MHz |
| 11/30206085 DC : 0 | BS EN 60947-7-4 - LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PRINTED BOARD TERMINAL BLOCKS FOR COPPER CONDUCTORS |
| BS EN 60068-2-82:2007 | Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components |
| BS EN 61249-8-8:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
| BS EN 61337-2:2004 | Filters using waveguide type dielectric resonators Guide for use |
| 08/30193715 DC : 0 | BS EN 62246-1 ED.2 - REED SWITCHES - PART 1: GENERIC SPECIFICATION |
| 02/208665 DC : DRAFT SEP 2002 | IEC 62319-1 ED.1.0 - POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| NF EN 61204-6 : 2001 | LOW-VOLTAGE POWER SUPPLIES, DC OUTPUT - PART 6: REQUIREMENTS FOR LOW-VOLTAGE POWER SUPPLIES ASSESSED PERFORMANCE |
| BS EN 123400:1992 | Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections |
| BS EN 130000:1994 | Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors |
| BS EN 62319-1:2005 | Polymeric thermistors. Directly heated positive step function temperature coefficient Generic specification |
| NF EN 60252-2 : 2011 AMD 1 2014 | AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS |
| BS EN 60122-1 : 2002 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 61643-331:2003 | Low voltage surge protective devices Specification for metal oxide varistors (MOV) |
| 08/30193881 DC : 0 | BS EN 60939-1 ED.3 - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| PD 6521:1988 | Summaries of test methods for environmental testing of electrotechnical products |
| BS EN 61196-2:2003 | Radio-frequency cables. Specifications. Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation |
| BS EN 60749-20:2009 | Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| NF EN 61071 : 2007 | CAPACITORS FOR POWER ELECTRONICS |
| BS EN 61248-2:1997 | Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for signal transformers on the basis of the capability approval procedure |
| BS EN 61810-7:2006 | Electromechanical elementary relays Test and measurement procedures |
| UL 60947-7-4:1ED 2018-04-27 | Low-Voltage Switchgear and Controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors |
| I.S. EN 61797-1:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN TELECOMMUNICATION AND ELECTRONIC EQUIPMENT - MAIN DIMENSIONS OF COIL FORMERS - PART 1: COIL FORMERS FOR LAMINATED CORES |
| I.S. EN 60169-21:1999 | RADIO-FREQUENCY CONNECTORS - PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING - CHARACTERISTIC IMPEDANCE 50 OHMS (TYPES SC-A AND SC-B) |
| IEC 61178-1:1993 | Quartz crystal units - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) - Part 1: Generic specification |
| IEC 61020-3:1991 | Electromechanical switches for use in electronic equipment - Part 3: Sectional specification for in-line package switches |
| CEI EN 62319-1 : 2005 | POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| BS EN 170000:1999 | Harmonized system of quality assessment for electronic components. Generic specification: waveguide type dielectric resonators |
| NF EN 62739-1 : 2014 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING |
| I.S. EN 61007:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - MEASURING METHODS AND TEST PROCEDURES |
| NF EN ISO 4521 : 2008 | METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
| EN 61810-1:2015/AC:2018-04 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS (IEC 61810-1:2015/COR1:2018) |
| I.S. EN IEC 62246-1-1:2018 | REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION |
| I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 165000-1:1998 | FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
| I.S. EN 134000:1994 | GENERIC SPECIFICATION: VARIABLE CAPACITORS (QUALIFICATION APPROVAL AND CAPABILITY APPROVAL) |
| I.S. EN 60068-3-13:2016 | ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
| I.S. EN 61643-312:2013 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 (EQV) + CORRIGENDUM JUL. 2013 (EQV)) |
| I.S. EN 61189-5-4:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 60749-15:2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
| BS CECC 40103:1988 | Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Fixed low power non-wirewound resistors. Assessment level P |
| CEI EN 60068-2-54 : 2007 | ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
| EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles - Performance requirements |
| CEI EN 60512-12-7 : 2002 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-7: SOLDERING TESTS - TEST 12G: SOLDERABILITY, WETTING BALANCE METHOD |
| I.S. CECC 33000:1994 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (GENERIC SPECIFICATION) |
| BS EN 60947-7-4:2013 | Low-voltage switchgear and controlgear Ancillary equipment. PCB terminal blocks for copper conductors |
| CEI EN 62246-1-1 : 2014 | REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT |
| EN 140401-802:2007/A3:2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| I.S. EN 62246-1:2015 | REED SWITCHES - PART 1: GENERIC SPECIFICATION |
| CEI EN 60749-15 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| CEI EN 61810-7 : 2006 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 7: TEST AND MEASUREMENT PROCEDURES |
| EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
| I.S. EN 60127-2:2014 | MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS |
| IEC 61071:2017 | Capacitors for power electronics |
| I.S. EN 61020-1:2009 | ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| IEC 61337-1-2:1999 | Filters using waveguide type dielectric resonators - Part 1-2: Test conditions |
| I.S. EN 140101:2008 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
| I.S. EN 60838-1:2017 | MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS |
| I.S. EN 140401-802:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
| I.S. EN 140401-803:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| I.S. EN 62391-1:2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61169-1:2013 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60326-10:1991 | Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections |
| IEC 60326-11:1991 | Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| IEC 61007:1994 | Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures |
| IEC 60115-2:2014 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| IEC 61196-8:2012 | Coaxial communication cables - Part 8: Sectional specification for semi-flexible cables with polytetrafluoroethylene (PTFE) dielectric |
| EN 61169-1:2013/AC:2016-02 | RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013) |
| EN 60938-1:1999/A1:2007 | FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| EN 60539-1:2016/AC:2017-09 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017) |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| DIN EN ISO 9455-2:1995-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
| 16/30350012 DC : 0 | BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
| IEC 60738-1:2006+AMD1:2009 CSV | Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification |
| IEC 60938-1:1999+AMD1:2006 CSV | Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification |
| IEC 60689:2008 | Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values |
| IEC 61248-6:1996 | Transformers and inductors for use in electronic andtelecommunication equipment - Part 6: Sectional specification forinductors on the basis of the capability approval procedure |
| BS EN 61984:2009 | Connectors. Safety requirements and tests |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 4521:2008 | Metallic and other inorganic coatings — Electrodeposited silver and silver alloy coatings for engineering purposes — Specification and test methods |
| IEC 60512-12-5:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method |
| IEC 61984:2008 | Connectors - Safety requirements and tests |
| IEC 60384-26-1:2010 | Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ |
| IEC 61797-1:1996 | Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| 05/30128512 DC : DRAFT JAN 2005 | IEC 61984 ED.2 - CONNECTORS - SAFETY REQUIREMENTS AND TESTS |
| IEC 61811-53:2002 | Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| IEC 61270-1:1996 | Capacitors for microwave ovens - Part 1: General |
| IEC 61058-2-4:1995+AMD1:2003 CSV | Switches for appliances - Part 2-4: Particular requirements for independently mounted switches |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 62314:2006 | Solid-state relays |
| IEC 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| IEC 61881-2:2012 | Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 2: Aluminium electrolytic capacitors with non-solid electrolyte |
| IEC 61881-1:2010 | Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors |
| IEC 60838-2-1:1994 | Miscellaneous lampholders - Part 2: Particular requirements - Section 1: Lampholders S14 |
| IEC 60939-1:2010 | Passive filter units for electromagnetic interference suppression - Part 1: Generic specification |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60512-12-6:1996 | Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering |
| IEC 62739-1:2013 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing |
| ISO 9455-17:2002 | Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
| IEC 60684-2:2011 | Flexible insulating sleeving - Part 2: Methods of test |
| IEC 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| IEC 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
| IEC 60512-12-2:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method |
| BS EN 62149-6:2003 | Fibre optic active components and devices. Performance standards 650-nm 250-Mbit/s plastic optical fibre transceivers |
| ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
| IEC 60947-7-4:2013 | Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors |
| IEC 61169-8:2007 | Radio-frequency connectors - Part 8: Sectional specification - RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock - Characteristic impedance 50 Ω (type BNC) |
| IEC 61248-1:1996 | Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification |
| IEC 62149-9:2014 | Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 61811-55:2002 | Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base |
| IEC 61811-51:2002 | Electromechanical all-or-nothing relays - Part 51: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Non-standardized types and construction |
| IEC 61019-1:2004 | Surface acoustic wave (SAW) resonators - Part 1: Generic specification |
| IEC 61248-5:1996 | Transformers and inductors for use in electronic andtelecommunication equipment - Part 5: Sectional specification forpulse transformers on the basis of the capability approvalprocedure |
| IEC 61811-52:2002 | Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base |
| IEC 60252-1:2010+AMD1:2013 CSV | AC motor capacitors - Part 1: General - Performance, testing andrating - Safety requirements - Guidance for installation and operation |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| NF EN ISO 9455-16 : 2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD |
| IEC 60252-2:2010+AMD1:2013 CSV | AC motor capacitors - Part 2: Motor start capacitors |
| IEC 61248-3:1996 | Transformers and inductors for use in electronic andtelecommunication equipment - Part 3: Sectional specification forpower transformers on the basis of the capability approvalprocedure |
| BS EN 60810:2015 | Lamps for road vehicles. Performance requirements |
| BS EN ISO 9455-10:2012 | Soft soldering fluxes. Test methods Flux efficacy test, solder spread method |
| IEC 61811-54:2002 | Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base |
| IEC 61248-4:1996 | Transformers and inductors for use in electronic andtelecommunication equipment - Part 4: Sectional specification forpower transformers for switched mode power supplies (SMPS) on thebasis of the capability approval procedure |
| IEC 61338-1:2004 | Waveguide type dielectric resonators - Part 1: Generic specification |
| BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
| UNE-EN 60400:2011 | Lampholders for tubular fluorescent lamps and starterholders |
| IEC 60127-6:2014 | Miniature fuses - Part 6: Fuse-holders for miniature fuse-links |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| IEC 62149-4:2010 | Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 61248-2:1996 | Transformers and inductors for use in electronic andtelecommunication equipment - Part 2: Sectional specification forsignal transformers on the basis of the capability approvalprocedure |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 62025-2:2005 | High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics |
| IEC 61337-2:2004 | Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60512-12-4:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method |
| EN 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification |
| EN 62326-4:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| EN 61196-2:2003 | Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation |
| EN 61811-52:2002 | Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base |
| EN 62739-1 : 2013 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013) |
| EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
| EN ISO 9455-2:1995 | Soft soldering fluxes - Test methods - Part 2: Determination of non-volatile matter, ebulliometric method (ISO 9455-2:1993) |
| EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| EN 14436:2004 | Copper and copper alloys - Electrolytically tinned strip |
| EN 16602-70-10:2015 | Space product assurance - Qualification of printed circuit boards |
| EN ISO 9455-17:2006 | Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
| EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
| 13/30294866 DC : 0 | BS EN 61058-1 - SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| BS EN 62435-1:2017 | Electronic components. Long-term storage of electronic semiconductor devices General |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| DD IEC/PAS 62435:2005 | Electronic components. Long duration storage of electronic components. Guidance for implementation |
| 17/30340059 DC : 0 | BS EN 61076-3-119 - CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR UNSHIELDED, FREE AND FIXED 10 WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS WITH FREQUENCIES UP TO 100 MHZ |
| BS EN 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality Generic specification and blank detail specification |
| BS EN 60512-12-4:2006 | Connectors for electronic equipment. Tests and measurements Soldering tests. Test 12d. Resistance to soldering heat, solder bath method |
| BS 9752:1989 | Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level |
| DD IEC/PAS 60747-17:2011 | Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation |
| 11/30243576 DC : DRAFT FEB 2011 | BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| 02/209658 DC : DRAFT OCT 2002 | IEC 60512-12-1, ED. 1.0 - CONNECTORS FOR ELECTRONIC EQUIPMENT - BASIC TESTING AND MEASUREMENTS - PART 12-1 - TEST 12A: SOLDERABILITY, WETTING, SOLDER BATH METHOD |
| I.S. EN 60384-26-1:2010 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ |
| CEI EN 61071 : 2007 | CAPACITORS FOR POWER ELECTRONICS |
| CEI EN 62391-1 : 2016 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 61270-1 : 1997 | CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
| BS CECC 32100:1992 | Harmonized system of quality assessment for electronic components. Sectional specification: fixed multilayer ceramic chip capacitors |
| CEI EN 60068-2-82 : 2008 | ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| CEI EN 60115-2 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| UNI EN ISO 27874 : 2008 | METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED GOLD AND GOLD ALLOY COATINGS FOR ELECTRICAL, ELECTRONIC AND ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
| 17/30349734 DC : 0 | BS EN 60384-26 ED.2.0 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| BS EN 62326-4-1:1997 | Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C |
| CEI EN 60684-2 : 2012 | FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST |
| CEI EN 140401 : 2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| 13/30294204 DC : 0 | BS EN 60238 - EDISON SCREW LAMPHOLDERS |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
| BS EN 60393-1:2009 | Potentiometers for use in electronic equipment Generic specification |
| BS EN 60115-8:2012 | Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors |
| CEI EN 138000 : 1996 | GENERIC SPECIFICATION: FIXED INDUCTORS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION (INDUCTORS FOR WHICH SAFETY TESTS ARE REQUIRED) |
| BS 6201-2:1982 | Fixed capacitors for use in electronic equipment. Specification for fixed capacitors of ceramic dielectric, Class 2. Selection of methods of test and general requirements |
| BS CECC43002(1984) : 1984 AMD 7379 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
| 03/308375 DC : DRAFT JUNE 2003 | IEC 61196-1 - COAXIAL COMMUNICATION CABLES - PART 1: GENERIC SPECIFICATION - GENERAL, DEFINITIONS AND REQUIREMENTS |
| CEI EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
| BS EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment Generic specification |
| 08/30192301 DC : 0 | BS EN 60384-26 ED.1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| I.S. EN 61810-1:2015 | ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS |
| CEI EN 60512-12-2 : 2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
| IEEE C62.33-1982 | IEEE Standard Test Specifications for Varistor Surge-Protective Devices |
| 10/30184598 DC : 0 | BS EN 61643-312 ED 1.0 - COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: PERFORMANCE SPECIFICATION FOR GAS DISCHARGE TUBES (GDT) |
| BS ISO 9455-17 : 2002 AMD 16425 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| BS EN 62246-1:2015 | Reed switches Generic specification |
| BS CECC43004(1984) : 1984 AMD 1992 | SPEC FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS (ROD TYPE) |
| 13/30286163 DC : 0 | BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS |
| 12/30265027 DC : 0 | BS EN 61196-9 ED.1 - COAXIAL COMMUNICATION CABLES - PART 9: SECTIONAL SPECIFICATION FOR FLEXIBLE RF COAXIAL CABLES |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 60393-1:2008 | Potentiometers for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 60115-2:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
| I.S. EN 60249-1:1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
| 16/30338642 DC : 0 | BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD |
| CEI EN 61643-331 : 2005 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV) |
| CEI EN 61249-8-7 : 1997 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
| BS EN 61248-7:1998 | Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for high-frequency inductors and intermediate transformers on the basis of the capability approval procedure |
| BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| 11/30213136 DC : 0 | BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| 11/30234673 DC : 0 | BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| BS EN 62149-4:2010 | Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application |
| I.S. EN 60068-2-44:1997 | ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING |
| I.S. EN 61248-2:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 2: SECTIONAL SPECIFICATION FOR SIGNAL TRANSFORMERS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| BS EN 61248-4:1997 | Transformers and inductors for use in electronic and telecommunication equipment Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability approval procedure |
| BS CECC43001(1984) : 1984 AMD 7378 | SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
| CEI EN 60068-2-69 : 2008 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| DIN EN 61881 : 2000 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS |
| CEI EN 60539-1 : 2009 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| NF EN 60238 : 2005 AMD 2 2011 | |
| I.S. EN 60939-3:2015 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE |
| I.S. EN 60934:2001 | CIRCUIT BREAKERS FOR EQUIPMENT (CBE) (IEC 60934:2000 (EQV)) |
| I.S. EN 61189-5-3:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 61811-54:2002 | ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE |
| I.S. EN 61811-53:2002 | ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE |
| NF EN 61249 8-7 : 1997 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND LINKS |
| I.S. EN IEC 61076-3-119:2018 | CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ |
| I.S. EN 61881-2:2012 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012 (EQV)) |
| IEEE C62.35-2010 | IEEE Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components |
| I.S. EN 60384-26:2010 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| I.S. EN 60127-4:2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
| I.S. EN 60749-20:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| BS EN 140101-806 : 2008 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
| I.S. EN 60122-1:2002 AMD 1 2018 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 61270-1:1999 | CAPACITORS FOR MICROWAVE OVENS - PART 1: GENERAL |
| I.S. EN 61248-6:1998 | TRANSFORMERS AND INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT - PART 6: SECTIONAL SPECIFICATION FOR INDUCTORS ON THE BASIS OF THE CAPABILITY APPROVAL PROCEDURE |
| I.S. EN 60862-1:2015 | SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
| I.S. EN 62149-9:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
| I.S. EN 61189-5-2:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 61811-1:2015 | ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION |
| IEC 62149-6:2003 | Fibre optic active components and devices - Performance standards - Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers |
| IEC 61196-1:2005 | Coaxial communication cables - Part 1: Generic specification - General, definitions and requirements |
| I.S. EN 61169-8:2007 | RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTICS IMPEDANCE 50 OHMS (TYPE BNC) |
| I.S. EN 60068-2-21:2006 | ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
| NF EN 62319-1 : 2005 | POLYMERIC THERMISTORS - DIRECTLY HEATED POSITIVE STEP FUNCTION TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION |
| NF EN 60127-4 : 2005 AMD 2 2013 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
| UNE-EN ISO 27874:2010 | Metallic and other inorganic coatings - Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes - Specification and test methods (ISO 27874:2008) |
| IEC 60238:2016 RLV | Edison screw lampholders |
| BIS IS 15934-5 : 2011 | LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 5: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS |
| CEI EN 60939-1 : 2011 | PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION |
| CEI EN 60512-12-4 : 2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS -PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
| EN 60838-1:2017/A1:2017 | MISCELLANEOUS LAMPHOLDERS - PART 1: GENERAL REQUIREMENTS AND TESTS (IEC 60838-1:2016/A1:2017) |
| I.S. EN 60947-7-4:2013 | LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013 (EQV)) |
| CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 61811-52:2002 | ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 52: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 20 MM X 10 MM BASE |
| I.S. EN 61811-55:2002 | ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE |
| IEC 60748-23-1:2002 | Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
| IEC 61058-1:2016 | Switches for appliances - Part 1: General requirements |
| I.S. EN 62314:2006 | SOLID-STATE RELAYS |
| I.S. EN 140401:2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
| I.S. EN 61643-331:2003 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 331: SPECIFICATION FOR METAL OXIDE VARISTORS (MOV) |
| IEC 61019-1-2:1993 | Surface acoustic wave (SAW) resonators - Part 1: General information, standard values and test conditions - Section 2: Test conditions |
| I.S. EN 116000-3:1998 | GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 60539-1:2016 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION |
| IEC 60748-23-3:2002 | Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report |
| EN 140401-803 : 2007 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
| EN 140101-806 : 2008 COR 2014 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61810-7:2006 | Electromechanical elementary relays - Part 7: Test and measurement procedures |
| IEC 60512-12-1:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method |
| IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| IEC 61881:1999 | Railway applications - Rolling stock equipment - Capacitors for power electronics |
| IEC 62922:2016 | Organic light emitting diode (OLED) panels for general lighting - Performance requirements |
| ISO 27874:2008 | Metallic and other inorganic coatings — Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes — Specification and test methods |
| IEC 60934:2000+AMD1:2007+AMD2:2013 CSV | Circuit-breakers for equipment (CBE) |
| ISO 9455-16:2013 | Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
| EN 62211:2017 | Inductive components - Reliability management |
| EN 61248-7:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 7: Sectional specification for high-frequency inductors and intermediate frequency transformers on the basis of the capability approval procedure |
| EN 61338-2:2004 | Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
| EN 61811-55:2002 | Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base |
| EN 61249-8-8:1997 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
| EN 61248-6:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 6: Sectional specification for inductors on the basis of the capability approval procedure |
| EN 61169-8:2007 | Radio-frequency connectors - Part 8: Sectional specification - RF coaxial connectors with inner diameter of outer conductor 6,5 mm (0,256 in) with bayonet lock - Characteristic impedance 50 ohms (type BNC) |
| EN 61881:1999 | Railway applications - Rolling stock equipment - Capacitors for power electronics |
| EN 60512-12-5:2006/corrigendum:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-5: SOLDERING TESTS - TEST 12E: RESISTANCE TO SOLDERING HEAT, SOLDERING IRON METHOD |
| EN 61747-10-1:2013 | Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods – Mechanical |
| EN 61984:2009 | Connectors - Safety requirements and tests |
| EN 61811-53:2002 | Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base |
| EN 61270-1:1996 | Capacitors for microwave ovens - Part 1: General |
| EN 60934:2001/A2:2013 | CIRCUIT BREAKERS FOR EQUIPMENT (CBE) (IEC 60934:2000/A2:2013) |
| EN 119000 : 1996 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION: DRY AND MERCURY WETTED REED CONTACT UNITS |
| EN 60252 : 94 AC 94 | A.C. MOTOR CAPACITORS |
| EN 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
| EN 62149-4:2010 | Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application |
| EN 61248-1 : 1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 60122-1:2002/A1:2018 | QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION (IEC 60122-1:2002/A1:2017) |
| EN 61643-311:2013 | Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT) |
| IEC 61071:2017 RLV | Capacitors for power electronics |
| EN 60115-8:2012 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| EN 60238 : 2004 AMD 2 2011 | EDISON SCREW LAMPHOLDERS (IEC 60238:2004/A2:2011) |
| EN 60368-1:2000/A1:2004 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| EN 60512-12-2:2006/corrigendum Dec. 2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-2: SOLDERING TESTS - TEST 12B: SOLDERABILITY, WETTING, SOLDERING IRON METHOD |
| EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| EN 60127-2:2014 | Miniature fuses - Part 2: Cartridge fuse-links |
| EN 62246-1-1:2013 | Reed switches - Part 1-1: Generic specification - Quality assessment |
| EN 60252-2 : 2011 AMD 1 2013 | AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010/A1:2013) |
| EN 60068-2-83 : 2011 | ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011) |
| DIN EN 14436:2004-11 | Copper and copper alloys - Electrolytically tinned strip |
| EN 61810-7:2006 | Electromechanical elementary relays - Part 7: Test and measurement procedures |
| EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| EN 165000-1:1996 | Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
| EN 61071:2007 | Capacitors for power electronics |
| EN 143000 : 1991 | THERMISTORS (GENERIC SPECIFICATION) |
| DIN EN ISO 4521:2009-01 | METALLIC AND OTHER INORGANIC COATINGS - ELECTRODEPOSITED SILVER AND SILVER ALLOY COATINGS FOR ENGINEERING PURPOSES - SPECIFICATION AND TEST METHODS |
| EN 116000-3 : 1996 | GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| EN 137000:1995 | Generic Specification: Fixed aluminium electrolytic a.c. capacitors with non-solid electrolyte for use with motors |
| EN 61881-3:2012/A1:2013 | RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012/A1:2013) |
| OVE/ONORM EN 62025-2 : 2005 | HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| EN 60512-12-7:2001 | Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method |
| EN 60512-12-4:2006/corrigendum:2006 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 12-4: SOLDERING TESTS - TEST 12D: RESISTANCE TO SOLDERING HEAT, SOLDER BATH METHOD |
| EN 61189-5 : 2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| EN 61338-1:2005 | Waveguide type dielectric resonators - Part 1: Generic specification |
| EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| EN 62391-1:2016/AC:2016-12 | FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016) |
| EN 140100:2008 | Sectional Specification: Fixed low power film resistors |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| EN 60947-7-4 : 2013 | LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013) |
| EN 60127-6:2014 | Miniature fuses - Part 6: Fuse-holders for miniature fuse-links |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 62149-9:2014 | Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers |
| EN 62314 : 2006 | SOLID-STATE RELAYS |
| EN 60512-12-1:2006 | Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method |
| EN 60393-1:2009 | Potentiometers for use in electronic equipment - Part 1: Generic specification |
| EN 62025-2:2005 | High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics |
| EN 61337-2:2004 | Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
| EN 60384-26:2010 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| EN 60749 : 99 AMD 2 2001 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS |
| EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| EN 61248-3:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 3: Sectional specification for power transformers on the basis of the capability approval procedure |
| EN 61248-5:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 5: Sectional specification for pulse transformers on the basis of the capability approval procedure |
| EN 61643-312 : 2013 | COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 + CORRIGENDUM JUL. 2013) |
| EN 140000 : 1993 | GENERIC SPECIFICATION: FIXED RESISTORS |
| CSA E60384.1 : 2014 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CSA C22.2 No. 61058.1 : 2009 | SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| I.S. EN ISO 9455-17:2006 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| CSA C22.2 No. 61058.1 : 2009 : R2014 | SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| BS CECC 30000:1992 | Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors |
| BS CECC 30000:1984 | Harmonized system of quality assessment for electronic components: generic specification: fixed capacitors |
| BS 2011-2.2T:1981 | Environmental testing. Guidance Test T. Guidance on Test T: soldering |
| ONORM EN ISO 9455-17 : 2006 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| CSA C22.2 No. 61058.1 : 2009 : INC : UPD 1 : 2013 | SWITCHES FOR APPLIANCES - PART 1: GENERAL REQUIREMENTS |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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